METHOD AND SYSTEM FOR AN ON-CHIP AND/OR AN ON-PACKAGE TRANSMIT/RECEIVE SWITCH AND ANTENNA

• US 20100225557A1
• Filed: 03/03/2009
• Published: 09/09/2010
• Est. Priority Date: 03/03/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Sponsoring Entity: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• GRANTED PATENT: US 8,238,842 B2
• Time in USPTO: 0 Days
• US Class Current: 343/860
• CPC Class Codes: H01L 2223/6677 : for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 3/30 : varying the relative phase between the radiating elements of an array H01Q3/2605, H01Q3/2658, H01Q3/2682, H01Q3/44 take precedence
• CPC Class Codes: H01Q 3/34 : by electrical means active lenses or reflecting arrays H01Q3/46
• CPC Class Codes: H04B 1/48 : in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter H04B1/46 takes precedence

Abstract

Methods and systems for an on-chip and/or on-package T/R switch and antenna are disclosed and may include selectively coupling one or more low noise amplifiers (LNAs) and/or one or more power amplifiers (PAs) to one or more ports of a multi-port distributed antenna utilizing configurable transmit/receive (T/R) switches integrated on a chip with the LNAs and PAs. The LNAs and PAs may be impedance matched to the antenna by coupling them to a port based on a characteristic impedance at the port. The T/R switches may be integrated on a package to which the chip may be coupled. The signals transmitted and received by the antenna may be time division duplexed. The antenna, which may include a microstrip antenna, may be integrated on the chip or the package. The LNA and the PA may be coupled to different ports on the antenna via the T/R switches.

Claims

1. . A method for communication, the method comprising:

in a wireless device, configuring one or more transmit/receive (T/R) switches, which are integrated on a chip with a plurality of low noise amplifiers (LNAs) and a plurality of power amplifiers (PAs), to selectively couple one or more of said plurality of LNAs and/or one or more of said plurality of PAs to one or more of a plurality of ports of a multi-port distributed antenna.

2. . The method according to claim 1, comprising impedance matching said selectively coupled one of said plurality of LNAs and said plurality of PAs to said multi-port distributed antenna by coupling said one or more of said plurality of LNAs and said plurality of PAs to said one or more of said plurality of ports based on a characteristic impedance of said multi-port distributed antenna at said one or more of said plurality of ports.

3. . The method according to claim 1, wherein said T/R switch is integrated on a package, and said chip is bonded to said package.

4. . The method according to claim 1, wherein said T/R switch comprises CMOS switches.

5. . The method according to claim 1, comprising time division duplexing signals transmitted and received by said multi-port distributed antenna.

6. . The method according to claim 5, wherein said signals comprise RF signals.

7. . The method according to claim 1, wherein said multi-port distributed antenna is integrated on said chip with said LNAs and PAs.

8. . The method according to claim 1, wherein said multi-port distributed antenna is integrated on a package, and said chip is bonded to said package.

9. . The method according to claim 1, wherein said multi-port distributed antenna comprises a microstrip antenna.

10. . The method according to claim 1, comprising coupling said one or more of said plurality of LNAs and said one or more of said plurality of PAs to different ports on said multi-port distributed antenna via said T/R switch.

11. . A system for enabling communication, the system comprising:

one or more circuits comprising a plurality of low noise amplifiers (LNAs) and a plurality of power amplifiers (PAs), said one or more circuits integrated on a chip,

wherein;

said one or more circuits are operable to configure one or more transmit/receive (T/R) switches, which are integrated on a chip with said plurality of low noise amplifiers (LNAs) and said plurality of power amplifiers (PAs), to selectively couple one or more of said plurality of LNAs and/or one or more of said plurality of PAs to one or more of a plurality of ports of a multi-port distributed antenna.

12. . The system according to claim 11, wherein said one or more circuits are operable to impedance match said selectively coupled one or more of said plurality of LNAs and said plurality of PAs to said multi-port distributed antenna by coupling said one or more of said plurality of LNAs and said plurality of PAs to said one or more of a plurality of ports based on a characteristic impedance of said multi-port distributed antenna at said one or more of said plurality of ports.

13. . The system according to claim 11, wherein said T/R switch is integrated on a package, and said chip is bonded to said package.

14. . The system according to claim 11, wherein said T/R switch comprises CMOS switches.

15. . The system according to claim 11, wherein said one or more circuits are operable to time division duplex signals transmitted and received by said multi-port distributed antenna.

16. . The system according to claim 15, wherein said signals comprise RF signals.

17. . The system according to claim 11, wherein said multi-port distributed antenna is integrated on said chip with said LNAs and PAs.

18. . The system according to claim 11, wherein said multi-port distributed antenna is integrated on a package, and said chip is bonded to said package.

19. . The system according to claim 11, wherein said multi-port distributed antenna comprises a microstrip antenna.

20. . The system according to claim 11, wherein said one or more circuits are operable to couple said one of said plurality of LNAs and said one of said plurality of PAs to different ports on said multi-port distributed antenna via said T/R switch.