SEMICONDUCTOR DEVICE

• US 20100224880A1
• Filed: 02/24/2010
• Published: 09/09/2010
• Est. Priority Date: 03/05/2009
• Status: Abandoned Application

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: KIMURA, Hajime
• Application Number:
  US12/711,661
• Publication Number:
  US 20100224880A1
• Time in Patent Office: Days
• US Class Current: 257/59
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1288 employing particular masking sequences or specially adapted masks, e.g. half-tone mask
• CPC Class Codes: H01L 29/45 Ohmic electrodes
• CPC Class Codes: H01L 29/458 for thin film silicon, e.g. source or drain electrode
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

It is an object to provide a semiconductor device with low wiring resistance, high transmittance, or a high aperture ratio. A gate electrode, a semiconductor layer, and a source electrode and a drain electrode are formed using a material having a light-transmitting property and a wiring such as a gate wiring or a source wiring is formed using a material whose resistivity is lower than that of the material having a light-transmitting property. Alternatively, the source wiring and/or the gate wiring are/is formed by a stack of a material having a light-transmitting property and a material whose resistivity is lower than that of the material having a light-transmitting property.

Claims

1. A semiconductor device comprising:

a first electrode comprising a first conductive layer having a light-transmitting property;

a first wiring electrically connected to the first electrode and comprising a layered structure of the first conductive layer and a second conductive layer wherein electrical resistance of the second conductive layer is lower than electrical resistance of the first conductive layer;

an insulating layer formed over the first electrode and the first wiring;

a second electrode formed over the insulating layer and comprising a third conductive layer having a light-transmitting property;

a second wiring electrically connected to the second electrode and comprising a layered structure of the third conductive layer and a fourth conductive layer wherein electrical resistance of the fourth conductive layer is lower than electrical resistance of the third conductive layer;

a third electrode comprising a fifth conductive layer having a light-transmitting property; and

a semiconductor layer formed over the second electrode and the third electrode and overlapped with the first electrode with the insulating layer interposed therebetween.

2. The semiconductor device according to claim 1, wherein a pixel electrode is electrically connected to the third electrode.

3. The semiconductor device according to claim 1, wherein a part of the semiconductor layer is between the third conductive layer and the fourth conductive layer.

4. The semiconductor device according to claim 1,

wherein a light-shielding property of the second conductive layer is higher than a light-shielding property of the first conductive layer, and

wherein a light-shielding property of the fourth conductive layer is higher than a light-shielding property of the third conductive layer.

5. The semiconductor device according to claim 1, wherein the second conductive layer and the fourth conductive layer each comprise at least one metal material selected from the group consisting of aluminum (Al), tungsten (W), titanium (Ti), tantalum (Ta), molybdenum (Mo), nickel (Ni), platinum (Pt), copper (Cu), gold (Au), silver (Ag), manganese (Mn), and neodymium (Nd), or a compound, an alloy, or nitride of the above metal.

6. The semiconductor device according to claim 1, wherein the semiconductor layer has a light-transmitting property.

7. The semiconductor device according to claim 1, wherein the semiconductor layer is an oxide semiconductor layer.

8. A semiconductor device comprising:

a first electrode comprising a first conductive layer having a light-transmitting property;

a first wiring electrically connected to the first electrode and comprising a layered structure of the first conductive layer and a second conductive layer wherein electrical resistance of the second conductive layer is lower than electrical resistance of the first conductive layer;

a second wiring comprising a third conductive layer having a light-transmitting property;

an insulating layer formed over the first electrode, the first wiring, and the second wiring;

a second electrode formed over the insulating layer and comprising a fourth conductive layer having a light-transmitting property;

a third wiring electrically connected to the second electrode and comprising a layered structure of the fourth conductive layer and a fifth conductive layer wherein electrical resistance of the fifth conductive layer is lower than electrical resistance of the fourth conductive layer;

a third electrode comprising a sixth conductive layer having a light-transmitting property;

a seventh conductive layer having a light-transmitting property provided over the second wiring with the insulating layer interposed therebetween; and

a semiconductor layer formed over the second electrode and the third electrode and overlapped with the first electrode with the insulating layer interposed therebetween.

9. The semiconductor device according to claim 8, wherein a pixel electrode is electrically connected to the third electrode.

