PACKAGED DEVICE AND PRODUCING METHOD THEREOF
First Claim
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1. A packaged device comprising:
- a device substrate including a first surface and a device formed in the device substrate; and
a packaging unit including an insulating layer facing the device substrate, the insulating layer including a second surface bonded to the first surface,wherein a metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface of the insulating layer on a side facing the device substrate, andan outline of the first surface is retreated inward from an outline of the second surface.
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Abstract
A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.
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Citations
8 Claims
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1. A packaged device comprising:
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a device substrate including a first surface and a device formed in the device substrate; and a packaging unit including an insulating layer facing the device substrate, the insulating layer including a second surface bonded to the first surface, wherein a metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface of the insulating layer on a side facing the device substrate, and an outline of the first surface is retreated inward from an outline of the second surface. - View Dependent Claims (2, 3, 4, 5)
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6. A method for fabricating a packaged device comprising:
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preparing a device substrate including a first surface and a device formed in the device substrate; preparing a packaging unit including an insulating layer with a second surface to be bonded to the first surface; and bonding the first surface and the second surface by a room-temperature bonding method, wherein the first surface and the second surface are bonded to each other such that an outline of the first surface is retreated inward from an outline of the second surface. - View Dependent Claims (7, 8)
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Specification