Apparatus for testing semiconductor device

• US 20100207653A1
• Filed: 02/04/2010
• Published: 08/19/2010
• Est. Priority Date: 02/17/2009
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Son, Ji-Young, Byun, Soomin, Yang, JaeHyun, Lee, Kunhyung
• Granted Patent: US 8,248,089 B2
• Time in Patent Office: Days
• US Class Current: 324/756.30
• CPC Class Codes: G01R 31/2862 Chambers or ovens; Tanks
• CPC Class Codes: G01R 31/2874 related to temperature

Abstract

An apparatus for testing an electrical property of a semiconductor device includes a substrate support unit, a tester head above the substrate support unit, the tester head including a base, a probe card connected to the base of the tester head, and a temperature control unit within the base of the tester head, the temperature control unit being configured to control temperature of the probe card by heat transfer with the probe card.

Claims

1. An apparatus for testing an electrical property of a semiconductor device, comprising:

a substrate support unit;

a tester head above the substrate support unit, the tester head including a base;

a probe card connected to the base of the tester head; and

a temperature control unit within the base of the tester head, the temperature control unit being configured to control temperature of the probe card by heat transfer with the probe card.

2. The apparatus as claimed in claim 1, wherein the temperature control unit includes:

a thermoelectric module configured to change a heat flow direction according to a power flow direction, the thermoelectric module being within the base of the head tester to exchange heat with the probe card; and

a plate on the thermoelectric module configured to radiate or absorb heat according to a change of the heat flow direction of the thermoelectric module.

3. The apparatus as claimed in claim 2, wherein the temperature control unit further comprises:

a power supply;

a temperature detector within the base, the temperature detector being configured to detect the temperature of the probe card and to generate a corresponding detection signal; and

a controller configured to generate a control signal corresponding to the detection signal of the temperature detector and to apply the generated control signal to the power supply to change a power flow direction of the power supply.

4. The apparatus as claimed in claim 3, wherein:

the temperature control unit further comprises a housing, and

the thermoelectric module, the plate, and the temperature detector being inside the housing.

5. The apparatus as claimed in claim 4, further comprising an elastic member between the base of the tester head and the housing, the elastic member being configured to apply an elastic force to push down the housing.

6. The apparatus as claimed in claim 5, wherein the temperature control unit further comprises:

at least one blow fan above the plate; and

at least one exhaust hole in the housing, the exhaust hole being configured to exhaust air blown by the blow fan.

7. The apparatus as claimed in claim 5, wherein the temperature control unit further comprises:

a cooling air supply member configured to supply cooling air into the housing; and

an exhaust hole in the housing, the exhaust hole being configured to exhaust the cooling air supplied into the housing.

8. The apparatus as claimed in claim 2, further comprising a cooling line through the plate for a coolant.

9. The apparatus as claimed in claim 2, further comprising a plurality of grooves in the plate, the grooves having contact with ambient air.

10. The apparatus as claimed in claim 1, wherein:

the base of the tester has a cylindrical shape having an open lower portion, the probe card is coupled to the base to close the open lower portion, and the temperature control unit includes;

a housing within the base, a bottom wall of the housing contacting the probe card,

a thermoelectric module in the housing and configured to change a heat flow direction according to a power flow direction, the bottom wall of the housing being between the thermoelectric module and the probe card,

a plate on the thermoelectric module and configured to radiate or absorb heat according to a change of the heat flow direction of the thermoelectric module, the thermoelectric module being between the plate and the bottom wall of the housing,

a temperature detector configured to detect a temperature of the bottom wall of the housing and to generate a detection signal reflecting a temperature of the probe card in accordance with the detected temperature of the bottom wall, and

a controller configured to generate a control signal corresponding to the detection signal of the temperature detector and to apply the control signal to a power supply of the thermoelectric module to change a power flow direction of the power supply.

11. The apparatus as claimed in claim 1, wherein the temperature control unit is enclosed between the probe card and the base of the tester head.

12. The apparatus as claimed in claim 11, wherein the probe card and the base of the tester head are coupled to each other to define a volumetric space therebetween, the temperature control unit being entirely within the volumetric space.

13. The apparatus as claimed in claim 12, wherein the temperature control unit is in a housing, the housing being enclosed in the volumetric space, and a bottom wall of the housing being flush with the probe card.

14. The apparatus as claimed in claim 12, wherein a portion of the probe card is in the volumetric space, the portion of the probe card contacting the temperature control unit.

15. The apparatus as claimed in claim 1, wherein the temperature control unit includes:

a thermoelectric module configured to change a heat flow direction according to a power flow direction; and

a temperature detector configured to detect the temperature of the probe card, the temperature detector and the thermoelectric module being positioned directly on a same surface.

16. The apparatus as claimed in claim 15, wherein the temperature detector is configured to directly measure a temperature of a surface which directly contacts the thermoelectric module.