Magnetic Film Enhanced Inductor

• US 20100225435A1
• Filed: 03/04/2009
• Published: 09/09/2010
• Est. Priority Date: 03/04/2009
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Kang, Seung H., Nowak, Matthew, Li, Xia, Henderson, Brian Matthew
• Granted Patent: US 9,190,201 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0053 with means to reduce eddy currents
• CPC Class Codes: H01F 2017/0066 with a magnetic layer
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 41/14 for applying magnetic films to substrates
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated magnetic film enhanced inductor and a method of forming an integrated magnetic film enhanced inductor are disclosed. The integrated magnetic film enhanced inductor includes an inductor metal having a first portion and a second portion, a top metal or bottom metal coupled to the inductor metal, and an isolation film disposed one of in, on, and adjacent to at least one of the first portion and the second portion of the inductor metal. The isolation film includes a magnetic material, such as a magnetic film.

Claims

1. An inductor comprising:

an inductor metal having a first portion and a second portion; and

an isolation film disposed one of in, on, and adjacent to at least one of the first portion and the second portion of the inductor metal,

wherein the isolation film includes a magnetic material.

2. The inductor according to claim 1, wherein the isolation film interposes the first portion and the second portion of the inductor metal.

3. The inductor according to claim 1, wherein the isolation film is one of in, on, and adjacent to a sidewall of the at least one of the first portion and the second portion of the inductor metal.

4. The inductor according to claim 1, wherein the magnetic material is a magnetic film.

5. The inductor according to claim 1, wherein the magnetic material is a shape anisotropic magnetic film.

6. The inductor according to claim 1, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

7. The inductor according to claim 1, wherein the inductor is a serpent type inductor.

8. The inductor according to claim 1, wherein the inductor is a circular type inductor.

9. The inductor according to claim 1, further comprising:

a top metal or bottom metal coupled to the inductor metal.

10. The inductor according to claim 1, further comprising:

a circuit coupled to the inductor metal.

11. The inductor according to claim 1 integrated in at least one semiconductor die.

12. The inductor according to claim 1, further comprising an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.

13. An inductor comprising:

a substrate;

an inductor metal having a plurality of turns formed on the substrate; and

a magnetic material one of in, on, and adjacent to a portion of the inductor metal.

14. The inductor according to claim 13, wherein the magnetic material is disposed between adjacent portions of the plurality of turns of the inductor metal.

15. The inductor according to claim 13, wherein the isolation film is one of in, on, and adjacent to a sidewall of the at least one of the first portion and the second portion of the inductor metal.

16. The inductor according to claim 13, wherein the magnetic material is a magnetic film.

17. The inductor according to claim 13, wherein the magnetic material is a shape anisotropic magnetic film.

18. The inductor according to claim 13, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

19. The inductor according to claim 13, wherein the inductor is a serpent type inductor.

20. The inductor according to claim 13, wherein the inductor is a circular type inductor.

21. The inductor according to claim 13, further comprising:

a top metal or a bottom metal coupled to the inductor metal.

22. The inductor according to claim 13, further comprising:

a circuit coupled to the inductor metal.

23. The inductor according to claim 13 integrated in at least one semiconductor die.

24. The inductor according to claim 13, further comprising an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.

25. A method of forming an inductor, the method comprising:

depositing and patterning an inductor metal having a first portion and a second portion; and

depositing and patterning a magnetic material one of in, on, and adjacent to at least one of the first portion and the second portion of the inductor metal.

26. The method according to claim 25, wherein the magnetic material is deposited and patterned between the first portion and the second portion of the inductor metal.

27. The method according to claim 25, wherein the magnetic material is deposited and patterned one of in, on, and adjacent to a sidewall of the at least one of the first portion and the second portion of the inductor metal.

28. The method according to claim 25, wherein the magnetic material is a magnetic film.

29. The method according to claim 25, wherein the magnetic material is a shape anisotropic magnetic film.

30. The method according to claim 25, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

31. The method according to claim 25, further comprising:

performing a magnetic anneal process to align a magnetic field axis of the inductor along an easy axis of the magnetic material.

