×

SUBSTRATE PROCESSING APPARATUS

  • US 20100229795A1
  • Filed: 03/03/2010
  • Published: 09/16/2010
  • Est. Priority Date: 03/10/2009
  • Status: Abandoned Application
First Claim
Patent Images

1. A substrate processing apparatus comprising:

  • a process chamber configured to process a substrate;

    a heating member configured to heat the substrate;

    a coating gas supply member including a coating gas supply nozzle configured to supply coating gas into the process chamber;

    a film-forming gas supply member including a film-forming gas supply nozzle configured to supply film-forming gas into the process chamber; and

    a control unit configured to control the heating member, the coating gas supply member, and the film-forming gas supply member,wherein the control unit executes a control such that the coating gas supply nozzle supplies the coating gas to coat a quartz member in the process chamber and the film-forming gas supply nozzle supplies the film-forming gas to form an epitaxial film on the substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×