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SUPER CAPACITOR CASING AND SUPERCAPACITOR EMBEDDED DEVICE

  • US 20100232124A1
  • Filed: 02/26/2010
  • Published: 09/16/2010
  • Est. Priority Date: 03/10/2009
  • Status: Active Grant
First Claim
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1. A casing, comprising:

  • a first case portion having a first plurality of through holes on a first surface thereof, the first case portion disposed on a second case portion to form a groove therebetween, the second case portion having a second plurality of through holes corresponding to respective ones of the first plurality of through holes, the groove configured to removably receive a solid state device (SSD) module therein;

    at least one super capacitor disposed on at least one of the first case portion and the second case portion; and

    a case mating medium disposed through each corresponding set of the first and second plurality of through holes to electrically connect the SSD module and the at least one super capacitor.

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