LED ASSEMBLY HAVING MAXIMUM METAL SUPPORT FOR LASER LIFT-OFF OF GROWTH SUBSTRATE
First Claim
1. A light emitting diode (LED) structure comprising:
- LED layers, forming an LED die, comprising an n-type layer, an active layer, and a p-type layer epitaxially grown over a growth substrate, the LED layers forming a substantially rectangular surface;
a first bonding metal on a back surface of the LED die electrically contacting at least one of the n-type layer and the p-type layer;
a second bonding metal on a submount generally corresponding to the first bonding metal, the first bonding metal being bonded to the second bonding metal, with substantially no gaps between the first bonding metal and the second bonding metal; and
a support structure formed on a bottom surface of the LED layers, facing the submount, prior to the first bonding metal being bonded to the second bonding metal, the support structure extending to at least two edges of the rectangular surface, such that at least portions of a perimeter of the rectangular surface are directly supported, in a direction normal to the rectangular surface along the perimeter, by the support structure, the second bonding metal, and the submount,wherein the growth substrate has been removed from the LED die after the LED die is bonded to the submount, and wherein there is no dispensed underfill between the submount and the LED layers to support the LED layers during removal of the growth substrate.
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Accused Products
Abstract
Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.
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Citations
15 Claims
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1. A light emitting diode (LED) structure comprising:
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LED layers, forming an LED die, comprising an n-type layer, an active layer, and a p-type layer epitaxially grown over a growth substrate, the LED layers forming a substantially rectangular surface; a first bonding metal on a back surface of the LED die electrically contacting at least one of the n-type layer and the p-type layer; a second bonding metal on a submount generally corresponding to the first bonding metal, the first bonding metal being bonded to the second bonding metal, with substantially no gaps between the first bonding metal and the second bonding metal; and a support structure formed on a bottom surface of the LED layers, facing the submount, prior to the first bonding metal being bonded to the second bonding metal, the support structure extending to at least two edges of the rectangular surface, such that at least portions of a perimeter of the rectangular surface are directly supported, in a direction normal to the rectangular surface along the perimeter, by the support structure, the second bonding metal, and the submount, wherein the growth substrate has been removed from the LED die after the LED die is bonded to the submount, and wherein there is no dispensed underfill between the submount and the LED layers to support the LED layers during removal of the growth substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification