LIGHT EMITTING PACKAGE CONTROLLING COLOR TEMPERATURE, FABRICATING METHOD THEREOF, COLOR TEMPERATURE CONTROLLING METHOD OF LIGHT EMITTING PACKAGE

• US 20100213498A1
• Filed: 02/23/2010
• Published: 08/26/2010
• Est. Priority Date: 02/26/2009
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Yu-Sik
• Granted Patent: US 8,212,278 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

Provided are a light emitting package capable of controlling a color temperature, a fabricating method thereof, and a color temperature controlling method of the light emitting package. The light emitting package includes a package body, a first electrode and a second electrode formed on the package body and spaced apart from each other, a light emitting element formed on the package body and electrically connected to the first electrode and the second electrode, and a thin film resistor connected in series to the first electrode.

Claims

1. A light emitting package comprising:

a package body having a first surface and a second surface opposite to the first surface;

a first electrode and a second electrode formed on the package body and spaced apart from each other;

a light emitting element formed on the package body and electrically connected to the first electrode and the second electrode; and

a thin film resistor series-connected to the first electrode.

2. The light emitting package of claim 1, wherein the first electrode includes a first conductive pattern and a second conductive pattern spaced apart from each other, and the thin film resistor is electrically connected to the first conductive pattern and the second conductive pattern.

3. The light emitting package of claim 1, wherein the resistance level of the thin film resistor is configured to be adjusted.

4. The light emitting package of claim 3, wherein the thin film resistor is configured to be adjusted by laser trimming.

5. The light emitting package of claim 3, wherein when the resistance level of the thin film resistor is at a first level, the light emitting package is configured to produce bluish white light;

and when the resistance level of the thin film resistor is at a second level greater than the first level, the light emitting package is configured to produce reddish white light.

6. The light emitting package of claim 1, wherein the light emitting element is disposed on the first surface of the package body, and the thin film resistor is disposed on the first surface or second surface of the package body.

7. The light emitting package of claim 1, wherein a zener diode is provided on the second surface of the package body, and the first electrode and the second electrode are electrically connected to the zener diode.

8. The light emitting package of claim 1, wherein a first groove is formed on the first surface of the package body, and the light emitting element is disposed within the groove.

9. The light emitting package of claim 8, wherein a second groove is formed on the second surface of the package body, the second groove connecting the second surface of the package body to the first groove.

10. The light emitting package of claim 1, wherein the first electrode is formed along the first surface and a left sidewall and the second surface of the package body, and the second electrode is formed along the first surface, a right sidewall and the second surface of the package body.

11. The light emitting package of claim 1, wherein the first electrode is formed on both the first surface and the second surface of the package body, and a portion of the first electrode formed on the first surface and another portion of the first electrode formed on the second surface are connected to each other through a first via passing through the package body;

and

the second electrode is formed on both the first surface and the second surface of the package body, and a portion of the second electrode formed on the first surface and another portion of the second electrode formed on the second surface are connected to each other through a second via passing through the package body.

12-15. -15. (canceled)