Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing
22 Assignments
0 Petitions
Accused Products
Abstract
A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).
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Citations
29 Claims
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1-9. -9. (canceled)
- 10. A lead frame-based, over-molded semiconductor package with an exposed pad comprising at least one THT heat spreader pin configured for insertion into a via formed in a printed circuit board.
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16. An electronic device comprising a package structure comprising:
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a mold structure; a die disposed within the mold structure; and a die attach pad coupled to the die, said die attach pad comprising a first surface exposed from the mold structure and at least a first through hole technology heat spreader pin protruding from the first surface. - View Dependent Claims (17, 18, 19, 20)
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21. A semiconductor package, comprising:
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a die pad comprising first and second opposite surfaces with one or more through hole technology (THT) heat spreader structures protruding through the first surface of the die pad; an integrated circuit die affixed to the second surface of the die pad; and a mold compound encasing the integrated circuit die and die pad, leaving exposed the first surface of the die pad and the one or more THT heat spreader structures. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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Specification