LIGHT EMITTING DIODE PACKAGE STRUCTURE

• US 20100213479A1
• Filed: 10/08/2009
• Published: 08/26/2010
• Est. Priority Date: 02/24/2009
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Hu, Hung-Lieh, Tsai, Yao-Jun, Hsu, Chen-Peng, Li, Chao-Wei
• Granted Patent: US 8,178,890 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 being other than a cuboid
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.

Claims

1. Alight emitting, diode (LED) package structure, comprising:

a carrier substrate;

at least one LED chip, disposed on the carrier substrate and having an active layer;

an optical element, disposed on the substrate and forming a sealed space with the carrier substrate, wherein the LED chip is disposed in the sealed space; and

a highly thermal-conductive transparent liquid, filling up the sealed space.

2. The LED package structure of claim 1, further comprising a sealing member disposed outside the sealed space, wherein the sealing member connects the carrier substrate and an outer periphery of the optical element.

3. The LED package structure of claim 2, further comprising a fixed component disposed on the carrier substrate, wherein the fixed component connects the sealing member and the carrier substrate.

4. The LED package structure of claim 2, further comprising a connection layer disposed between the sealing member and the carrier substrate, and a material of the connection layer comprises metal or alloy.

5. The LED package structure of claim 1, wherein the highly thermal-conductive transparent liquid comprises at least one antifreeze material.

6. The LED package structure of claim 1, wherein the highly thermal-conductive transparent liquid contains a plurality of suspended particles.

7. The LED package structure of claim 1, wherein the highly thermal-conductive transparent liquid is an electric insulated liquid.

8. The LED package structure of claim 1, wherein a thermal conductivity of the highly thermal-conductive transparent liquid is greater than a thermal conductivity of epoxy resin.

9. The LED package structure of claim 1, further comprising a light conversion layer disposed on a light-emitting path of the LED chip.

10. The LED package structure of claim 1, further comprising an insulating layer covering the active layer, a plurality of pads of the LED chip and a plurality of conductive lines respectively electronically connected to the pads.

11. The LED package structure of claim 10, wherein the insulating layer comprises a light conversion layer directly attaching to the LED chip.

12. A LED package structure, comprising:

a carrier substrate;

at least one protrusion, disposed on the carrier substrate, having an opening to expose the carrier substrate and a material of the protrusion comprising a thermal-conductive material;

at least one LED chip, disposed on the carrier substrate and in the opening, wherein a ratio of a cross-sectional width of the opening to a cross-sectional width of the LED chip is larger than 1 and smaller than or equal to 1.5;

an optical element, disposed on the carrier substrate and forming a sealed space with the carrier substrate, wherein the protrusion and the LED chip are disposed in the sealed space; and

a highly thermal-conductive transparent liquid, filling up the sealed space.

13. The LED package structure of claim 12, further comprising a sealing member disposed outside the sealed space, wherein the sealing member connects the carrier substrate and an outer periphery of the optical element.

14. The LED package structure of claim 13, further comprising a fixed component disposed on the carrier substrate, wherein the fixed component connects the sealing member and the carrier substrate.

15. The LED package structure of claim 12, further comprising an intermediate layer disposed on an inner wall of the opening and on a portion of the carrier substrate exposed by the opening.

16. The LED package structure of claim 12, wherein the thermal-conductive material comprises metal, metal alloy or ceramics.

17. The LED package structure of claim 12, wherein a thermal conductivity of the highly thermal-conductive transparent liquid is greater than a thermal conductivity of epoxy resin.

18. A LED package structure, comprising:

a carrier substrate;

at least one pedestal, disposed on the carrier substrate, having at least one groove and a first top surface away from the carrier substrate and a material of the pedestal comprising a thermal-conductive material;

at least one LED chip, disposed on the first top surface of the pedestal;

an optical element, disposed on the carrier substrate and forming a sealed space with the carrier substrate, wherein the pedestal and the LED chip are disposed in the sealed space; and

a highly thermal-conductive transparent liquid, filling up the sealed space and the groove.

19. The LED package structure of claim 18, further comprising a sealing member disposed outside the sealed space and connecting the carrier substrate and an outer periphery of the optical element, wherein the sealing member has a second top surface away from the carrier substrate, and a distance between the first top surface of the pedestal and the carrier substrate is greater than or at least equal to a distance between the second top surface of the sealing member and the carrier substrate.

20. The LED package structure of claim 19, further comprising a fixed component disposed on the carrier substrate, wherein the fixed component connects the sealing member and the carrier substrate.

21. The LED package structure of claim 18, wherein the pedestal comprises a base and a protrusion disposed on the base, the protrusion has an opening to expose the base, and the LED chip is disposed on the base and in the opening.

22. The LED package structure of claim 21, wherein a ratio of a cross-sectional width of the opening to a cross-sectional width of the LED chip is larger than 1 and smaller than or equal to 1.5.

23. The LED package structure of claim 21, further comprising an intermediate layer disposed on an inner wall of the opening and on a portion of the base exposed by the opening.

24. The LED package structure of claim 18, wherein a thermal conductivity of the highly thermal-conductive transparent liquid is greater than a thermal conductivity of epoxy resin.