Thermal Energy Dissipating and Light Emitting Diode Mounting Arrangement
First Claim
1. A thermal energy dissipating and light emitting diode (LED) mounting arrangement, comprising:
- a plurality of LEDs each including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface mounted to a mounting surface, and encapsulating material surrounding the LED circuit and the mounting surface, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the mounting surface and at least one side portion extending between the bottom portion and the top portion, anda thermally conductive sheet having a length, a width and a thickness, the thermally conductive sheet defining a plurality of openings through the thickness, each of the plurality of openings sized to receive and securely hold therein a different one of the plurality of LEDs such that the thermally conductive sheet defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of a corresponding one of the plurality of LEDs, the thermally conductive sheet carrying the plurality of LEDs, and also absorbing thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejecting the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet.
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Accused Products
Abstract
A thermal energy dissipating and LED mounting arrangement includes a plurality of LEDs and a thermally conductive sheet. The thermally conductive sheet has a length, a width and a thickness, and defines a plurality of openings through the thickness. Each of the plurality of openings is sized to receive and securely hold therein a different one of the plurality of LEDs such that the thermally conductive sheet defining the opening is in physical, thermally conductive contact with an exterior surface of at least one side portion of encapsulating material surrounding a corresponding one of the plurality of LEDs. The thermally conductive sheet carries the plurality of LEDs, and also absorbs thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet.
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Citations
20 Claims
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1. A thermal energy dissipating and light emitting diode (LED) mounting arrangement, comprising:
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a plurality of LEDs each including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface mounted to a mounting surface, and encapsulating material surrounding the LED circuit and the mounting surface, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the mounting surface and at least one side portion extending between the bottom portion and the top portion, and a thermally conductive sheet having a length, a width and a thickness, the thermally conductive sheet defining a plurality of openings through the thickness, each of the plurality of openings sized to receive and securely hold therein a different one of the plurality of LEDs such that the thermally conductive sheet defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of a corresponding one of the plurality of LEDs, the thermally conductive sheet carrying the plurality of LEDs, and also absorbing thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejecting the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification