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LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

  • US 20100237775A1
  • Filed: 03/19/2010
  • Published: 09/23/2010
  • Est. Priority Date: 03/20/2009
  • Status: Abandoned Application
First Claim
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1. A method of fabricating a light emitting diode (LED) package structure, comprising:

  • providing at least one LED chip, wherein the LED chip is electronically connected with a carrier and has a light emitting surface and a plurality of side surfaces connected to the light emitting surface;

    providing a first mask, wherein the first mask has at least one first opening positioned related to the LED chip;

    providing a spray coating apparatus, wherein the spray coating apparatus is disposed above the first mask to perform a first spray coating process, and the spray coating apparatus moves back and forth to spray a first phosphor solution over the LED chip so that the light-emitting surface and the side surfaces of the LED chip can be conformally covered by the sprayed first phosphor solution;

    performing a curing process to cure the first phosphor solution to form a first fluorescent layer; and

    forming a molding compound to encapsulate the first fluorescent layer and a portion of the carrier.

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