SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

• US 20100207257A1
• Filed: 02/17/2009
• Published: 08/19/2010
• Est. Priority Date: 02/17/2009
• Status: Abandoned Application

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Lee, Seokwon
• Application Number:
  US12/372,133
• Publication Number:
  US 20100207257A1
• Time in Patent Office: Days
• US Class Current: 257/660
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor package including at least a sensing component and a shielding layer is provided. While the shielding layer disposed over the molding compound can protect the semiconductor package from EMI radiations, the sensing component of the package is not blocked by the shielding layer for the feasibility of receiving the sensing signal.

Claims

1. A semiconductor package, comprising:

a carrier;

at least a chip disposed on and electrically connected to the carrier;

at least a sensing component disposed on the carrier;

a molding compound, at least encapsulating the chip, a portion of the sensing component and a portion of the carrier, wherein the molding compound has an opening to expose at least a portion of a sensing surface of the sensing component; and

a shielding layer, disposed over and covering the molding compound except for covering the opening of the molding compound.

2. The semiconductor package as claimed in claim 1, wherein a size of the opening of the molding compound is smaller than or equivalent to that of the sensing surface of the sensing component.

3. The semiconductor package as claimed in claim 1, wherein the sensing component is electrically connected to the chip through at least a wire.

4. The semiconductor package as claimed in claim 1, wherein the sensing component is a sonic sensing component, and the carrier is a laminated substrate or a leadframe.

5. The semiconductor package as claimed in claim 1, wherein the shielding layer is electrically connected to at least a ground via of the carrier.

6. The semiconductor package as claimed in claim 1, a material of the shielding layer is a metal material.

7. A manufacturing method of a semiconductor package, comprising:

providing a carrier having a plurality of carrier units;

disposing at least a chip and at least a sensing component on the carrier unit, wherein the chip is electrically connected to the carrier unit and the sensing component is electrically connected to the carrier unit;

forming a molding compound on the carrier to encapsulate the chip and at least a portion of the sensing component in each carrier unit, but to expose at least a portion of a sensing surface of the sensing component in each carrier unit; and

forming a shielding layer over the molding compound without covering the exposed sensing surface of the sensing component in each carrier unit.

8. The method as claimed in claim 7, wherein the sensing component is electrically connected to the carrier through wire-bonding.

9. The method as claimed in claim 8, wherein forming the molding compound on the carrier includes forming the molding compound with an opening to expose at least a portion of the sensing surface of the sensing component by using a partial molding process.

10. The method as claimed in claim 7, wherein the sensing component is electrically connected to the carrier through flip-chip bonding.

11. The method as claimed in claim 10, wherein forming the molding compound on the carrier includes forming the molding compound with a void to expose the sensing surface of the sensing component.

12. The method as claimed in claim 7, further comprising performing a singulation process to cut through the carrier so as to obtain individual semiconductor packages after forming the shielding layer.

13. The method as claimed in claim 12, further comprising performing a half-cutting process to remove portions of the molding compound before forming the shielding layer.

14. The method as claimed in claim 7, wherein the shielding layer is formed by a screen printing process or a plating process.

15. The method as claimed in claim 7, wherein the shielding layer is formed to cover an exposed surface of the molding compound and at least a ground via of the carrier.

16. A semiconductor package, comprising:

a carrier having at least a through hole therein and a plurality of contacts thereon;

at least a chip disposed on and electrically connected to the contacts of the carrier;

at least a sensing component disposed on the carrier and electrically connected to the carrier though a plurality of bumps, wherein at least a portion of a sensing surface of the sensing component is exposed by the through hole of the carrier;

a molding compound, at least encapsulating the chip, the contacts, a portion of the sensing component and a portion of the carrier, wherein the sensing surface of the sensing component is exposed by a void existing in the molding compound; and

a shielding layer, disposed over and covering the molding compound.

17. The semiconductor package as claimed in claim 16, wherein a size of the void of the molding compound is bigger or equivalent to that of the sensing surface of the sensing component, and the sensing surface is completely exposed by the void.

18. The semiconductor package as claimed in claim 16, wherein the sensing component is a sonic sensing component, and the carrier is a laminated substrate or a leadframe.

19. The semiconductor package as claimed in claim 16, wherein the shielding layer is electrically connected to at least a ground via of the carrier.

20. The semiconductor package as claimed in claim 16, a material of the shielding layer is a metal material.