×

SIDE-EMITTING LED PACKAGE AND MANUFACTURING METHOD OF THE SAME

  • US 20100213487A1
  • Filed: 02/09/2010
  • Published: 08/26/2010
  • Est. Priority Date: 02/24/2009
  • Status: Active Grant
First Claim
Patent Images

1. A side-emitting LED package:

  • a substrate formed with a plural electrodes;

    an LED chip bonded onto the substrate and electrically connected to the electrodes;

    a transparent member encapsulating the LED chip and having a flat bottom surface attached to the substrate, a vertically surface extending perpendicularly from a straight side edge of the flat bottom surface and a curved surface connected to curved edges of the flat bottom and vertical surfaces; and

    a casing fixed on the substrate and encapsulating the transparent member, excepting the vertical surface of the transparent member;

    wherein the curved surface of the transparent member is shaped as a part of an outer surface of an ellipsoid.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×