10. The semiconductor device according to claim 8,

wherein the second wiring is formed in a region overlapped with the third wiring, and

wherein the second wiring comprises a layered structure of the third conductive layer and a conductive layer whose electrical resistance is lower than that of the third conductive layer.

11. The semiconductor device according to claim 8, wherein the seventh conductive layer is electrically connected to a pixel electrode.

12. The semiconductor device according to claim 8,

wherein the seventh conductive layer is electrically connected to a pixel electrode through a contact hole;

and

wherein the second wiring is formed in a region overlapped with the contact hole and comprises a layered structure of the third conductive layer and a conductive layer whose electrical resistance is lower than that of the third conductive layer.

13. The semiconductor device according to claim 8, wherein a part of the semiconductor layer is between the fourth conductive layer and the fifth conductive layer.

14. The semiconductor device according to claim 8, wherein the second conductive layer and the fifth conductive layer have a light-shielding property.

15. The semiconductor device according to claim 8, wherein the second conductive layer and the fifth conductive layer each comprise at least one metal material selected from the group consisting of aluminum (Al), tungsten (W), titanium (Ti), tantalum (Ta), molybdenum (Mo), nickel (Ni), platinum (Pt), copper (Cu), gold (Au), silver (Ag), manganese (Mn), and neodymium (Nd), or a compound, an alloy, or nitride of the above metal.

16. The semiconductor device according to claim 8, wherein the semiconductor layer has a light-transmitting property.

17. The semiconductor device according to claim 8, wherein the semiconductor layer is an oxide semiconductor layer.

18. A semiconductor device comprising:

a gate electrode comprising a first conductive layer having a light-transmitting property;

a gate wiring electrically connected to the gate electrode and comprising a layered structure of the first conductive layer and a second conductive layer wherein electrical resistance of the second conductive layer is lower than electrical resistance of the first conductive layer;

a first insulating layer formed over the gate electrode and the gate wiring;

a first electrode formed over the first insulating layer and comprising a third conductive layer having a light-transmitting property;

a source wiring electrically connected to the first electrode and comprising a layered structure of the third conductive layer and a fourth conductive layer wherein electrical resistance of the fourth conductive layer is lower than electrical resistance of the third conductive layer;

a second electrode comprising a fifth conductive layer having a light-transmitting property;

a semiconductor layer formed over the first electrode and the second electrode and overlapped with the gate electrode with the first insulating layer interposed therebetween;

a second insulating layer formed over the first electrode, the second electrode, and the semiconductor layer; and

a pixel electrode formed over the second insulating layer and electrically connected to the second electrode.

19. The semiconductor device according to claim 18, further comprising a capacitor wiring comprising a sixth conductive layer having a light-transmitting property wherein the first insulating layer is formed over the capacitor wiring.

20. The semiconductor device according to claim 18,

wherein a capacitor wiring is formed in a region overlapped with the source wiring, and

wherein the capacitor wiring comprises a layered structure of a sixth conductive layer having a light-transmitting property and a conductive layer whose electrical resistance is lower than that of the sixth conductive layer.

21. The semiconductor device according to claim 19, further comprising a seventh conductive layer having a light-transmitting property provided over the capacitor wiring with the first insulating layer interposed therebetween wherein the seventh conductive layer is electrically connected to the pixel electrode.

22. The semiconductor device according to claim 19, further comprising a seventh conductive layer electrically connected to the pixel electrode through a contact hole,

wherein the capacitor wiring is formed in a region overlapped with the contact hole and comprises a layered structure of the sixth conductive layer and a conductive layer whose electrical resistance is lower than that of the sixth conductive layer.

23. The semiconductor device according to claim 18, wherein a part of the semiconductor layer is between the third conductive layer and the fourth conductive layer.

24. The semiconductor device according to claim 18, wherein the second conductive layer and the fifth conductive layer have a light-shielding property.

25. The semiconductor device according to claim 18, wherein the second conductive layer and the fourth conductive layer each comprise at least one metal material selected from the group consisting of aluminum (Al), tungsten (W), titanium (Ti), tantalum (Ta), molybdenum (Mo), nickel (Ni), platinum (Pt), copper (Cu), gold (Au), silver (Ag), manganese (Mn), and neodymium (Nd), or a compound, an alloy, or nitride of the above metal.

26. The semiconductor device according to claim 18, wherein the semiconductor layer has a light-transmitting property.

27. The semiconductor device according to claim 18, wherein the semiconductor layer is an oxide semiconductor layer.