THIN PROFILE CONDUCTOR ASSEMBLY FOR MEDICAL DEVICE LEADS

• US 20100234929A1
• Filed: 02/12/2010
• Published: 09/16/2010
• Est. Priority Date: 03/12/2009
• Status: Active Grant

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Scheuermann, Torsten
• Granted Patent: US 9,084,883 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads

Abstract

A medical device lead includes a thin profile conductor assembly. A proximal connector includes a proximal end that is configured to couple the lead to a pulse generator. An insulative lead body extends distally from the proximal connector. The conductor assembly extends distally from the proximal end within the lead body and includes a non-conductive tubular core member that defines a lumen, an outer insulative layer, and a multilayer conductor between the tubular core member and the outer insulative layer. The multilayer conductor is electrically connected to the proximal connector and includes a first conductive layer adjacent to the tubular core member and a second conductive layer adjacent to the first conductive layer opposite the tubular core member. A conductivity of the second conductive layer is greater than a conductivity of the first conductive layer.

Claims

1. A medical device lead comprising:

a proximal connector having a proximal end and configured to couple the lead to a pulse generator;

an insulative lead body extending distally from the proximal connector;

a conductor assembly extending distally from the proximal end within the lead body, the conductor assembly comprising a non-conductive tubular core member that defines a lumen, an outer insulative layer, and a multilayer conductor between the tubular core member and the outer insulative layer, wherein the multilayer conductor is electrically connected to the proximal connector and includes a first conductive layer adjacent the tubular core member and a second conductive layer adjacent the first conductive layer opposite the tubular core member, and wherein a conductivity of the second conductive layer is greater than a conductivity of the first conductive layer.

2. The medical device lead of claim 1, wherein a thickness of the first conductive layer in a dimension extending between the tubular core member and the outer insulative layer is less than a thickness of the second conductive layer.

3. The medical device lead of claim 2, wherein the thickness of the first conductive layer is in the range of about 10 to about 30 nm and the thickness of the second conductive layer is in the range of about 0.2 to about 2 μ

m.

4. The medical device lead of claim 1, wherein the first conductive layer is comprised of a paramagnetic material and the second conductive layer is comprised of a diamagnetic material.

5. The medical device lead of claim 4, wherein the first conductive layer is comprised of Ti, and the second conductive layer is comprised of a material selected from the group consisting of Ag, Al, Au, and Pt.

6. A method for making a conductive assembly for a medical electrical lead, the method comprising:

masking a non-conductive tubular core member with a pattern, wherein the tubular core member defines a lumen;

depositing a first conductive layer on the masked tubular core member;

depositing a second conductive layer on the first conductive layer, wherein the second conductive layer has a conductivity greater than the first conductive layer;

removing the mask from the tubular core member such that portions of the first conductive layer and the second conductive layer deposited on the mask are removed with the mask and a first conductive pattern remains on the tubular core member; and

covering the tubular core member and the first conductive pattern with a first insulative layer.

7. The method of claim 6, wherein masking the tubular core member with the pattern comprises spinning a fibrous material over the tubular core member.

8. The method of claim 6, wherein the first conductive layer is deposited on the masked tube via plasma enhanced chemical vapor deposition (PECVD).

9. The method of claim 6, wherein the second conductive layer is deposited on the first conductive layer via physical vapor deposition (PVD).

10. The method of claim 6, wherein the second conductive layer is deposited on the first conductive layer via galvanic deposition.

11. The method of claim 6, wherein a thickness of the first conductive layer in a dimension extending between the tubular core member and the outer insulative layer is less than a thickness of the second conductive layer.

12. The method of claim 6, wherein the first conductive layer is comprised of a paramagnetic material and the second conductive layer is comprised of a diamagnetic material.

13. The method of claim 6, wherein the tubular core member is covered with the first insulative layer via any of spray coating, dip coating, pulsed laser deposition, or condensation.

14. The method of claim 6, wherein the tubular core member and the first insulative layer are comprised of a polymer.

15. The method of claim 6, and further comprising:

masking the first insulative layer with a pattern;

depositing a third conductive layer on the masked first insulative layer;

depositing a fourth conductive layer on the third conductive layer, wherein the fourth conductive layer has a conductivity greater than the third conductive layer;

removing the mask from the first insulative layer such that portions of the third conductive layer and the fourth conductive layer deposited on the mask are removed with the mask and a second conductive pattern remains on the first insulative layer; and

covering the first insulative layer and the second conductive pattern with a second insulative layer.

16. A conductor assembly for a medical device lead, the conductor assembly comprising:

a non-conductive tubular core member having a lumen;

an outer insulative layer disposed about the non-conductive tubular core member; and

a multilayer conductor between the tubular core member and the outer insulative layer, wherein the multilayer conductor defines a conductor pattern and includes a first conductive layer adjacent to the tubular core member and a second conductive layer adjacent to the first conductive layer opposite the tubular core member, and wherein a conductivity of the second conductive layer is greater than a conductivity of the first conductive layer.

17. The conductor assembly of claim 16, wherein a thickness of the first conductive layer in a dimension extending between the tubular core member and the outer insulative layer is less than a thickness of the second conductive layer.

18. The conductor assembly of claim 17, wherein the thickness of the first conductive layer is in the range of about 10 to about 30 nm and the thickness of the second conductive layer is in the range of about 0.2 to about 2 μ

m.

19. The conductor assembly of claim 16, wherein the first conductive layer is comprised of a paramagnetic material and the second conductive layer is comprised of a diamagnetic material.

20. The conductor assembly of claim 16, wherein the conductor pattern is helical.

21. The conductor assembly of claim 20, wherein turns of the helical pattern have a varying pitch along a major dimension of the conductor assembly.

22. The conductor assembly of claim 16, wherein the conductor pattern comprises a plurality of longitudinally extending conductive filars.

23. The conductor assembly of claim 22, wherein each of the longitudinally extending conductive filars is substantially straight.

24. The conductor assembly of claim 22, wherein each of the longitudinally extending conductive filars is undulating.

25. The conductor assembly of claim 22, wherein each of the longitudinally extending conductive filars is serpentine.

26. The conductor assembly of claim 16, wherein the multilayer conductor defines more than one conductive path.