HEAT DISSIPATING DEVICE USING HEAT PIPE

• US 20100212865A1
• Filed: 06/25/2008
• Published: 08/26/2010
• Est. Priority Date: 10/08/2007
• Status: Abandoned Application

• Current Assignee: Zaonzi Co., Ltd.
• Original Assignee: Zaonzi Co., Ltd.
• Inventors: Lee, Sangcheol
• Application Number:
  US12/448,831
• Publication Number:
  US 20100212865A1
• Time in Patent Office: Days
• US Class Current: 165/104.190
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/67 characterised by the arrangement of fans
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

There is provided a heat dissipating device using a heat pipe. The heat dissipating device includes a plurality of unit pipe loops. Each unit pipe loop includes: a heat absorbing part arranged adjacent to a heat source; and a heat dissipating part which is connected with the heat absorbing part and dissipates heat transferred from the heat absorbing part. A working fluid is to be provided inside the heat absorbing part and the heat dissipating part. The plurality of unit pipe loops being arranged radially with respect to the heat source.

Claims

1. A heat dissipating device comprising:

a plurality of unit pipe loops,

each unit pipe loop comprising;

a heat absorbing part arranged adjacent to a heat source; and

a heat dissipating part which is connected with the heat absorbing part and dissipates heat transferred from the heat absorbing part,

a working fluid being to be provided inside the heat absorbing part and the heat dissipating part,

the plurality of unit pipe loops being arranged radially with respect to the heat source, and being connected with each other to form a single loop.

2. The heat dissipating device according to claim 1, wherein the length of each unit pipe loop is longer than a radial shortest straight line.

3. The heat dissipating device according to claim 2, wherein the heat dissipating part comprises:

a first heat dissipating part which is connected with the heat absorbing part and is arranged radially to have a length longer than the radial shortest straight line; and

a second heat dissipating part which is connected with the first heat dissipating part and forms an outer circumferential wall of each unit pipe loop.

4. The heat dissipating device according to claim 3, wherein the heat dissipating part further comprises at least one projection part between the first heat dissipating part and the second heat dissipating part.

5. The heat dissipating device according to claim 4, wherein at least one end part of each unit pipe loop is connected with a neighboring unit pipe loop.

6. The heat dissipating device according to claim 5, further comprising a auxiliary pipe loop which is disposed between the neighboring unit pipe loops and supports heat dissipation.

7. The heat dissipating device according to claim 6, further comprising a heat dissipating member which is coupled to each unit pipe loop.

8. The heat dissipating device according to claim 7, wherein the heat dissipating member comprises a guide part which guides flow of the dissipated heat.

9. The heat dissipating device according to claim 8, further comprising a mount which is disposed adjacent to the heat source, and to which the plurality of unit pipe loops are installed.

10. The heat dissipating device according to claim 9, further comprising a holder which is coupled to the mount with the plurality of unit pipe loops being interposed therebetween.

11. The heat dissipating device according to claim 10, further comprising a fan which is installed adjacent to the heat dissipating part.

12. The heat dissipating device according to claim 8, wherein each unit pipe loop comprises a first pipe member and a second pipe member which have a first end part and a second end part, respectively, and wherein the first end part of the first pipe member is coupled to the first end part of the second pipe member, and the second end part of the first pipe member is coupled to the second end part of the second pipe member of the neighboring unit pipe loop.

13. The heat dissipating device according to claim 12, wherein one of the end parts of the first pipe member and the end parts of the second pipe member, which are coupled each other, are expanded in diameter.

14. The heat dissipating device according to claim 13, wherein the end parts of the first pipe member and the second pipe member are coupled each other by soldering.

15. The heat dissipating device according to claim 1, wherein the plurality of unit pipe loops is connected with each other to form a single closed loop.