Plasma system and method of producing a functional coating

• US 20100203253A1
• Filed: 12/05/2001
• Published: 08/12/2010
• Est. Priority Date: 02/02/2001
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Henke, Sasha, Grosse, Stefan, Spindler, Susanne
• Application Number:
  US10/240,474
• Publication Number:
  US 20100203253A1
• Time in Patent Office: Days
• US Class Current: 427/452
• CPC Class Codes: C23C 16/513 using plasma jets
• CPC Class Codes: C23C 16/515 using pulsed discharges
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32706 Polarising the substrate
• CPC Class Codes: H05H 1/30 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/28 takes precedence

Abstract

A plasma system has at least one inductively coupled high-frequency plasma jet source having a burner body delimiting a plasma generating space, having an outlet orifice for the plasma jet, and a chamber communicating with the plasma jet source through the outlet orifice, having a substrate situated in the chamber, where it is exposed to the plasma jet. The substrate is situated on a substrate electrode to which an electric voltage may be applied. In addition, a method of producing a functional coating on the substrate using such a plasma system is also described. In a preferred embodiment, during operation of the plasma system, both the plasma jet and the electric voltage on the substrate electrode are pulsed and/or a pressure gradient is maintained between the interior of the plasma jet source and the interior of the chamber.

Claims

1-18. -18. (canceled)

19. A plasma system, comprising:

at least one inductively coupled high-frequency plasma jet source including a burner body delimiting a plasma generating space;

a chamber including an outlet orifice for a plasma jet, the chamber communicating with the at least one inductively coupled plasma jet source through the outlet orifice;

a substrate electrode capable of receiving an electric voltage; and

a substrate situated in the chamber and on the substrate electrode, the substrate being exposed to the plasma jet in the chamber.

20. The plasma system as recited in claim 19, further comprising:

a generator to which the substrate electrode is connected, the generator applying one of an electric direct voltage and an alternating voltage having an amplitude between 10 V and 5 kV and a frequency between 0 Hz and 50 MHz to the substrate electrode.

21. The plasma system as recited in claim 19, further comprising:

a generator to which the substrate electrode is connected, the generator applying to the substrate electrode one of an electric direct voltage and an alternating voltage having an amplitude between 50 V and 300 kV and a frequency between 1 kHz and 100 kHz.

22. The plasma system as recited in claim 19, wherein:

the burner body includes;

a coil surrounding the plasma generating space in some areas, and

at least one inlet for supplying at least one of a gas and a precursor material into the plasma generating space, and

a high-frequency generator is connected to the coil for igniting a plasma and for injecting an electric power into the plasma.

23. The plasma system as recited in claim 19, further comprising:

an arrangement for periodically varying an intensity of the plasma jet of the plasma jet source.

24. The plasma system as recited in claim 22, wherein:

the burner body is pot-shaped,

the coil one of surrounds the burner body in a vicinity of the outlet orifice and is integrated into the burner body in the vicinity of the outlet orifice,

an injector gas is supplied into the plasma generating space through the at least one inlet, and

the burner body includes at least one second inlet for supplying at least one of a central gas and an enveloping gas into the plasma generating space, the central gas reacting with the injector gas, and the enveloping gas separating the burner body from the plasma produced therein in at least some areas and concentrically surrounding the plasma in the plasma generating space.

25. The plasma system as recited in claim 22, wherein:

the burner body is pot-shaped,

the coil one of surrounds the burner body in a vicinity of the outlet orifice and is integrated into the burner body in the vicinity of the outlet orifice,

a precursor material for producing a functional coating on the substrate is supplied into the plasma generating space through the at least one inlet, and

the burner body includes at least one second inlet for supplying at least one of a central gas and an enveloping gas into the plasma generating space, the central gas reacting with the injector gas, and the enveloping gas separating the burner body from the plasma produced therein in at least some areas and concentrically surrounding the plasma into the plasma generating space.

26. The plasma system as recited in claim 19, further comprising:

a pumping device to which the chamber is connected in order to maintain at least one of;

a pressure difference of more than 100 mbar between the plasma generating space and an interior of the chamber in operation of the plasma system, and

a ratio of a pressure in the plasma generating space to a pressure in the interior of the chamber that is greater than 1.5.

