ELECTRONIC DEVICES FORMED OF TWO OR MORE SUBSTRATES BONDED TOGETHER, ELECTRONIC SYSTEMS COMPRISING ELECTRONIC DEVICES AND METHODS OF MAKING ELECTRONIC DEVICES
First Claim
1. An electronic device, comprising:
- a first substrate comprising circuitry including a plurality of conductive traces extending at least substantially parallel to each other through a portion of the first substrate, a plurality of bond pads positioned on a surface of the first substrate and comprising a width extending over at least two of the plurality of conductive traces, and a plurality of vias extending from adjacent at least some conductive traces of the plurality of conductive traces to bond pads of the plurality of bond pads;
a second substrate bonded to the first substrate, the second substrate comprising circuitry coupled to the plurality of bond pads on the first substrate with a plurality of conductive bumps.
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0 Petitions
Accused Products
Abstract
Electronic devices comprise a first substrate and a second substrate. The first substrate comprises circuitry including a plurality of conductive traces at least substantially parallel to each other through at least a portion of the first substrate. A plurality of bond pads are positioned on a surface of the first substrate and comprise a width extending over at least two of the plurality of conductive traces. A plurality of vias extend from adjacent at least some of the conductive traces to the plurality of bond pads. The second substrate is bonded to the first substrate and comprises circuitry coupled to the plurality of bond pads on the first substrate with a plurality of conductive bumps. Memory devices and related methods of forming electronic devices and memory devices are also disclosed, as are electronic systems.
31 Citations
25 Claims
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1. An electronic device, comprising:
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a first substrate comprising circuitry including a plurality of conductive traces extending at least substantially parallel to each other through a portion of the first substrate, a plurality of bond pads positioned on a surface of the first substrate and comprising a width extending over at least two of the plurality of conductive traces, and a plurality of vias extending from adjacent at least some conductive traces of the plurality of conductive traces to bond pads of the plurality of bond pads; a second substrate bonded to the first substrate, the second substrate comprising circuitry coupled to the plurality of bond pads on the first substrate with a plurality of conductive bumps. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A memory device comprising a first substrate, the first substrate comprising:
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a plurality of magnetic tracks comprising a plurality of domains; a plurality of magnetic tunneling junctions proximate to the plurality of magnetic tracks and extending to a location adjacent a surface of the first substrate; and a plurality of bond pads on the surface of the first substrate, each bond pad of the plurality of bond pads electrically coupled to a magnetic tunneling junction of the plurality of magnetic tunneling junctions. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method of fanning an electronic device, comprising:
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forming a first substrate comprising a plurality of conductive traces extending through a portion thereof, a plurality of vias extending from adjacent at least some conductive traces of the plurality of conductive traces to a surface of the first substrate, and a plurality of bond pads on the surface of the first substrate and adjacent to a via of the plurality of vias, each bond pad of the plurality of bond pads comprising a width extending over at least two conductive traces of the plurality of conductive traces; forming a second substrate comprising circuitry; attaching a second substrate to the first substrate with a plurality of conductive bumps coupled to the plurality of bond pads on the first surface of the first substrate and to the circuitry of the second substrate. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method of forming a memory device, comprising:
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forming a plurality of conductive traces in a first substrate, the plurality of conductive traces configured as magnetic shift registers comprising a plurality of domains; forming a plurality of vias comprising magnetic tunneling junctions extending from a surface of the first substrate to proximate the plurality of magnetic shift registers; forming a plurality of bond pads, each bond pad of the plurality of bond pads coupled to a via of the plurality of vias. - View Dependent Claims (20, 21, 22, 23, 24)
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25. A system, comprising:
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at least one processor; and at least one memory device coupled to the processor, the at least one memory device comprising; a first substrate comprising a plurality of magnetic tracks including a plurality of domains, a plurality of magnetic tunneling junctions proximate to the plurality of magnetic tracks and extending to a location adjacent a surface of the first substrate, and a plurality of bond pads on the surface of the first substrate, each bond pad of the plurality of bond pads electrically coupled to a magnetic tunneling junction of the plurality of magnetic tunneling junctions; and a second substrate comprising support circuitry, the second substrate bonded to the plurality of bond pads with a plurality of conductive bumps.
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Specification