METROLOGICAL INSTRUMENT

• US 20100217561A1
• Filed: 01/25/2006
• Published: 08/26/2010
• Est. Priority Date: 02/01/2005
• Status: Active Grant

• Current Assignee: Taylor Hobson Limited (Ametek Incorporated)
• Original Assignee: Taylor Hobson Limited (Ametek Incorporated)
• Inventors: Mills, Michael
• Granted Patent: US 8,296,098 B2
• Time in Patent Office: Days
• US Class Current: 702/168
• CPC Class Codes: G01B 5/20 for measuring contours or curvatures

Abstract

A metrological instrument determines a surface profile or form of a surface (61) of a workpiece (60) by effecting relative movement between a probe (11, 12) and the surface (61) so that the probe follows and is displaced by changes in the surface topography. A measure of the displacement of the probe as it follows the surface is obtained by a displacement provider which may be an interferometric gauge (35). Instead of making a measurement along a single measurement path over the surface (61), respective measurements are made on sections (61d and 61e or 61g and 61h) of that measurement path to obtain corresponding measurement data sets and these measurement data sets are independently positioned or aligned to a reference data set. The reference data set may be obtained by a measurement made on another section (61c) of the measurement path (61), on another measurement path (61f) over another surface (62a and 62b) of the component or on another measurement path over a surface on which the component is located. The aligned measurement data sets are then merged together to form a profile of the surface.

Claims

1. A metrological instrument for determining a surface profile of a surface of a component, the instrument comprising:

a component support to support a component;

a mover to effect relative movement between a measurement probe and the component support so that the measurement probe follows changes in the surface in a direction perpendicular to the relative movement direction;

a measure to provide measurement data indicating the displacement of the measurement probe as the measurement probe follows the changes in the surface;

an orientation controller to control the orientation of the component;

a measurement controller to control the mover to cause

the measurement probe to follow a reference measurement path with the component in a first orientation so that the measurer obtains reference data,

the measurement probe to follow a first section of a measurement path along the surface with the component in a second orientation so that the measurer obtains first measurement data, and

the measurement probe to follow a second section of the measurement path along the surface with the component in a third orientation so that the measurer obtains second measurement data; and

a processor to process the measurement data, the processor being operable;

to define a datum using the reference data, to align the first measurement data to the datum to produce aligned first measurement data, to align the second measurement data to the datum to produce aligned second measurement data, and then to use the aligned first and second measurement data to generate a surface profile of the surface of the component.

2. A metrological instrument according to claim 1, wherein the processor is operable to align the measurement data to the datum by determining the relative orientations at which reference data and measurement data were obtained, by transforming the measurement data to compensate for the relative orientations and by fitting the measurement data to the reference data.

3. A metrological instrument according to claim 1, wherein the processor is operable to align the measurement data to the datum by determining the relative orientations at which reference data and measurement data were obtained, by transforming the measurement data to compensate for the relative orientations and by fitting the measurement data to the reference data using a least squares fitting procedure.

4. A metrological instrument according to claim 2, wherein the processor is operable to determine the relative orientations at which the reference data and measurement data were obtained by displaying respective traces representing the reference and measurement data to an operator to allow the operator to re-orientate the measurement data so as visually to align the measurement data to the reference data.

5. A metrological instrument according to claim 1, wherein the measurement controller is operable to control the mover so that the reference measurement path is provided by a third section of the measurement path.

6. A metrological instrument according to claim 5, wherein the surface is a lens surface, for example an aspheric lens surface, and the measurement controller is operable to control the mover so that the first, second and third sections of the measurement path are respective sections of a diametral path across the surface.

7. A metrological instrument according to claim 5, wherein the surface is a recessed, for example aspheric, surface of a mould and the measurement controller is operable to control the mover so that the first, second and third sections of the measurement path are respective sections of a diametral path across the surface.

8. A metrological instrument according to claim 5, wherein the measurement controller is operable to control the mover so that the third section of the measurement path encompasses an axis of symmetry of the surface being measured.

9. A metrological instrument according to claim 5, wherein the measurement controller is operable to control the mover so that the third section of the measurement path overlaps each of the first and second sections of the measurement path.

10. A metrological instrument according to claim 1, wherein the measurement controller is operable to control the mover to cause the measurement probe to include in the first and second measurement paths areas that provide reference data and the processor is operable to align the measurement data to the datum provided by the reference data by using the reference data provided by the corresponding areas of the first and second measurement paths and by fitting the measurement data to the reference data.

11. A metrological instrument according to claim 1, wherein the measurement controller is operable to control the mover to cause the measurement probe to include in the first and second measurement paths areas that provide reference data and the processor is operable to align the measurement data to the datum provided by the reference data by using the reference data provided by those corresponding areas of the first and second measurement paths and by fitting the measurement data to the reference data using a least squares fitting procedure.

