Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing

• US 20100237479A1
• Filed: 06/11/2010
• Published: 09/23/2010
• Est. Priority Date: 04/06/2006
• Status: Active Grant

• Current Assignee: Chip Packaging Technologies, LLC
• Original Assignee: Anton Kolbeck, Robert Bauer
• Inventors: Kolbeck, Anton, Bauer, Robert
• Granted Patent: US 8,659,146 B2
• Time in Patent Office: Days
• US Class Current: 257/675
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).

Claims

1-9. -9. (canceled)

10. A lead frame-based, over-molded semiconductor package with an exposed pad comprising at least one THT heat spreader pin configured for insertion into a via formed in a printed circuit board.

11. The semiconductor package of claim 10, where said THT heat spreader pin comprises a plurality of heat spreader pins.

12. The semiconductor package of claim 10, where said THT heat spreader pin is formed as an integral part of the exposed pad.

13. The semiconductor package of claim 10, where said THT heat spreader pin is formed separately from the exposed pad and is attached to the exposed pad.

14. The semiconductor package of claim 10, where the over-molded semiconductor package comprises a PQFN, QFN, HSOP, SOIC, QFP, TQFP or MO-188 package.

15. The semiconductor package of claim 10, where said exposed pad and THT heat spreader pin comprise copper.

16. An electronic device comprising a package structure comprising:

a mold structure;

a die disposed within the mold structure; and

a die attach pad coupled to the die, said die attach pad comprising a first surface exposed from the mold structure and at least a first through hole technology heat spreader pin protruding from the first surface.

17. The electronic device of claim 16, wherein the mold structure has a first surface, and where the first through hole technology heat spreader pin and the first surface of the die attach pad are exposed from the first surface of the mold structure.

18. The electronic device of claim 16, further comprising a heat sink disposed in thermal communication with the heat spreader pin of the die attach pad.

19. The electronic device of claim 16, where the first through hole technology heat spreader pin comprises a plurality of heat spreader pins.

20. The electronic device of claim 16, where the first through hole technology heat spreader pin is formed as an integral part of the die attach pad.

21. A semiconductor package, comprising:

a die pad comprising first and second opposite surfaces with one or more through hole technology (THT) heat spreader structures protruding through the first surface of the die pad;

an integrated circuit die affixed to the second surface of the die pad; and

a mold compound encasing the integrated circuit die and die pad, leaving exposed the first surface of the die pad and the one or more THT heat spreader structures.

22. The semiconductor package of claim 21, where the one or more THT heat spreader structures are positioned and disposed for attachment to a printed circuit board.

23. The semiconductor package of claim 22, where the one or more THT heat spreader structures are positioned and disposed for insertion through one or more vias formed in the printed circuit board.

24. The semiconductor package of claim 21, where the one or more THT heat spreader structures are formed as an integral part of the die pad.

25. The semiconductor package of claim 21, where the one or more THT heat spreader structures are formed as an integral part of the die pad by etching, milling, punching or machining a lead frame.

26. The semiconductor package of claim 21, where the one or more THT heat spreader structures comprises a plurality of heat spreader pins formed integrally to the die pad.

27. The semiconductor package of claim 21, where the die pad comprises:

a pad having one or more mounting holes formed in the first surface;

one or more THT heat spreader pins affixed into the one or more mounting holes of the pad so that the one or more THT heat spreader pins protrude from the pad.

28. The semiconductor package of claim 27, where the one or more THT heat spreader pins are affixed by press fitting, cold welding or inserting the one or more THT heat spreader pins into the one or more mounting holes.

29. The semiconductor package of claim 21, where the one or more THT heat spreader pins comprise copper.