Arrangements For An Integrated Sensor
First Claim
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1. An integrated circuit, comprising:
- a lead frame;
a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame;
a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the second surface of the second substrate;
an electronic component disposed on the first surface of the first substrate; and
a magnetic field sensing element disposed on the first surface of the second substrate.
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Abstract
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
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Citations
62 Claims
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1. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a magnetic field sensing element disposed on the first surface of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 61)
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11. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame such that the second surface of the first substrate is above the lead frame and the first surface of the first substrate is above the second surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the second surface of the second substrate is above the first surface of the first substrate and the first surface of the second substrate is above the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a magnetic field sensing element disposed on the first surface of the second substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 62)
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20-60. -60. (canceled)
Specification