MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS
First Claim
1. An apparatus, comprising:
- a primary illumination system configured to produce an intensity distribution of projection light in a mask plane;
a projection objective comprising a lens; and
a correction optical system, comprising;
a secondary illumination system configured to produce an intensity distribution of correction light in a reference surface; and
a correction element comprising a heating material, the correction element being in a plane that is at least substantially optically conjugate to the reference surface so that the correction light and the projection light pass through the lens of the projection objective before they impinge on the correction element,wherein all lenses through which both the correction light and the projection light pass comprise one or more lens materials having a lower coefficient of absorption for the correction light than the heating material, and the apparatus is a microlithographic projection exposure apparatus.
2 Assignments
0 Petitions
Accused Products
Abstract
A microlithographic projection exposure apparatus includes a primary illumination system producing projection light, a projection objective and a correction optical system. The correction optical system includes a secondary illumination system, which produces an intensity distribution of correction light in a reference surface, and a correction element which includes a heating material and is arranged in a plane that is at least substantially optically conjugate to the reference surface such that the correction light and the projection light pass through at least one lens contained in the projection objective before they impinge on the correction element. All lenses through which both the correction light and the projection light pass are made of a lens material which has a lower coefficient of absorption for the correction light than the heating material contained in the correction element.
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Citations
36 Claims
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1. An apparatus, comprising:
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a primary illumination system configured to produce an intensity distribution of projection light in a mask plane; a projection objective comprising a lens; and a correction optical system, comprising; a secondary illumination system configured to produce an intensity distribution of correction light in a reference surface; and a correction element comprising a heating material, the correction element being in a plane that is at least substantially optically conjugate to the reference surface so that the correction light and the projection light pass through the lens of the projection objective before they impinge on the correction element, wherein all lenses through which both the correction light and the projection light pass comprise one or more lens materials having a lower coefficient of absorption for the correction light than the heating material, and the apparatus is a microlithographic projection exposure apparatus. - View Dependent Claims (2, 3, 4, 5, 11, 12, 14, 15, 16, 17, 19, 20, 22, 23, 29)
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- 6. (canceled)
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7. (canceled)
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8. (canceled)
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10. (canceled)
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13. (canceled)
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18. (canceled)
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21. (canceled)
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24. (canceled)
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25. (canceled)
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26. (canceled)
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27. (canceled)
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28. (canceled)
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30. (canceled)
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31. An apparatus, comprising:
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a projection objective comprising a lens; and a correction optical system, comprising; a light modulator system configured to produce a variable intensity distribution of correction light in a reference surface; and a correction element in a plane that is at least substantially optically conjugate to the reference surface so that the correction light and the projection light pass through the lens of the projection objective before they impinge on the correction element, wherein the apparatus is a microlithographic projection exposure apparatus. - View Dependent Claims (33)
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32. (canceled)
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34. A method, comprising:
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producing an intensity distribution of correction light in a reference surface; imaging the reference surface onto a correction element in a projection objective of a microlithographic projection exposure apparatus, wherein both projection light of the microlithographic projection exposure apparatus and the correction light pass through at least one lens of the projection objective before they impinge on the correction element, and the correction light is more strongly absorbed in the correction element than in any lens through which both the correction light and the projection light pass.
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35. (canceled)
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36. (canceled)
Specification