27. The plasma system as recited in claim 19, further comprising:

a pumping device to which the chamber is connected in order to maintain at least one of;

a pressure difference of more than 100 mbar between the plasma generating space and an interior of the chamber in operation of the plasma system, and

a ratio of a pressure in the plasma generating space to a pressure in the interior of the chamber that is greater than 3.

28. A method of producing a functional coating on a substrate, comprising:

placing the substrate in a chamber;

generating a plasma having reactive particles by a high-frequency, inductively coupled plasma jet source, the plasma emerging in the form of a plasma jet from the plasma jet source and entering the chamber connected thereto, where the plasma acts on the substrate so that the functional coating is one of produced and deposited on the substrate; and

situating the substrate on a substrate electrode in order to expose the substrate to an electric voltage at least intermittently.

29. The method as recited in claim 28, further comprising:

injecting one of a direct voltage and an alternating voltage into the substrate electrode via a generator, the one of the direct voltage and the alternating voltage having an amplitude between 10 V and 5 kV and a frequency between 0 Hz and 50 MHz.

30. The method as recited in claim 28, further comprising:

injecting one of a direct voltage and an alternating voltage into the substrate electrode via a generator, the one of the direct voltage and the alternating voltage having an amplitude between 50 V and 300 V and a frequency between 1 kHz and 100 kHz.

31. The method as recited in claim 28, further comprising:

varying the electric voltage over time at least one of intermittently provided with an adjustable offset voltage and pulsed with a selectable pulse-pause ratio.

32. The method as recited in claim 28, wherein:

the electric voltage has one of a unipolar saw-tooth characteristic, a bipolar saw-tooth characteristic, a triangular characteristic, and a sinusoidal characteristic.

33. The method as recited in claim 28, further comprising:

periodically varying an intensity of the plasma jet in an action of the plasma jet on the substrate at a frequency of 1 Hz to 10 kHz, between an adjustable upper limit and an adjustable lower limit.

34. The method according to claim 33, wherein:

the plasma jet is periodically extinguished for an adjustable period of time.

35. The method as recited in claim 28, further comprising:

periodically varying an intensity of the plasma jet in an action of the plasma jet on the substrate at a frequency of 50 Hz to 1 kHz, between an adjustable upper limit and an adjustable lower limit.

36. The method according to claim 35, wherein:

the plasma jet is periodically extinguished for an adjustable period of time.

37. The method as recited in claim 28, further comprising:

injecting an electric power of 500 W to 50 kW at a high frequency of 0.5 MHz to 20 MHz into the plasma in the plasma jet source via a coil.

38. The method as recited in claim 28, further comprising:

injecting an electric power of 1 kW to 10 kW at a high frequency of 0.5 MHz to 20 MHz into the plasma in the plasma jet source via a coil.

39. The method as recited in claim 28, further comprising:

discharging the plasma as the plasma jet out of the plasma jet source and into the chamber through an outlet orifice by supplying a gas at a gas flow rate of 5,000 sccm to 100,000 sccm to the plasma jet source.

40. The method according to claim 39, wherein:

the gas includes argon.

41. The method as recited in claim 28, further comprising:

discharging the plasma as the jet out of the plasma jet source and into the chamber through an outlet orifice by supplying a gas at a gas flow rate of 20,000 sccm to 70,000 sccm to the plasma jet source.

42. The method according to claim 41, wherein:

the gas includes argon.

43. The method as recited in claim 28, further comprising:

supplying at least one precursor material to at least one of the plasma through an inlet in the plasma jet source and the plasma jet through a feeding device in the chamber, the at least one precursor material in a modified form after undergoing one of a chemical reaction and a chemical activation then at least one of forming the functional coating on the substrate and being integrated into the functional coating.

44. The method according to claim 43, wherein:

the at least one precursor material includes one of a gaseous precursor material, a microscale precursor material, a nanoscale precursor material, a suspension of the precursor material, and a reactive gas.

45. The method as recited in claim 43, further comprising:

supplying to the plasma a carrier gas for the at least one precursor material to cause a chemical reaction with the at least one precursor material.

46. The method according to claim 45, wherein:

the carrier gas includes one of oxygen, nitrogen, ammonia, silane, acetylene, methane, and hydrogen.