32. The method according to claim 25, further comprising:

depositing a cap layer on the inductor metal as a hardmask to self-align the magnetic material between the first portion and the second portion of the inductor metal.

33. The method according to claim 25, further comprising:

forming a bottom metal that is coupled to the inductor metal; and

forming a top metal that is coupled to the inductor metal

34. The method according to claim 25, wherein the inductor is applied in an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.

35. A method of forming an inductor, the method comprising:

depositing and patterning a bottom metal using a metal deposit/photo/etching process;

depositing a first inter layer dielectric (ILD) on the first metal and performing a chemical mechanical planarization (CMP) process on the inter layer dielectric;

depositing a bottom cap film on the first inter layer dielectric (ILD);

depositing an inductor metal on the bottom cap film and patterning the inductor metal using a photo/etching process;

depositing a top cap film above the inductor metal and performing a chemical mechanical planarization (CMP) process on the top cap film;

performing a photo/etching process to the top cap film to form a hole one of in, on, and adjacent to a first portion of the inductor metal;

depositing a magnetic material over the top cap film and the hole and etching the magnetic material back to a top of the top cap film such that the magnetic material is one of in, on, and adjacent to the first portion of the inductor metal;

depositing a second inter layer dielectric (ILD) above the magnetic material and performing a chemical mechanical planarization (CMP) process on the second inter layer dielectric (ILD); and

performing a vertical magnetic anneal to align a magnetic field axis of the inductor along an easy axis of the magnetic material.

36. The method according to claim 35, wherein the photo/etching process forms the hole between the first portion of the inductor metal and a second portion of the inductor metal, and

wherein the magnetic material is deposited over the top cap film and the hole and etched back to the top of the top cap film such that the magnetic material is between the first portion and the second portion of the inductor metal.

37. The method according to claim 35, wherein the photo/etching process forms a plurality of holes one of in, on, and adjacent to the first portion of the inductor metal, and

wherein the magnetic material is deposited over the top cap film and the plurality of holes and etched back to the top of the top cap film.

38. The method according to claim 35, wherein the photo/etching process forms a plurality of holes between the first portion of the inductor metal and a second portion of the inductor metal, and

wherein the magnetic material is deposited over the top cap film and the plurality of holes and etched back to the top of the top cap film such that the magnetic material is between the first portion and the second portion of the inductor metal.

39. The method according to claim 35, further comprising:

patterning a first via opening in the first inter layer dielectric (ILD) using a photo/etching process and filling the first via opening with a metal to form a bottom via interconnect that couples the inductor metal to the bottom metal.

40. The method according to claim 35, further comprising:

depositing and patterning a top metal above the second inter layer dielectric (ILD) using a metal deposit/photo/etching process; and

patterning a second via opening in the second inter layer dielectric (ILD) using a photo/etching process and filling the second via opening with a metal to form a top via interconnect that couples the inductor metal to the top metal.

41. The method according to claim 35, wherein the magnetic material is a magnetic film.

42. The method according to claim 35, wherein the magnetic material is a shape anisotropic magnetic film.

43. The method according to claim 35, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

44. The method according to claim 35, wherein the inductor is applied in an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.

45. A method of forming an integrated magnetic film enhanced inductor, the method comprising:

depositing and patterning a bottom metal using a dual damascene process;

depositing a first inter layer dielectric (ILD) on the first metal;

depositing a bottom cap film on the first inter layer dielectric (ILD);

depositing a second inter layer dielectric (ILD) on the bottom cap film;

forming a trench in the second inter layer dielectric (ILD) using photolithography and etching techniques;

plating a copper layer over at least the trench and polishing the copper layer down to the surface of the second inter layer dielectric (ILD) to form an inductor metal;

depositing a top cap film above the second inter layer dielectric (ILD) and the inductor metal and polishing the top cap film;

forming a hole in the top cap film and the second inter layer dielectric (ILD) using photolithography and etching techniques;

depositing a magnetic material layer over at least the hole;

depositing a third inter layer dielectric (ILD) above the magnetic material and performing a chemical mechanical planarization (CMP) process on the third inter layer dielectric (ILD); and

performing a magnetic anneal to align a magnetic field axis of the inductor along an easy axis of the magnetic material.

