MEMS Interconnection Pins Fabrication on a Reusable Substrate for Probe Card Application

• US 20100207654A1
• Filed: 02/18/2009
• Published: 08/19/2010
• Est. Priority Date: 02/18/2009
• Status: Active Grant

• Current Assignee: Winmems Technologies Co., Ltd.
• Original Assignee: Winmems Technologies Holdings Co., Ltd.
• Inventors: Hsu, Tseng-Yang
• Granted Patent: US 7,928,751 B2
• Time in Patent Office: Days
• US Class Current: 324/756.30
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: Y10T 29/49105 Switch making

Abstract

A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects.

Claims

1. A method for forming a Micro-Electro-Mechanical Systems (MEMS) interconnection pin, the method comprising:

forming a conductive layer on a substrate;

forming a sacrificial layer on the conductive layer;

forming the MEMS interconnection pin on the sacrificial layer, the MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer; and

removing at least partially, the sacrificial layer to detach the MEMS interconnection pin from the substrate.

2. The method of claim 1, further comprising:

detaching the MEMS interconnection pin from the substrate by breaking a joint located between the pin base and the frame.

3. The method of claim 1, further comprising:

forming the MEMS interconnection pin that has double-sided springs connected to a pin base, wherein the pin includes a upper lip and a snatching end for placement in a slot of a plate.

4. The method of claim 1, wherein forming a sacrificial layer on the conductive layer further comprises:

forming the sacrificial layer on the conductive layer, the sacrificial layer having an opening to expose the conductive layer; and

forming the pin and the frame on the sacrificial layer, the frame having direct contact to the conductive layer through the opening.

5. The method of claim 1, wherein forming a MEMS interconnection pin further comprises:

forming a bottom part of a tip base of the pin in a first lithographic operation;

forming one or more contact tips on the tip base in a second lithographic operation; and

forming a remaining portion of the pin on the substrate in a third lithographic operation.

6. The method of claim 5, further comprising:

forming walls that structurally connect to the tip base and extend along the MEMS interconnection pin.

7. The method of claim 1, wherein the MEMS interconnection pin comprises:

two springs extending out from two opposite surfaces of the pin base; and

two tip portions, each tip portions attached to an end of one of the springs.

8. A Micro-Electro-Mechanical Systems (MEMS) interconnection pin for making electrical contacts between two conductive subjects, the MEMS interconnection pin comprising:

a pin base;

two springs extending out from two different surfaces of the pin base; and

two tip portions, each tip portions attached to an end of one of the springs, each tip portion including one or more contact tips to make contact to one of the conductive subjects,

wherein one end of the pin base has a broken surface that is formed by detaching the MEMS interconnection pin with force from a substrate on which the MEMS interconnection pin was fabricated.

9. The MEMS interconnection pin of claim 8, wherein the two springs have different shapes or different spring constants.

10. The MEMS interconnection pin of claim 8, wherein the two tip portions have different numbers of contact tips or different shapes of contact tips.

11. The MEMS interconnection pin of claim 8, wherein the pin base includes lips and snatching ends for locking into a slot of a platform.

12. The MEMS interconnection pin of claim 8, wherein at least one of the springs has two symmetrically curved elements on the same plane.

13. The MEMS interconnection pin of claim 8, wherein the pin base has two guiding units that extend out from the pin base, each guiding unit to receive an extension of a corresponding tip portion to confine movement of a corresponding spring.

14. The MEMS interconnection pin of claim 8, further comprising:

a guarding wall, which connects to and extends from the pin base, along two sides of the springs, toward the tip portions.

15. The MEMS interconnection pin of claim 14, wherein the wall is tapered at the tip end and the tip portion has corresponding tapered part.

16. The MEMS interconnection pin of claim 8, further comprising:

walls surrounding the spring and partially the tip portion for protection and confinement, the walls being part of the pin base extending to surround the spring and partially tip portion.

17. The MEMS interconnection pin of claim 16, wherein the walls include multiple holes.

18. A Micro-Electro-Mechanical Systems (MEMS) interconnection pin for making electrical contacts between two conductive subjects, the MEMS interconnection pin comprising:

a pin base;

a spring extending out from a surface of the pin base; and

a tip portion attached to an end of the spring, the tip portion including one or more contact tips to make contact to one of the conductive subjects,

wherein one end of the pin base has a broken surface that is formed by detaching the MEMS interconnection pin with force from a substrate on which the MEMS interconnection pin was fabricated.

19. The MEMS interconnection pin of claim 18, further comprising:

a second spring extending out from a different surface of the pin base; and

a second tip portion attached to an end of the second spring, the second tip portion including one or more contact tips to make contact to the other one of the conductive subjects.

20. The MEMS interconnection pin of claim 18, wherein the pin base includes lips and snatching ends for locking into a slot of a platform.