DUAL-SIDED THERMAL CYCLER
First Claim
1. A method comprising:
- positioning a fluid processing device between and in thermal contact with a first thermal device on a first surface of the fluid processing device, and a second thermal device on an opposite second surface of the fluid processing device; and
regulating the temperature of the fluid processing device for carrying out a reaction by thermally cycling the first and second thermal devices such that each carries out a heating portion of a thermal cycle and a cooling portion of the thermal cycle.
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Accused Products
Abstract
A device, system, and method are provided for thermally treating a fluid processing device. According to various embodiments, a system is provided that can include a thermal device and a fluid processing device holder. The thermal device can include a first block having a thermal conductivity greater than 0.5 Watt per centimeter Kelvin (W/cm·K), a second block having a thermal conductivity greater than 0.5 W/cm·K, and a heat-pump device disposed between the first block and the second block. The heat-pump device can transfer thermal energy from at least one of the first block and the second block to the other of the first block and the second block. The fluid processing device holder can hold a fluid processing device in a heat-transfer position with respect to the first block and the second block. The fluid processing device can be a microfluidic device.
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Citations
29 Claims
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1. A method comprising:
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positioning a fluid processing device between and in thermal contact with a first thermal device on a first surface of the fluid processing device, and a second thermal device on an opposite second surface of the fluid processing device; and regulating the temperature of the fluid processing device for carrying out a reaction by thermally cycling the first and second thermal devices such that each carries out a heating portion of a thermal cycle and a cooling portion of the thermal cycle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system comprising:
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a fluid processing device comprising a first surface and an opposite second surface; a first thermal device; a second thermal device; and a fluid processing device holder for positioning the fluid processing device in a heat-transfer position between the first thermal device and the second thermal device, wherein the first surface is in thermal contact with the first thermal device, the second surface is in thermal contact with the second thermal device, and the first thermal device and the second thermal device are configured to operate such that each carries out a heating portion of a thermal cycle and a cooling portion of the thermal cycle. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A system comprising:
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a substrate comprising a first surface and an opposite second surface, and containing a plurality of fluid retainment regions; a first thermal device; a second thermal device; and a substrate holder for positioning the substrate in a heat-transfer position between the first thermal device and the second thermal device, wherein the first surface is in thermal contact with the first thermal device, the second surface is in thermal contact with the second thermal device, and the first thermal device and the second thermal device are configured to operate such that each carries out a heating portion of a thermal cycle and a cooling portion of the thermal cycle. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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Specification