Leadframe package for light emitting diode device
First Claim
Patent Images
1. An LED leadframe package comprising:
- a heat dissipation base;
a plurality of electrodes disposed around the heat dissipation base;
a supporter surrounding and fixing the heat dissipation base and the plurality of electrodes;
at least two ring-shaped structures protruding upward formed around a top surface of the supporter; and
at least one ring-shaped groove formed between the at least two ring-shaped structures.
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Abstract
An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
23 Citations
21 Claims
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1. An LED leadframe package comprising:
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a heat dissipation base; a plurality of electrodes disposed around the heat dissipation base; a supporter surrounding and fixing the heat dissipation base and the plurality of electrodes; at least two ring-shaped structures protruding upward formed around a top surface of the supporter; and at least one ring-shaped groove formed between the at least two ring-shaped structures. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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2-8. -8. (canceled)
Specification