SIDE-EMITTING LED PACKAGE AND MANUFACTURING METHOD OF THE SAME

• US 20100213487A1
• Filed: 02/09/2010
• Published: 08/26/2010
• Est. Priority Date: 02/24/2009
• Status: Active Grant

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: CHEN, PIN-CHUAN, KUO, CHESTER, LO, HSING-FEN
• Granted Patent: US 8,089,089 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A side-emitting LED includes a substrate formed with a plurality of electrodes, an LED chip bonded onto the substrate and electrically connected to the electrodes, a transparent member encapsulating the LED chip and a casing fixed on the substrate. The transparent member has a flat bottom surface attached to the substrate, a vertically surface extending perpendicularly from a straight side edge of the flat bottom surface and a curved surface connected to curved edges of the flat bottom and vertical surfaces. The casing encapsulates the transparent member excepting the vertical surface of the transparent member. The curved surface of the transparent member is shaped as a part of an outer surface of an ellipsoid.

Claims

1. A side-emitting LED package:

a substrate formed with a plural electrodes;

an LED chip bonded onto the substrate and electrically connected to the electrodes;

a transparent member encapsulating the LED chip and having a flat bottom surface attached to the substrate, a vertically surface extending perpendicularly from a straight side edge of the flat bottom surface and a curved surface connected to curved edges of the flat bottom and vertical surfaces; and

a casing fixed on the substrate and encapsulating the transparent member, excepting the vertical surface of the transparent member;

wherein the curved surface of the transparent member is shaped as a part of an outer surface of an ellipsoid.

2. The side-emitting LED package of claim 1, wherein a reflective layer is formed between the casing and the transparent member.

3. The side-emitting LED package of claim 2, wherein the reflective layer wholly covers the curved surface of the transparent surface and reflects light from the LED chip to transmit through the vertical surface in a direction parallel to a planer surface where the LED chip is mounted.

4. The side-emitting LED package of claim 1, wherein the electrodes comprises a first electrode, a second electrode, a third electrode and a fourth electrode, the first and second electrodes separated apart from each other and mounted on a first surface of the substrate, while the third and fourth electrodes separated apart from each other and mounted on a second surface of the substrate opposite to the first surface.

5. The side-emitting LED package of claim 4, wherein the first electrode is located over the third electrode and electrically connected to the third electrode, and the second electrode is located over the fourth electrode and electrically connected to the fourth electrode.

6. The side-emitting LED package of claim 5, wherein the LED chip is die-bonded onto the second electrode and electrically connected to the first and second electrodes by bonding wires, respectively.

7. The side-emitting LED package of claim 1, wherein the substrate is a metal core printed circuit board (MCPCB) or a ceramic substrate.

8. The side-emitting LED package of claim 1, wherein the transparent member is formed of transparent resin mixed with fluorescent material, and thus is capable of changing wave length of a part of single color light transmitted therethtough to mix with other part of the single color light to obtain white light.

9. The side-emitting LED package of claim 8, wherein the transparent resin comprises epoxy or silicon resin.

10. The side-emitting LED package of claim 8, wherein the fluorescent material is formed from a group comprising an element selected from sulfides, oxides, nitrides and silicate.

11. The side-emitting LED package of claim 8, wherein the casing is formed of PPA or PPB.

12. A manufacturing method of a side-emitting LED package, comprising following steps:

(i) providing a substrate formed with a plural electrodes;

(ii) bonding LED chips on the substrate;

(iii) forming a transparent member encapsulating the LED chips, wherein the transparent member having a configuration of a half of an ellipsoid with a flat elliptical bottom surface attached to the substrate, the LED chips each being located at one of two focuses of the flat elliptical bottom surface;

(iv) forming a casing on the substrate and encapsulating the transparent member;

(v) dicing the substrate together with the transparent member and the casing into the side-emitting LED package each having a corresponding LED chip therein, wherein the transparent member is divided into two halves each having a bottom face, a vertical surface extending perpendicularly from a straight side edge of the bottom surface and a curved surface connected to curved edges of the bottom face and the vertical faces.

13. The manufacturing method of a side-emitting LED package of claim 12, wherein the transparent member is coated with a reflective layer between the casing and the transparent member after forming the transparent member in step (iii).

14. The manufacturing method of a side-emitting LED package of claim 12, wherein the transparent member (iii) is formed by transfer molding.

15. The manufacturing method of a side-emitting LED package of claim 12, wherein the casing is formed by transfer molding.

16. The manufacturing method of a side-emitting LED package claim 12, wherein the substrate is a metal core printed circuit board (MCPCB) or a ceramic substrate.

17. The manufacturing method of a side-emitting LED package of claim 12, wherein the transparent member is formed of transparent resin mixed with fluorescent material, and is capable of changing wave length of a part of single color light transmitted therethrough to mix with other part of the single color light to obtain white light.

18. The manufacturing method of a side-emitting LED package of claim 17, wherein the transparent resin comprises epoxy or silicon resin, the fluorescent material is formed from a group comprising an element selected from sulfides, oxides, nitrides and silicate.

19. The manufacturing method of a side-emitting LED package of claim 12, wherein the molding material is formed of PPA or PPB.

20. The manufacturing method of a side-emitting LED package of claim 13, wherein the reflective layer is formed by depositing metal selected from group comprising Al, Au, Ag, Ni, W, Ti and Pt.