FIXTURE APPARATUS FOR LOW-TEMPERATURE AND LOW-PRESSURE SINTERING

• US 20100224674A1
• Filed: 03/03/2010
• Published: 09/09/2010
• Est. Priority Date: 03/04/2009
• Status: Abandoned Application

• Current Assignee: ABB Research Ltd. (ABB Ltd.)
• Original Assignee: ABB Research Ltd. (ABB Ltd.)
• Inventors: Hartmann, Samuel, LIU, Chunlei
• Application Number:
  US12/716,412
• Publication Number:
  US 20100224674A1
• Time in Patent Office: Days
• US Class Current: 228/212
• CPC Class Codes: B22F 3/003 Apparatus, e.g. furnaces in general F27B
• CPC Class Codes: B22F 7/062 involving the connection or repairing of preformed parts
• CPC Class Codes: H01L 21/67011 Apparatus for manufacture or treatment processes H01L21/30, H01L21/46; for production or after-treatment of single crystals or homogeneous polycrystalline material C30B35/00
• CPC Class Codes: H01L 2224/29139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/10253 Silicon [Si]

Abstract

The disclosure relates to bonding plural elements by sintering a bonding layer sandwiched between the elements. An exemplary embodiment includes a support frame; a clamping device; a reception region for receiving a stack including the plural elements, in-between which the bonding layer is arranged, wherein the stack is clamped when loaded into the reception region to permanently apply a sintering pressure. An exemplary method is also disclosed for bonding plural of elements using a sintering process. The method includes clamping the stack into a reception region of a fixture device, and applying heat to the stack and the bonding layer to perform a sintering process of the bonding layer.

Claims

1. Fixture apparatus for bonding plural elements by sintering a bonding layer between the elements, the apparatus comprising:

a support frame;

a clamping means; and

a reception region for receiving a stack having plural elements, in-between which a bonding layer is arranged, the clamping means clamping a stack when loaded into the reception region for permanently applying a sintering pressure.

2. Fixture apparatus according to claim 1, wherein the clamping means is configured to receive a stack biased with the sintering pressure, and for clamping the stack while maintaining the sintering pressure.

3. Fixture apparatus according to claim 1, wherein the support frame comprises:

a support portion; and

a pressure maintaining portion, wherein the sintering pressure is applied on the stack received in the reception region by assembling the support portion and the pressure maintaining portion, thereby biasing a force-applying element of the clamping means to provide the sintering pressure.

4. Fixture apparatus according to claim 3, comprising:

fastening means for fastening the support portion and the pressure maintaining portion.

5. Fixture apparatus according to claim 1, wherein the sintering pressure is between 1 MPa to 20 MPa.

6. Fixture apparatus according to claim 1, wherein the clamping means comprises:

a resilient element.

7. Fixture apparatus according to claim 1, wherein the clamping means comprises:

a stamp which includes a material having a thermal expansion coefficient which is higher than a thermal expansion coefficient of at least a portion of the support frame, such when the clamping means is heated, pressure is exposed to the stack loaded into the reception region due to a thermal expansion difference.

8. Fixture apparatus according to claim 1, wherein the clamping means comprises:

a cavity to receive a heater element for heating the clamping means, wherein the clamping means is configured for transferring the heat from the heater element to the stack via a stamp head which is formed by the end of the stamp applying pressure onto the stack.

9. Fixture apparatus according to claim 1, wherein the stamp is included in a stamp arrangement wherein the stamp is placed on the elements to be bonded, and wherein a biasing screw is associated with the stamp which can be tied into a corresponding opening in the support frame to pressure bias the stamp onto the stack.

10. Fixture apparatus according to claim 1, comprising:

a plurality of clamping means for performing the bonding of plural elements in the fixture apparatus.

11. Fixture apparatus according to claim 10, wherein the support frame is configured to hold a common substrate onto which the plural elements are to be bonded, wherein each of the plural elements are clamped by means of respective clamping means.

16. Fixture apparatus according to claim 4, wherein the fastening means include at least one of a server and a fastening bolt.

17. Fixture apparatus according to claim 4, wherein the sintering pressure is between 1 MPa to 20 MPa.

18. Fixture apparatus according to claim 17, wherein the clamping means comprises:

a resilient element.

19. Fixture apparatus according to claim 18, wherein the clamping means comprises:

a stamp which includes a material having a thermal expansion coefficient which is higher than a thermal expansion coefficient of at least a portion of the support frame, such when the clamping means is heated, pressure is exposed to the stack loaded into the reception region due to a thermal expansion difference.

20. Fixture apparatus according to claim 19, wherein the clamping means comprises:

a cavity to receive a heater element for heating the clamping means, wherein the clamping means is configured for transferring the heat from the heater element to the stack via a stamp head which is formed by the end of the stamp applying pressure onto the stack.

21. Fixture apparatus according to claim 20, wherein the stamp is included in a stamp arrangement wherein the stamp is placed on the elements to be bonded, and wherein a biasing screw is associated with the stamp which can be tied into a corresponding opening in the support frame to pressure bias the stamp onto the stack.

22. Fixture apparatus according to claim 21, comprising:

a plurality of clamping means for performing the bonding of plural elements in the fixture apparatus.

12. Method for bonding plural elements by a sintering process to produce a stack of elements, comprising:

clamping the stack into a reception region of a fixture apparatus which includes a support frame, a clamping means, and the reception region for receiving a stack having plural elements, in-between which a bonding layer is arranged, the clamping means clamping the stack when loaded into the reception region for permanently applying a sintering pressure; and

applying heat to the elements and the bonding layer to perform a sintering process of the bonding layer after the stack has been clamped to the reception region.

13. Method according to claim 12, comprising:

prior to or during the clamping of the stack into the reception region, applying a sintering pressure to the stack wherein, with the stack being clamped, the pressure on the stack is maintained.

14. Method according to claim 12, comprising:

clamping the stack to fixate the stack in the reception region wherein pressure is applied to the stack by applying heat to at least the clamping means, such that pressure is generated due to thermal expansion of the clamping means.

15. Method according to claim 12 comprising:

sintering the bonding layer to bond the plural elements in the stack, wherein the fixture apparatus is loaded with the stack and at least the clamping means of the fixture apparatus is heated at a sintering temperature.