Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects

• US 20100215314A1
• Filed: 02/19/2010
• Published: 08/26/2010
• Est. Priority Date: 02/20/2009
• Status: Active Grant

• Current Assignee: Hong Kong University of Science and Technology
• Original Assignee: Hong Kong University of Science and Technology
• Inventors: Chen, Haibin, Yuen, Matthew Ming Fai, Fan, Haibo, Wu, Jingshen, Lau, Hon Shing, Lo, Chi Chuen, Lee, Shi-Wei
• Granted Patent: US 9,057,853 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component

Abstract

An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Claims

1. An optoelectronic apparatus including:

a circuit board including a cavity;

a waveguide structure embedded in the circuit board for transmitting optical signals; and

a laser transmitter for generating the optical signals, the laser transmitter being disposed within the cavity in proximity to the waveguide, wherein the waveguide is aligned with the laser transmitter for receiving the optical signals from the laser transmitter.

2. The optoelectronic apparatus of claim 1, wherein the laser transmitter further includes:

a serializer;

a laser driver; and

a laser generator.

3. The optoelectronic apparatus of claim 2, wherein the laser transmitter has a three-dimensional integrated circuit structure, and the serializer, the laser driver, and the laser generator are stacked and electronically coupled within the three-dimensional integrated circuit.

4. The optoelectronic apparatus of claim 3, wherein the laser driver is arranged between the serializer and the laser generator and the serializer and the laser generator are electronically coupled through the laser driver.

5. The optoelectronic apparatus of claim 4, wherein the laser driver includes a silicon substrate having a plurality of through silicon vias passing through the silicon substrate, and wherein the serializer and the laser generator are electronically coupled through the plurality of through silicon vias in the laser driver.

6. The optoelectronic apparatus of claim 4, wherein the waveguide structure includes a transparent surface and first and second reflective surfaces.

7. The optoelectronic apparatus of claim 6, wherein the laser transmitter is attached to the transparent surface of the waveguide structure through a plurality of solder bumps between the serializer and the transparent surface, and wherein the laser generator is oriented toward the transparent surface of the waveguide structure.

8. The optoelectronic apparatus of claim 7, wherein the first reflective surface of the waveguide structure is aligned with the laser generator for receiving the optical signals from the laser generator through the transparent surface, and wherein the first reflective surface reflects the optical signals onto the second reflective surface in a direction substantially parallel to the transparent surface.

9. The optoelectronic apparatus of claim 3, wherein the circuit board further includes an opening extending from the cavity through an outer surface of the circuit board.

10. The optoelectronic apparatus of claim 9, wherein the serializer is oriented toward the outer surface of the circuit board and alighted with the opening,

the apparatus further including a heat slug disposed within the opening and attached to the serializer for dissipating heat from the serializer toward the outer surface of the circuit board.

11. The optoelectronic apparatus of claim 10, further including a heat spreader attached to the outer surface of the circuit board for further dissipating the heat from the heat slug.

12. The optoelectronic apparatus of claim 1, wherein the laser transmitter generates one or more vertical cavity surface emitting laser (VCSEL) beams for transmission through the waveguide structure.

13. The optoelectronic apparatus of claim 8, wherein the circuit board further includes another cavity,

the apparatus further including a laser receiver disposed within the another cavity and aligned with the second reflective surface of the waveguide structure for receiving the optical signals reflective from the second reflective surface.

14. An optoelectronic apparatus including:

a circuit board including a cavity;

a waveguide structure embedded in the circuit board for transmitting optical signals; and

a laser receiver disposed within the cavity in proximity to the waveguide, wherein the laser receiver is aligned with the waveguide structure for receiving the optical signals through the waveguide structure.

15. The optoelectronic apparatus of claim 14, wherein the laser receiver further includes a de-serializer, an amplifier, and a photodiode detector, wherein the laser receiver has a three-dimensional integrated circuit structure, and wherein the de-serializer, the amplifier, and the photodiode detector are stacked and electronically coupled within the three-dimensional integrated circuit.

16. The optoelectronic apparatus of claim 15, wherein the amplifier is arranged between the de-serializer and the photodiode detector, wherein the amplifier includes a silicon substrate having a plurality of through silicon vias passing through the silicon substrate, and wherein the de-serializer and the photodiode detector are electronically coupled through the plurality of through silicon vias in the amplifier.

17. The optoelectronic apparatus of claim 16, wherein the waveguide structure includes a transparent surface and first and second reflective surfaces, wherein the optical signals are reflective from the first reflective surface to the second reflective surface in a direction substantially parallel to the transparent surface, and wherein the laser receiver is attached to the transparent surface of the waveguide structure through a plurality of solder bumps between the de-serializer and the transparent surface, and wherein the laser receiver is oriented toward the transparent surface of the waveguide structure.

18. The optoelectronic apparatus of claim 17, wherein the photodiode detector is aligned with the second reflective surface of the waveguide structure for receiving the optical signals reflected from the second reflective surface through the transparent surface.

19. The optoelectronic apparatus of claim 15, wherein the circuit board further includes an opening extending from the cavity through an outer surface of the circuit board, and wherein the de-serializer is oriented toward the outer surface of the circuit board and alighted with the opening,

the apparatus further including a heat slug disposed within the opening and attached to the de-serializer for dissipating heat from the de-serializer toward the outer surface of the circuit board.

20. The optoelectronic apparatus of claim 19, further including a heat spreader attached to the outer surface of the circuit board for further dissipating the heat from the heat slug.