Lead frame assembly, package structure and LED package structure

• US 20100213484A1
• Filed: 01/11/2010
• Published: 08/26/2010
• Est. Priority Date: 02/26/2009
• Status: Active Grant

• Current Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Original Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Inventors: Lin, Chen-Hsiu
• Granted Patent: US 8,455,970 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire.

Claims

1. A package structure adapted for mounting at least one light emitting diode (LED) die, said package structure comprising:

an insulating housing having a top surface that is formed with a cavity; and

a lead frame unit including;

a first lead frame portion covered by said insulating housing, and having a die-bonding area exposed within said cavity and adapted for mounting said LED die, and

a second lead frame portion covered by said insulating housing, and having a conductive surface exposed outwardly of said top surface of said insulating housing and adapted for electrical connection with an end of a conductive wire.

2. The package structure as claimed in claim 1, wherein said conductive surface of said second lead frame portion and said top surface of said insulating housing are located in a plane.

3. The package structure as claimed in claim 2, wherein said second lead frame portion further has a conductive portion and a bent portion bent upwardly to connect with said conductive portion such that said conductive surface is disposed higher than said LED die, said conductive surface of said second lead frame portion constituting a top surface of said conductive portion.

4. The package structure as claimed in claim 1, wherein said top surface of said insulating housing has a rough portion surrounding said cavity of said insulating housing.

5. The package structure as claimed in claim 1, wherein said lead frame unit further includes:

a pair of first side strips arranged in a first direction, aligned with and spaced apart from each other, and flanking said first lead frame portion and said second lead frame portion;

a pair of second side strips arranged in a second direction different from the first direction, aligned with and spaced apart from each other, extending into said insulating housing, and flanking said first lead frame portion and said second lead frame portion, each of said second side strips being connected between said first side strips; and

a plurality of connecting strips connecting said first lead frame portion and said second lead frame portion with said first side strips,

whereby, after said insulating housing is molded on said lead frame unit, said connecting strips are removable from said lead frame unit.

6. A light emitting diode (LED) package structure comprising:

an insulating housing having a top surface that is formed with a cavity;

an LED die;

a lead frame unit including;

a first lead frame portion covered by said insulating housing and having a die-bonding area exposed within said cavity and adapted for mounting said LED die, and

a second lead frame portion covered by said insulating housing, and having a conductive surface exposed outwardly of said top surface of said insulating housing and disposed higher than said LED die;

at least one conductive wire having one end connected fixedly to said conductive surface of said second lead frame portion, and the other end extending into said cavity of said insulating housing and connected fixedly to said LED die; and

an encapsulating material filled in said cavity of said insulating housing for covering said LED die.

7. The LED package structure as claimed in claim 6, wherein said conductive surface of said second lead frame portion and said top surface of said insulating housing are located in a plane.

8. The LED package structure as claimed in claim 7, wherein said second lead frame portion further has a conductive portion and a bent portion bent upwardly to connect with said conductive portion such that said conductive surface is disposed higher than said LED die, said conductive surface of said second lead frame portion constituting a top surface of said conductive portion.

9. The LED package structure as claimed in claim 6, wherein said top surface of said insulating housing has a rough portion surrounding said cavity of said insulating housing, said LED package structure further comprising an optical lens disposed on said top surface of said insulating housing for covering said encapsulating material and said rough portion of said insulating housing.

10. The LED package structure as claimed in claim 9, wherein said encapsulating material and said optical lens are made of the same material.

11. The LED package structure as claimed in claim 6, further comprising an optical lens disposed on said top surface of said insulating housing for covering said encapsulating material.

12. The LED package structure as claimed in claim 11, wherein said encapsulating material and said optical lens are made of the same material.

13. The LED package structure as claimed in claim 6, wherein said cavity of said insulating housing is defined by an inner surface, a distance between said LED die and said inner surface of said insulating housing being smaller than 0.6 mm.

14. The LED package structure as claimed in claim 6, wherein said encapsulating material includes fluorescent powders.

15. The LED package structure as claimed in claim 6, wherein said lead frame unit further includes:

a pair of first side strips arranged in a first direction, aligned with and spaced apart from each other, and flanking said first lead frame portion and said second lead frame portion;

a pair of second side strips arranged in a second direction different from the first direction, aligned with and spaced apart from each other, extending into said insulating housing, and flanking said first lead frame portion and said second lead frame portion, each of said second side strips being connected between said first side strips; and

a plurality of connecting strips connecting said first lead frame portion and said second lead frame portion with said first side strips,

whereby, after said insulating housing is molded on said lead frame unit, said connecting strips are removable from said lead frame unit.

16. A lead frame assembly comprising a plurality of lead frame units connected to each other, each of said lead frame units including:

a first lead frame portion having a die-bonding area adapted for mounting a light emitting diode (LED) die;

a second lead frame portion having a conductive surface that is higher than remaining portions thereof, and that is adapted for electrical connection with a conductive wire;

a pair of first side strips arranged in a first direction, aligned with and spaced apart from each other, and flanking said first lead frame portion and said second lead frame portion;

a pair of second side strips arranged in a second direction different from the first direction, aligned with and spaced apart from each other, and flanking said first lead frame portion and said second lead frame portion, each of said second side strips being connected between said first side strips; and

a plurality of connecting strips connecting said first lead frame portion and said second lead frame portion with said first side strips.

17. The lead frame assembly as claimed in claim 16, wherein said second lead frame portion of each of said lead frame units has a conductive portion and a bent portion that is bent upwardly to connect with said conductive portion such that said conductive surface is disposed higher than said LED die, said conductive surfaces of said second lead frame portions constituting respectively top surfaces of said conductive portions of said second lead frame portions of said lead frame units.