12. A metrological instrument according to claim 1, wherein the measurement controller is operable to control the mover so that the reference data is obtained by following a reference path on a planar surface forming part of the component or fixed for movement and rotation with the component and the corresponding areas of the first and second measurement paths are provided by that planar surface.

13. A metrological instrument according to claim 12, wherein the surface is a recessed, for example aspheric, surface of a mould and the measurement controller is operable to control the mover so that the reference path and the corresponding areas of the first and second measurement paths are provided by portions of a planar surface of the mould bounding the surface.

14. A metrological instrument according to claim 12, wherein the surface is a lens surface, for example an aspheric lens surface, of a lens that is mounted on a flat surface on the component support and the measurement controller is operable to control the mover so that the reference path and the corresponding areas of the first and second measurement paths are provided by portions of the flat surface bounding the lens.

15. A metrological instrument according to claim 1, wherein the first and second sections of the measurement path are respective sections of a diametral path across the surface.

16. A metrological instrument according to claim 1, wherein the measurement controller is operable to control the mover so that the first and second sections of the measurement path overlap.

17. A metrological instrument according to claim 1, wherein the measurement controller is operable to control the mover to cause the measurement probe to follow at least one further section of the measurement path so that the measurer obtains at least one further set of measurement data and the processor is operable to align the at least one further set of measurement data to the reference data or to another set of reference data obtained by measurement controller controlling the mover to cause the measurement probe to follow another reference path.

18. A metrological instrument according to claim 1, wherein the component support comprises a support platform that is rotatable or tiltable to change the orientation of the component.

19. A metrological instrument according to claim 1, wherein the component support comprises a support platform that is manually rotatable or tiltable to change the orientation of the component.

20. A metrological instrument according to claim 18, wherein the support platform is carried by support member which is rotatable about an axis extending at an angle to the direction in which the component is oriented.

21. A metrological instrument according to claim 1, wherein the component support comprises a support platform configured to receive the component with an axis of symmetry of the component perpendicular to a surface of the support platform and coincident with a rotation axis of the support platform, the support platform being carried by a support member which is rotatable to change the orientation of the axis of symmetry of the component and thus the orientation of the component.

22. A metrological instrument according to claim 21, wherein the support comprises a chuck for holding the component.

23. A metrological instrument according to claim 1, wherein the first and second orientations are mirror images and the third orientation is with the component not tilted.

24. A metrological apparatus according to claim 1, wherein the measurement controller and processor are operable to cause respective profiles to be determined for different measurement paths across the surface and the processor is operable to determine at least one of a three dimensional form and an average two dimensional profile for the surface.

25. A metrological instrument according to claim 1, wherein processor is operable to remove the expected form from the profile or three dimensional form to provide an indication of the error from an expected form.

26. A metrological instrument according to Claim 1, further comprising the measurement probe in the form of a stylus.

27. A metrological instrument according to claim 1, wherein the measurement probe comprises a pivotable arm carrying a stylus and wherein the arm is mounted so as to pivot as the stylus follows the surface.

28. A metrological instrument according to claim 1, wherein the measurer comprises an interferometric measurer.

29. A data processing apparatus for use in a metrological instrument in accordance with claim 1, the data processing apparatus comprising:

a receiver to receive reference data obtained by causing the measurement probe to follow a reference measurement path with the component in a first orientation, first measurement data obtained by causing the measurement probe to follow a first section of a measurement path along the surface with the component in a second orientation, and second measurement data obtained by causing the measurement probe to follow a second section of the measurement path along the surface with the component in a third orientation; and

a processor to process the measurement data, the processor being operable;

to define a datum using the reference data, to align the first measurement data to the datum to produce aligned first measurement data, to align the second measurement data to the datum to produce aligned second measurement data, and then to use the aligned first and second measurement data to generate a surface profile of the surface of the component.

30. A data processing apparatus according to claim 29, wherein the processor is operable to align the measurement data to the datum by determining the relative orientations at which reference data and measurement data were obtained, by transforming the measurement data to compensate for the relative orientations and by fitting the measurement data to the reference data.

31. A data processing apparatus metrological instrument according to claim 29, wherein the processor is operable to align the measurement data to the datum by determining the relative orientations at which reference data and measurement data were obtained, by transforming the measurement data to compensate for the relative orientations and by fitting the measurement data to the reference data using a least squares fitting procedure.

32. A data processing apparatus according to claim 30, wherein the processor is operable to determine the relative orientations at which the reference data and measurement data were obtained by displaying respective traces representing the reference and measurement data to an operator to allow the operator to re-orientate the measurement data so as visually to align the measurement data to the reference data.

