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Leadframe package for light emitting diode device

  • US 20100230708A1
  • Filed: 03/10/2009
  • Published: 09/16/2010
  • Est. Priority Date: 03/10/2009
  • Status: Active Grant
First Claim
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1. An LED leadframe package comprising:

  • a heat dissipation base;

    a plurality of electrodes disposed around the heat dissipation base;

    a supporter surrounding and fixing the heat dissipation base and the plurality of electrodes;

    at least two ring-shaped structures protruding upward formed around a top surface of the supporter; and

    at least one ring-shaped groove formed between the at least two ring-shaped structures.

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