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HIGH-TEMPERATURE, SPIN-ON, BONDING COMPOSITIONS FOR TEMPORARY WAFER BONDING USING SLIDING APPROACH

  • US 20100206479A1
  • Filed: 04/29/2010
  • Published: 08/19/2010
  • Est. Priority Date: 10/06/2006
  • Status: Active Grant
First Claim
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1. A wafer bonding method comprising:

  • providing a stack comprising first and second substrates bonded together via a bonding layer formed from a bonding composition comprising a polymer dissolved or dispersed in a solvent system;

    subjecting said stack to heat so as to soften said bonding layer; and

    applying a force to at least one of said first and second substrates while causing the other of said first and second substrates to resist said force, said force being applied in a sufficient amount so as to separate said first and second substrates.

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