33. A data processing apparatus according to claim 29, wherein the receiver is operable to receive reference data in each orientation of the component and the processor is operable to align the measurement data to the datum by determining from the respective reference data the relative orientations at which the measurement data were obtained, by transforming the measurement data to compensate for the relative orientations and by fitting the measurement data to the reference data.

34. A data processing apparatus according to claim 29, wherein the receiver is operable to receive reference data in each orientation of the component and the processor is operable to align the measurement data to the datum by determining from the respective reference data the relative orientations at which the measurement data were obtained, by transforming the measurement data to compensate for the relative orientations and by fitting the measurement data to the reference data using a least squares fitting procedure.

35. A data processing apparatus according to claim 29, wherein the processor is operable to cause respective profiles to be determined for different measurement paths across the surface and to determine at least one of a three dimensional form and an average two dimensional profile for the surface.

36. A data processing apparatus according to claim 29, wherein the processor is operable to remove the expected form from the profile or from three dimensional form to provide an indication of the error from an expected form.

37. A component support assembly for use with a metrological instrument according to claim 1, wherein the support comprises a stand to be mounted on a support base of the metrological instrument and a support platform rotatably mounted to the stand to enable orientation of the component to be changed.

38. A component support assembly according to claim 37, wherein the support platform is manually rotatable or tiltable to change the orientation of the component.

39. A component support assembly according to claim 37, wherein the support platform is rotatably mounted to the stand by a support member, the support platform is configured to receive the component with an axis of symmetry of the component perpendicular to a surface of the support platform and coincident with an axis about which the support platform is rotatable relative to support member.

41. A method of processing data provided by a metrological instrument in accordance with claim 1, the method comprising a data processor:

receiving reference data obtained by causing the measurement probe to follow a reference measurement path with the component in a first orientation, first measurement data obtained by causing the measurement probe to follow a first section of a measurement path along the surface with the component in a second orientation, and second measurement data obtained by causing the measurement probe to follow a second section of the measurement path along the surface with the component in a third orientation;

defining a datum using the reference data;

aligning the first measurement data to the datum to produce aligned first measurement data;

aligning the second measurement data to the datum to produce aligned second measurement data; and

using the aligned first and second measurement data to generate a surface profile of the surface of the component.

43. A signal carrying program instructions for programming a processor to become configured to provide data processing apparatus in accordance with claim 29.

44. A signal carrying program instructions for programming a processor of a metrological instrument to become configured to provide a metrological instrument in accordance with claim 1.

40. A method of determining a surface profile of a surface of a component, the method comprising:

effecting relative movement between a measurement probe and the component support to cause the measurement probe to follow a reference path with the component in a first orientation to obtain reference data indicating the displacement of the measurement probe as the measurement probe follows the changes in the reference path;

to cause the measurement probe to follow a first section of a measurement path along the surface with the component in a second orientation to obtain first measurement data indicating the displacement of the measurement probe as the measurement probe follows changes in the first section of the measurement path, and to cause the measurement probe to follow a second section of the measurement path along the surface with the component in a third orientation to obtain second measurement data indicating the displacement of the measurement probe as the measurement probe follows changes in the second section of the measurement path;

defining a datum using the reference data;

aligning the first measurement data to the datum to produce aligned first measurement data;

aligning the second measurement data to the datum to produce aligned second measurement data; and

using the aligned first and second measurement data to generate a surface profile of the surface of the component.

42. A signal carrying program instructions for programming a processor to carry out a method in accordance with claim 40.

45. A storage medium storing a signal in accordance with claim 42.

46. A metrological instrument for determining a surface profile of a surface of a component, the instrument comprising:

component support means for supporting a component;

moving means for effecting relative movement between measurement probe means and the component support means so that the measurement probe means follows changes in the surface in a direction perpendicular to the relative movement direction;

measuring means for providing measurement data indicating the displacement of the measurement probe means as the measurement probe means follows the changes in the surface;

orientation control means for controlling the orientation of the component;

measurement controlling means for controlling the moving means to cause;

the measurement probe means to follow a reference measurement path with the component in a first orientation so that the measuring means obtains reference data,

the measurement probe means to follow a first section of a measurement path along the surface with the component in a second orientation so that the measuring means obtains first measurement data, and

the measurement probe means to follow a second section of the measurement path along the surface with the component in a third orientation so that the measuring means obtains second measurement data; and

processing means for processing the measurement data, the processing means being operable to define a datum using the reference data;

to align the first measurement data to the datum to produce aligned first measurement data,

to align the second measurement data to the datum to produce aligned second measurement data, and then

to use the aligned first and second measurement data to generate a surface profile of the surface of the component.