LIGHT AND PROCESS OF MANUFACTURING A LIGHT
First Claim
Patent Images
1. A light circuit manufacturing process comprising:
- forming a palletized driver printed circuit board (PCB) having a plurality of driver PCBs;
forming a plurality of power PCBs on a palletized surface;
forming slots in the driver PCBs;
forming holes in the power PCBs;
aligning both the power PCB palletization and the driver PCB palletization using reference holes such that edges of each palletization extend further in one direction or the other with respect to the other palletization; and
inserting at least one thermal tab into both the power PCB and the driver PCB.
3 Assignments
0 Petitions
Accused Products
Abstract
A light circuit manufacturing process includes forming a palletized driver PCB board having a plurality of driver PCBs, forming a plurality of power PCBs on a palletized surface, forming slots in the driver PCBs, forming holes in the power PCBs, aligning both the power PCB palletization and the driver PCB palletization using reference holes such that the edges of each extend further in one direction or the other, and inserting thermal tabs into both the power PCB and the driver PCB.
-
Citations
20 Claims
-
1. A light circuit manufacturing process comprising:
-
forming a palletized driver printed circuit board (PCB) having a plurality of driver PCBs; forming a plurality of power PCBs on a palletized surface; forming slots in the driver PCBs; forming holes in the power PCBs; aligning both the power PCB palletization and the driver PCB palletization using reference holes such that edges of each palletization extend further in one direction or the other with respect to the other palletization; and inserting at least one thermal tab into both the power PCB and the driver PCB. - View Dependent Claims (2, 3, 4, 5, 6, 19)
-
-
7. A LED light circuit manufacturing process comprising:
-
forming a palletized driver printed circuit board (PCB) having a plurality of driver PCBs; forming a plurality of power PCBs on a palletized surface; forming slots in the driver PCBs; forming holes in the power PCBs; aligning both the power PCB palletization and the driver PCB palletization using reference holes such that edges of each palletization extend further in one direction or the other with respect to the other palletization; and inserting at least one thermal tab into both the power PCB and the driver PCB. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20)
-
Specification