Method to reduce heating at implantable medical devices including neuroprosthetic devices

• US 20100217356A1
• Filed: 02/21/2009
• Published: 08/26/2010
• Est. Priority Date: 08/21/2006
• Status: Abandoned Application

• Current Assignee: Maged M. Elwassif, Marom Bikson, Qingjun Kong
• Original Assignee: Maged M. Elwassif, Marom Bikson, Qingjun Kong
• Inventors: Kong, Qingjun, Elwassif, Maged M., Bikson, Marom
• Application Number:
  US12/380,021
• Publication Number:
  US 20100217356A1
• Time in Patent Office: Days
• US Class Current: 607/63
• CPC Class Codes: A61N 1/36082 Cognitive or psychiatric applications, e.g. dementia or Alzheimer's disease
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: G01R 33/288 Provisions within MR facilities for enhancing safety during MR, e.g. reduction of the specific absorption rate [SAR], detection of ferromagnetic objects in the scanner room
• CPC Class Codes: G01R 33/31 Temperature control thereof

Abstract

A method to control tissue/device heating at implantable medical devices including neuroprosthetic devices. In a first embodiment, thermal conductivity of components of the implantable medical devices including the neuroprosthetic devices is increased. In a second embodiment, the implantable medical devices including the neuroprosthetic devices are cooled by using heat-sinks. In a third embodiment, portions of the implantable medical devices including the neuroprosthetic devices are replaced with specific thermal properties. In a fourth embodiment, the implantable medical devices including the neuroprosthetic devices are coated with a drug/material that will induce surrounding tissue to become more resistant to temperature increases. In a fifth embodiment, the temperature increase near the implantable devices including the neuroprosthetic devices is determined using a modified bio-heat transfer model. In a sixth embodiment, the shape of the outer or the inner surface of the device is modified.

Claims

1. A method to reduce heating or to change spatial distribution of heating at implantable medical devices including neuroprosthetic devices, comprising the step of increasing thermal conductivity of components of the implantable medical devices including the neuroprosthetic devices.

2. A method to reduce heating or to change spatial distribution of heating at implantable medical devices including neuroprosthetic devices, comprising the step of cooling the implantable medical devices including the neuroprosthetic devices by using heat-sinks.

3. A method to control heating or to change spatial distribution of heating at implantable medical devices including neuroprosthetic devices, comprising the step of replacing components of the implantable medical devices including the neuroprosthetic devices with specific thermal properties.

4. A method to reduce heating or to change spatial distribution of heating at implantable medical devices including neuroprosthetic devices, comprising the step of modifying/coating components of the implantable medical devices including the neuroprosthetic devices with a material or drug that will induce surrounding tissue to become more resistant to temperature increases.

5. A method to determine and reduce hazards relating to temperature increases at implantable medical devices including neuroprosthetic devices, comprising the step of using a modified bio-heat transfer model.

6. A method to control heating or to change spatial distribution of heating at implantable medical devices including neuroprosthetic devices, comprising the step of changing outer or inner surface dimensions and geometry of the device or device components.