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Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing

  • US 20100237479A1
  • Filed: 06/11/2010
  • Published: 09/23/2010
  • Est. Priority Date: 04/06/2006
  • Status: Active Grant
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1-9. -9. (canceled)

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