Time Division Duplex Front End Module

• US 20100203922A1
• Filed: 02/08/2010
• Published: 08/12/2010
• Est. Priority Date: 02/10/2009
• Status: Abandoned Application

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Reeser, Glen O., Knecht, Thomas A.
• Application Number:
  US12/701,681
• Publication Number:
  US 20100203922A1
• Time in Patent Office: Days
• US Class Current: 455/561
• CPC Class Codes: H04B 1/44 Transmit/receive switching

Abstract

A front end module for use in a wireless base station such as a picocell includes a housing defining a cavity for a substrate. A first section on the substrate defines a signal transmit path and includes at least the following discrete electronic components: a bandpass filter, a power amplifier, and a coupler. A second section on the substrate defines a signal receive path and includes at least the following discrete electronic components: a bandpass filter and a low-noise amplifier. A switch on the substrate interconnects the first and second sections to an antenna terminal and a wall in the housing extends through a slot in the substrate to isolate the components in the first and second sections. Terminals extend through an exterior wall of the housing and into contact with the substrate.

Claims

1. An electronic assembly comprising:

a housing defining a cavity;

a substrate located in the cavity;

a first section on the substrate defining a transmit path for a transmit signal and including at least the following components mounted thereon;

a bandpass filter, a power amplifier, and a coupler;

a second section on the substrate defining a receive path for a receive signal and including at least the following electrical components mounted thereon;

a receive bandpass filter and a low-noise amplifier; and

a switch between and interconnecting the respective first and second sections to an antenna terminal.

2. The electronic assembly of claim 1 wherein the substrate defines a slot and the housing includes an interior wall, the interior wall in the housing extending through the slot in the substrate.

3. The electronic assembly of claim 1 wherein the first section further comprises a pre-amplifier between the bandpass filter and the power amplifier and the second section further comprises a second receive bandpass filter.

4. The electronic assembly of claim 3 wherein the first section further comprises an isolator between the power amplifier and the coupler and the receive section further comprises a low pass filter between the low-noise amplifier and the second receive bandpass filter.

5. The electronic assembly of claim 1 wherein the first section comprises first and second power amplifiers and first and second couplers between the bandpass filter and the coupler.

6. An electronic assembly comprising:

a transmitter circuit adapted to receive a transmit input signal and generate a transmit output signal including at least the following discrete components;

a first bandpass filter in communication with a first amplifier;

a first coupler in communication with the first amplifier;

a switch in communication with the coupler, the switch being connected to an antenna terminal;

a receiver circuit adapted to receive a receive input signal and generate a receive output signal including at least the following discrete components;

a second bandpass filter in communication with the switch;

a second amplifier in communication with the second bandpass filter;

a third bandpass filter in communication with the second amplifier; and

the elements of the transmitter and receiver circuits being direct surface mounted on a substrate which is mounted on the front end of a base station.

7. The electronic assembly of claim 6 wherein the substrate is mounted in a housing including a peripheral exterior wall and an interior wall, the substrate including first and second sections separated by a slot, the transmitter and receiver circuits being formed on the first and second sections respectively, the interior wall protruding through the slot in the substrate and isolating the transmitter and receiver circuits.

8. The electronic assembly of claim 6 wherein the substrate is seated in a housing defining a peripheral wall and a plurality of terminals extend into the housing through the peripheral wall and into contact with the substrate.

9. The electronic assembly of claim 6 wherein the transmitter circuit further comprises an isolator between the power amplifier and the coupler.

10. The electronic assembly of claim 6 wherein the second amplifier in the first section comprises a pair of amplifiers connected to second and third couplers.

11. An electronic front end module comprising:

a housing including an exterior peripheral wall defining an interior cavity;

a substrate seated in the cavity in the housing and including first and second sections;

a plurality of electronic components mounted on the first section and defining an RF signal transmit path;

a plurality of electronic components mounted on the second section and defining an RF signal receive path;

a switch in the housing and interconnecting the electronic elements mounted on the first and second sections of the substrate; and

a plurality of terminals extending through the exterior peripheral wall of the housing into contact with the substrate.

12. The electronic front end module of claim 11 wherein the substrate defines a slot which separates the first and second sections and a bridge on the substrate couples the first and second sections, the housing including an interior wall extending through the slot and isolating the first and second sections of the substrate.

13. The electronic front end module of claim 12 wherein at least the following discrete electronic components are direct surface mounted on the first section of the substrate:

a bandpass filter, a driver, a power amplifier, and a first coupler connected to the switch.

14. The electronic front end module of claim 13 wherein the power amplifier comprises a pair of separate amplifiers coupled to the driver and further comprising second and third couplers coupled to the pair of amplifiers respectively, the third coupler being coupled to the first coupler.

15. The electronic front end module of claim 12 wherein at least the following discrete electronic components are direct surface mounted on the second section of the substrate:

first and second bandpass filters and a low noise amplifier.