LIGHTING EMITTING DEVICE PACKAGE

• US 20100207152A1
• Filed: 02/16/2010
• Published: 08/19/2010
• Est. Priority Date: 02/17/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: WON, Jung Min
• Granted Patent: US 8,648,365 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Disclosed is a light emitting device package. The light emitting device package includes a package body including a cavity formed therein with first and second via holes, a first electrode extending from one side of the cavity to one side of a rear surface of the package body through the first via hole, a second electrode extending from an opposite side of the cavity to an opposite side of the rear surface of the package body through the second via hole, a light emitting device connected with the first and second electrodes, an insulating layer insulating the first and second electrodes from the package body, and a reflective layer disposed on the insulating layer having a structure in which first and second media having different refractive indexes are alternately stacked on each other.

Claims

1. A light emitting device package comprising:

a package body including a cavity formed therein with first and second via holes;

a first electrode extending from one side of the cavity to one side of a rear surface of the package body through the first via hole;

a second electrode extending from an opposite side of the cavity to an opposite side of the rear surface of the package body through the second via hole;

a light emitting device connected with the first and second electrodes;

an insulating layer insulating the first and second electrodes from the package body; and

a reflective layer disposed on the insulating layer having a structure in which first and second media having different refractive indexes are alternately stacked on each other.

2. The light emitting device package of claim 1, wherein the insulating layer is formed on top and bottom surfaces of the package body and in the first and second via holes.

3. The light emitting device package of claim 1, wherein the package body is formed of silicon.

4. The light emitting device package of claim 1, wherein the first and second media are alternately stacked on each other, the first medium includes one selected from the group consisting of Al₂O₃, SiO₂, and Fe₂0₃, and the second medium includes TiO₂.

5. The light emitting device package of claim 1, wherein the reflective layer has a structure in which a pair of the first and second media are stacked four times to fifteenth times

6. The light emitting device package of claim 1, wherein an outer surface of the package body is not inclined.

7. The light emitting device package of claim 1, wherein an outer surface of the package body is inclined.

8. The light emitting device package of claim 1, further comprising a zener diode disposed on a bottom surface of the package body.

9. The light emitting device package of claim 1, wherein the light emitting device is connected through at least one selected from flip-chip bonding, die-bonding, and wire bonding.

10. The light emitting device package of claim 1, wherein the first and second via holes have a circular shape or a polygonal shape.

11. The light emitting device package of claim 1, further comprising a first zener diode connected between the first electrode and the package body, and a second zener diode connected between the second electrode and the package body.

12. The light emitting device package of claim 1, wherein at least one of a resin member and a lens is formed over the cavity.

13. The light emitting device package of claim 1, wherein the first medium has a thickness of 650 Å

to 1300 Å

, and the second medium has a thickness of 450 Å

to 900 Å

.

14. The light emitting device package of claim 1, further comprising a via plug extending downward through the package body and disposed below the light emitting device.

15. The light emitting device package of claim 1, wherein the first and second electrodes extend below the reflective layer.

20. The illumination device comprising the light emitting device package of claim 1.

16. A light emitting device package comprising:

a package body formed therein with first and second via holes;

a first electrode formed at one side of an upper portion of the package body and through the first via hole;

a second electrode formed at an opposite side of the upper portion of the package body and through the second via hole;

a light emitting device connected with the first and second electrodes;

an insulating layer insulating the first and second electrodes from the package body;

a reflective layer disposed on the insulating layer and having a structure in which first and second media having different refractive indexes are alternately stacked; and

a via plug extending downward through the package body and disposed below the light emitting device.

17. The light emitting device package of claim 16, wherein the first and second media are alternately stacked, the first medium includes one selected from the group consisting of Al₂O₃, SiO₂ and Fe₂O₃, and the second medium includes TiO₂.

18. The light emitting device package of claim 16, wherein the reflective layer has a structure in which a pair of the first and second media are stacked four times to fifteenth times.

19. The light emitting device package of claim 16, wherein the first medium has a thickness of 650 Å

to 1300 Å

, and the second medium has a thickness of 450 Å

to 900 Å

.