Thin film light emitting diode
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Abstract
Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a thin film layer over the LED chip that changes the color of the emitted light. For example, a blue LED chip can be used to produce white light. The thin film layer beneficially consists of a florescent material, such as a phosphor, and/or includes tin. The thin film layer is beneficially deposited using chemical vapor deposition.
130 Citations
114 Claims
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1-39. -39. (canceled)
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40. A vertical topology light emitting device, comprising:
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a conductive support structure; a semiconductor structure over the conductive support structure, wherein the semiconductor structure emits light having a first wavelength, and wherein the semiconductor structure has a first surface, a second surface and a side surface; a first electrode between the conductive support structure and the first surface of the semiconductor structure; a second electrode over the second surface of the semiconductor structure, wherein the second surface is opposite the first surface; a passivation layer disposed over the semiconductor structure; and a thin film layer over the second surface of the semiconductor structure, the thin film layer interacting with the light having a first wavelength to form light having a second wavelength. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113)
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114. A vertical topology light emitting device, comprising:
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a GaN-based LED chip that emits light having a first wavelength, the GaN-based LED chip comprising; a conductive support structure, a semiconductor structure over the conductive support structure, the semiconductor structure comprising an n-type GaN-based layer, a p-type GaN-based layer, and a light emitting layer therebetween, wherein the semiconductor structure has a first surface, a second surface and a side surface, a first electrode between the conductive support structure and the first surface of the semiconductor structure, and a second electrode over the second surface of the semiconductor structure, wherein the second surface is opposite the first surface; a passivation layer disposed over at least one of the side surface and the second surface of the semiconductor structure; and a thin film layer over the GaN-based LED chip, the thin film layer interacting with the light having a first wavelength to form light having a second wavelength.
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Specification