LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

• US 20100237775A1
• Filed: 03/19/2010
• Published: 09/23/2010
• Est. Priority Date: 03/20/2009
• Status: Abandoned Application

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Chao, Tzu-Hao
• Application Number:
  US12/727,238
• Publication Number:
  US 20100237775A1
• Time in Patent Office: Days
• US Class Current: 313/506
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

A method of fabricating a light emitting diode (LED) package structure is provided. A carrier and at least one LED chip having a light emitting surface and a plurality of side surfaces are provided. A first mask having at least one first opening is provided, and the first opening at least exposes the LED chip. A spray coating apparatus is provided above the first mask to perform a first spray coating process. The spray coating apparatus moves back and forth to spray a first phosphor solution over the LED chip so that the light-emitting surface and the side surfaces of the LED chip can be conformally covered by the sprayed first phosphor solution. The first phosphor solution is cured to form a first fluorescent layer by performing a curing process. A molding compound is formed to encapsulate the first fluorescent layer and a portion of the carrier.

Claims

1. A method of fabricating a light emitting diode (LED) package structure, comprising:

providing at least one LED chip, wherein the LED chip is electronically connected with a carrier and has a light emitting surface and a plurality of side surfaces connected to the light emitting surface;

providing a first mask, wherein the first mask has at least one first opening positioned related to the LED chip;

providing a spray coating apparatus, wherein the spray coating apparatus is disposed above the first mask to perform a first spray coating process, and the spray coating apparatus moves back and forth to spray a first phosphor solution over the LED chip so that the light-emitting surface and the side surfaces of the LED chip can be conformally covered by the sprayed first phosphor solution;

performing a curing process to cure the first phosphor solution to form a first fluorescent layer; and

forming a molding compound to encapsulate the first fluorescent layer and a portion of the carrier.

2. The method of fabricating the LED package structure as claimed in claim 1, wherein the first phosphor solution comprises a solvent, a gel and a fluorescent powder.

3. The method of fabricating the LED package structure as claimed in claim 2, during the step of spray-coating the first phosphor solution back and forth along the path, the method further comprises performing a first heating process on the LED chip and the carrier to evaporate the solvent in the first phosphor solution on the LED chip.

4. The method of fabricating the LED package structure as claimed in claim 1, wherein before the curing process is performed, the method further comprises:

removing the first mask;

providing a second mask above the LED chip, wherein the second mask has at least one second opening smaller than the first opening, and the second opening correspondingly exposes a portion of the first phosphor solution on the light emitting surface of the LED chip; and

performing a second spray coating process, wherein the spray coating apparatus sprays a second phosphor solution on the portion of the first fluorescent layer exposed by the second opening.

5. The method of fabricating the LED package structure as claimed in claim 4, wherein the second phosphor solution comprises a solvent, a gel and fluorescent powder.

6. The method of fabricating the LED package structure as claimed in claim 2, wherein the solvent comprises xylene, n-heptane or acetone.

7. The method of fabricating the LED package structure as claimed in claim 6, wherein the gel comprises silicone or silica gel or epoxy resin.

8. The method of fabricating the LED package structure as claimed in claim 7, wherein the solvent, the gel and the fluorescent powder respectively account for about 50%, 20% and 30% in the first phosphor solution.

9. The method of fabricating the LED package structure as claimed in claim 5, during the step of performing the second spray coating process, the method further comprises performing a second heating process to evaporate the solvent in the second phosphor solution on the LED chip.

10. The method of fabricating the LED package structure as claimed in claim 4, wherein the spray coating apparatus comprises a spray nozzle, and the spray nozzle sprays the first phosphor solution and the second phosphor solution on the LED chip respectively by atomization.

11. The method of fabricating the LED package structure as claimed in claim 4, wherein during the curing process is performed, the method further comprises curing the second phosphor solution on the LED chip to form a second fluorescent layer.

12. The method of fabricating the LED package structure as claimed in claim 1, wherein before the first mask is provided, the method further comprises forming at least one wire, and the LED chip is electrically connected to the carrier through the wire.

13. The method of fabricating the LED package structure as claimed in claim 1, wherein the carrier comprises a circuit board or a lead frame.

14. A light emitting diode (LED) package structure, comprising:

a LED chip, disposed on a carrier and having a light emitting surface and a plurality of side surfaces connected to the light emitting surface;

a first fluorescent layer conformally covering the light emitting surface and the side surfaces of the LED chip;

a second fluorescent layer, disposed on a portion of the first fluorescent layer on the light emitting layer of the LED chip; and

a lens, disposed on the first fluorescent layer, the second fluorescent layer and a portion of the carrier.

15. The LED package structure as claimed in claim 14, wherein the first fluorescent layer comprises a gel and a fluorescent powder.

16. The LED package structure as claimed in claim 15, the gel comprises silicone or silica gel or epoxy resin.

17. The LED package structure as claimed in claim 14, wherein the second fluorescent layer comprises a gel and a fluorescent powder.

18. The LED package structure as claimed in claim 14, wherein the second fluorescent layer has substantially the same thickness on the first fluorescent layer.

19. The LED package structure as claimed in claim 14, wherein a thickness of the second fluorescent layer is smaller than, equal than or greater than a thickness of the first fluorescent layer.

20. The LED package structure as claimed in claim 19, wherein the thickness of the first fluorescent layer is between about 10 μ

m and 30 μ

m, and the thickness of the second fluorescent layer is between about 10 μ

m and 20 μ

m.

21. The LED package structure as claimed in claim 14, further comprising at least one wire, wherein the LED chip is electrically connected to the carrier through the wire.

22. The LED package structure as claimed in claim 21, wherein the carrier comprises a circuit board or a lead frame.