46. The method according to claim 45, comprising:

forming a plurality of trenches in the second inter layer dielectric (ILD) using the photolithography and etching techniques;

plating the copper layer over at least the plurality of trenches and polishing the copper layer down to the surface of the second inter layer dielectric (ILD) to form the inductor metal;

forming a plurality of holes in the top cap film and the second inter layer dielectric (ILD) using the photolithography and etching techniques;

depositing the magnetic material layer over at least the plurality of holes.

47. The method according to claim 45, further comprising:

patterning a first via opening in the first inter layer dielectric (ILD) using a photo/etching process and filling the first via opening with a metal to form a bottom via interconnect that couples the inductor metal to the bottom metal by a dual damascene process.

48. The method according to claim 45, further comprising:

plating and patterning a top metal above the third inter layer dielectric (ILD) using a dual damascene process; and

patterning a second via opening in the third inter layer dielectric (ILD) using a photo/etching process and filling the second via opening with a metal to form a top via interconnect that couples the inductor metal to the top metal.

49. The method according to claim 45, wherein the magnetic material is a magnetic film.

50. The method according to claim 45, wherein the magnetic material is a shape anisotropic magnetic film.

51. The method according to claim 45, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

52. The method according to claim 45, wherein the inductor is applied in an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.

53. An inductor comprising:

inductive means for generating a magnetic field, the inductive means having a first portion and a second portion; and

isolating means for magnetically isolating at least one of the first portion and the second portion of the inductive means, the isolating means disposed one of in, on, and adjacent to the at least one of the first portion and the second portion of the inductive means,

wherein the isolation means includes a magnetic material.

54. The inductor according to claim 53, wherein the isolating means interposes the first portion and the second portion of the inductive means.

55. The inductor according to claim 53, wherein the isolating means is one of in, on, and adjacent to a sidewall of the at least one of the first portion and the second portion of the indcutive means.

56. The inductor according to claim 53, wherein the magnetic material is a magnetic film.

57. The inductor according to claim 53, wherein the magnetic material is a shape anisotropic magnetic film.

58. The inductor according to claim 53, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

59. The inductor according to claim 53, wherein the inductor is a serpent type inductor.

60. The inductor according to claim 53, wherein the inductor is a circular type inductor.

61. The inductor according to claim 53, further comprising:

first and second electrode means for electrically connecting the inductor coupled to the inductive means.

62. The inductor according to claim 53 integrated in at least one semiconductor die.

63. The inductor according to claim 53, further comprising an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.

64. A method of forming an inductor, the method comprising:

step for forming an inductor metal having a first portion and a second portion; and

step for forming a magnetic material one of in, on, and adjacent to at least one of the first portion and the second portion of the inductor metal.

65. The method according to claim 64, wherein the magnetic material is deposited and patterned between the first portion and the second portion of the inductor metal.

66. The method according to claim 64, wherein the magnetic material is deposited and patterned one of in, on, and adjacent to a sidewall of the at least one of the first portion and the second portion of the inductor metal.

67. The method according to claim 64, wherein the magnetic material is a magnetic film.

68. The method according to claim 64, wherein the magnetic material is a shape anisotropic magnetic film.

69. The method according to claim 64, wherein a thickness of the magnetic material is selected to reduce an eddy current and a skin effect inside the magnetic material to reduce magnetic field loss.

70. The method according to claim 64, further comprising:

performing a magnetic anneal process to align a magnetic field axis of the inductor along an easy axis of the magnetic material.

71. The method according to claim 64, further comprising:

step for depositing a cap layer on the inductor metal as a hardmask to self-align the magnetic material between the first portion and the second portion of the inductor metal.

72. The method according to claim 64, further comprising:

step for forming a bottom metal that is coupled to the inductor metal; and

step for forming a top metal that is coupled to the inductor metal

73. The method according to claim 64, wherein the inductor is applied in an electronic device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the inductor is integrated.