Multilayer finite difference methods for electrical modeling of packages and printed circuit boards

• US 20100218145A1
• Filed: 08/02/2007
• Published: 08/26/2010
• Est. Priority Date: 08/02/2006
• Status: Active Grant

• Current Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Original Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Inventors: Swaminathan, Madhavan, Engin, Ege
• Granted Patent: US 7,895,540 B2
• Time in Patent Office: Days
• US Class Current: 716/130
• CPC Class Codes: G06F 2119/06 Power analysis or power optimisation
• CPC Class Codes: G06F 30/23 using finite element methods [FEM] or finite difference methods [FDM]

Abstract

Disclosed are exemplary finite difference methods for electromagnetically simulating planar multilayer structures. The exemplary finite difference methods simulate multilayer planes by combining the admittance matrices of single plane pairs and equivalent circuit models for such single plane pairs based on multilayer finite difference approximation. Based on the methods, coupling between different layers through electrically large apertures can be modeled very accurately and efficiently.

Claims

1. A method for electromagnetically simulating a planar multilayer structure, comprising:

providing a data file that defines the material properties and layout of each plane, transmission line and via of the planar multilayer structure;

defining a plurality of unit cells that each represent a portion of the planar multilayer structure and that includes all planes of the planar multilayer structure;

for each unit cell, processing the data associated with the cell to generate an individual equivalent circuit model for that cell using a multilayer finite difference method;

interconnecting the unit cells to create an overall circuit model for the planar multilayer structure;

processing the overall circuit model to obtain frequency or time domain responses for the planar multilayer structure.

2. The method recited in claim 1 wherein processing the overall circuit model comprises:

defining a matrix equation based upon the overall circuit model and simulation parameters for a desired simulation setup; and

solving the matrix equation to generate frequency or time domain responses for the planar multilayer structure.

3. The method recited in claim 1 processing the overall circuit model comprises:

defining simulation parameters for a desired simulation setup; and

processing the overall circuit model and the simulation parameters using a circuit solver to obtain frequency and time domain responses for the planar multilayer structure.

4. The method recited in claim 1 wherein interconnection of the unit cells is achieved by short circuiting adjacent unit cells of the overall circuit model to produce the overall circuit model.

5. The method recited in claim 1 wherein a multilayer finite difference approximation of the Helmholtz equation is used for each plane pair in the unit cell to obtain the parameters of the unit cell.

6. The method recited in claim 1 wherein processing the data to generate an individual equivalent circuit model comprises:

generating admittance matrices of single plane pairs of a planar multilayer structure;

generating equivalent circuit models for the single plane pairs to generate equivalent unit-cell models; and

generating a multilayered unit-cell model using a finite difference approximation that combines the unit-cell models and the admittance matrices of the single plane pairs.

7. The method recited in claim 1 further comprising:

processing data defining transmission line segments associated with each of the unit cells to generate transmission line models for each segment of the transmission line; and

connecting the transmission line models at common nodes of the overall multilayer circuit model.

8. The method recited in claim 7 wherein if the transmission line is a stripline, splitting the stripline into parallel-connected striplines and connecting the parallel-connected striplines to the common nodes.

9. The method recited in claim 7 wherein if the transmission line is a micro-stripline, connecting it to the common nodes of the multilayer circuit model.

10. The method recited in claim 1 further comprising:

generating fringe and gap models for the single plane pairs to take into account second-order effects; and

constructing a multilayered unit-cell model by combining unit-cell models of the single plane pairs along with the fringe and gap models.

11. The method recited in claim 1 further comprising:

generating via models for the single plane pairs; and

connecting the via models to common nodes to construct the multilayered unit-cell model.

12. The method recited in claim 1 wherein the approximation is either a 5-point approximation or a 9-point approximation.

13. Software for processing a data file that defines the material properties and layout of each plane, transmission line and via of a planar multilayer structure to electromagnetically simulate the planar multilayer structure, comprising:

a code segment that defines a plurality of unit cells that each represent a portion of the planar multilayer structure and that includes all planes of the planar multilayer structure;

a code segment that, for each unit cell, processes the data associated with the cell to generate an individual equivalent circuit model for that cell using a multilayer finite difference method;

a code segment that interconnects the unit cells to create an overall circuit model for the planar multilayer structure; and

a code segment that processes the overall circuit model to obtain frequency or time domain responses for the planar multilayer structure.

14. The software recited in claim 13 wherein the code segment that processes the overall circuit model to obtain frequency or time domain responses comprises:

a code segment that defines a matrix equation based upon the overall circuit model and simulation parameters for a desired simulation setup; and

a code segment that solves the matrix equation to generate frequency or time domain responses for the planar multilayer structure.

15. The software recited in claim 13 wherein the code segment that processes the overall circuit model to obtain frequency or time domain responses comprises:

a code segment that defines simulation parameters for a desired simulation setup; and

a code segment that processes the overall circuit model and the simulation parameters using a circuit solver to obtain frequency and time domain responses for the planar multilayer structure.

16. The software recited in claim 13 wherein the code segment that interconnects the unit cells comprises:

a code segment that interconnects the unit cells by short circuiting adjacent unit cells of the overall circuit model to produce the overall circuit model.

17. The software recited in claim 13 further comprising:

a code segment that generates admittance matrices of single plane pairs of a planar multilayer structure;

a code segment that generates equivalent circuit models for the single plane pairs to generate equivalent unit-cell models; and

a code segment that generates a multilayered unit-cell model using a finite difference approximation that combines the unit-cell models and the admittance matrices of the single plane pairs.

18. The software recited in claim 13 further comprising:

a code segment that processes data defining transmission line segments associated with each of the unit cells to generate transmission line models for each segment of the transmission line; and

a code segment that connects the transmission line models at common nodes of the overall multilayer circuit model.

19. The software recited in claim 13 further comprising:

a code segment that generates fringe and gap models for the single plane pairs to take into account second-order effects; and

a code segment that constructs a multilayered unit-cell model by combining unit-cell models of the single plane pairs along with the fringe and gap models.

20. The software recited in claim 13 further comprising:

a code segment that generates via models for the single plane pairs; and

a code segment that connects the via models to common nodes to construct the multilayered unit-cell model.