LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

• US 20100224903A1
• Filed: 07/23/2008
• Published: 09/09/2010
• Est. Priority Date: 07/25/2007
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Cho, Bum Chul, Park, Jin Soo
• Granted Patent: US 8,624,268 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.

Claims

1. A light emitting device package comprising:

a substrate comprising a plurality of protrusions;

an insulating layer on the substrate;

a metal layer on the insulating layer; and

a light emitting device that is installed on the substrate and electrically connected to the metal layer.

2. The light emitting device package according to claim 1, wherein the substrate includes a recess and the plurality of the protrusions are formed in the recess.

3. The light emitting device package according to claim 2, wherein the light emitting device is installed on a bottom surface of the recess.

4. The light emitting device package according to claim 3, wherein the bottom surface of the recess has a planar region on which the light emitting device is installed.

5. The light emitting device package according to claim 2, wherein a side surface of the recess is an inclined surface.

6. The light emitting device package according to claim 1, wherein the light emitting device is electrically connected to the metal layer by contacting the metal layer.

7. The light emitting device package according to claim 1, wherein the light emitting device is electrically connected to the metal layer by a wire.

8. The light emitting device package according to claim 1, wherein the substrate includes silicon.

9. The light emitting device package according to claim 1, wherein the metal layer includes silver or aluminum.

10. The light emitting device package according to claim 1, wherein the insulating layer is a silicon oxide layer.

11. The light emitting device package according to claim 2, wherein the plurality of the protrusions are formed on at least one of bottom and side surfaces of the recess.

12. The light emitting device package according to claim 1, wherein the plurality of the protrusions are fanned on at least a portion of the substrate except for a portion where the light emitting device is installed.

13. A light emitting device package comprising:

a substrate having a recess and a plurality of protrusions formed on at least one of bottom and side surfaces of the recess;

an insulating layer on the substrate;

a metal layer on the insulating layer; and

a light emitting device that is installed on the recess and electrically connected to the metal layer.

14. The light emitting device package according to claim 13, wherein the plurality of the protrusions are formed on the bottom surface of the recess except for a portion where the light emitting device is installed.

15. The light emitting device package according to claim 13, wherein the insulating layer is formed along a surface of the substrate, the metal layer includes first and second metal layers that are electrically separated from each other, and the side surface of the recess is an inclined surface.

16. The light emitting device package according to claim 13, wherein the light emitting device has at least one electrode that is directly and electrically connected to the metal layer or two electrodes that are electrically connected to the metal layer by wires.

17-20. -20. (canceled)

21. A light emitting device package, comprising:

a substrate including a recess having a plurality of protrusions;

a conductive layer covering the plurality of protrusions; and

a light emitting device on the substrate and electrically connected to the conductive layer via at least one wire,

wherein the light emitting device is configured to emit light in at least a direction toward the plurality of protrusions such that the plurality of protrusions reflect light in an upward direction away from the substrate, and

wherein the plurality of protrusions are on an upper surface of the substrate at outside portions of the light emitting device.

22. The light emitting device package according to claim 21, wherein the light emitting device is installed on a bottom surface of the recess, and

wherein the plurality of protrusions are not underneath the light emitting device.

23. The light emitting device package according to claim 21, wherein a side surface of the recess is an inclined surface.

24. The light emitting device package according to claim 23, wherein the plurality of protrusions are additionally on the inclined side surfaces of the recess.

25. The light emitting device package according to claim 21, wherein the plurality of protrusions are not on the inclined surfaces of the recess.