Printed circuit board, manufacturing method thereof and radio-frequency device

• US 20100238635A1
• Filed: 05/27/2010
• Published: 09/23/2010
• Est. Priority Date: 12/14/2007
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Yang, Ruiquan, Sheng, Haiqiang, Li, Hongcai
• Granted Patent: US 8,633,393 B2
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/03 Use of materials for the substrate
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/4688 Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Claims

1. A PCB, comprising:

a first board material, a second board material, and a third board material sequentially pressed together, wherein

the first board material, the second board material, and the third board material are provided with an opening respectively;

at least two openings have different sizes, a borehole passing through at least one board material in the region between boundaries of the two openings having different sizes is provided on the PCB.

2. The PCB according to claim 1, wherein, a borehole passing through the three board materials is further provided in a region outside the largest opening.

3. The PCB according to claim 1, wherein, in the first board material, the second board material, and the third board material, corresponding two openings of at least two board materials form a step-shaped region.

4. The PCB according to claim 3, wherein, the board material in a region between boundaries of the two openings forming the step-shaped region is provided with a soldering surface on one surface thereof close to the larger opening.

5. The PCB according to claim 1, wherein, the first board material is a high-frequency PCB material, the second board material is a prepreg, and the third board material is a low-frequency PCB material, or each of the first board material, the second board material and the third board material comprises at least one layer.

6. The PCB according to claim 1, wherein, at least one borehole is provided with a back-drilled hole or a back-drilled groove.

7. A method for manufacturing a PCB, comprising:

forming an opening in a first board material, a second board material, and a third board material respectively, at least two openings have different sizes;

stacking the first board material, second board material, and third board material are sequentially;

pressing the stacked first board material, second board material, and third board material together; and

forming a borehole passing through at least one board material in the region between boundaries of the two openings having different size.

8. The method according to claim 7, wherein, the method further comprises:

forming a borehole which is in a region outside the largest opening and passes through the three board materials.

9. The method according to claim 7, wherein, the method further comprises:

back-drilling on a part chosen from a borehole which has been metallized in the pressed board material from backside.

10. The method according to claim 8, wherein, the method further comprises:

mounting a radio-frequency component or a heat sink on the pressed board material.

11. The method according to claim 10, wherein, the step of mounting a radio-frequency component or a heat sink on the pressed board material comprises:

soldering a component on the back surface and/or the front surface of the laminated PCB;

fixing a heat-dissipation metal block with the opening by mounting and sintering the heat-dissipation metal block to the opening; and

mounting the heat sink on the heat-dissipation metal block.

12. The method according to claim 8, wherein, the first board material is a high-frequency PCB material.

13. The method according to claim 8, wherein, the second board material is a prepreg.

14. The method according to claim 8, wherein, the third board material is a low-frequency PCB material.

15. A radio-frequency device, comprising:

a PCB and a radio-frequency component mounted on the PCB, wherein

the PCB comprises a first board material, a second board material, and a third board material sequentially pressed together;

the first board material, the second board material, and the third board material are provided with an opening respectively; and

at least two openings have different sizes, a borehole passing through at least one board material in the region between boundaries of the two openings having different sizes is provided on the PCB.

16. The radio-frequency device according to claim 15, wherein, a borehole passing through the three board materials is further provided in a region outside the largest opening.

17. The radio-frequency device according to claim 15, wherein, in the first board material, the second board material, and the third board material, corresponding two openings of at least two board materials form a step-shaped region.

18. The radio-frequency device according to claim 17, wherein, the board material in a region between boundaries of the two openings forming the step-shaped region is provided with a soldering surface on one surface thereof close to the larger opening.

19. The radio-frequency device according to claim 15, wherein, the first board material is a high-frequency PCB material.

20. The radio-frequency device according to claim 15, wherein, the second board material is a prepreg.

21. The radio-frequency device according to claim 15, wherein, the third board material is a low-frequency PCB material.

22. The radio-frequency device according to claim 15, wherein, at least one borehole is provided with a back-drilled hole or a back-drilled groove.

23. The radio-frequency device according to claim 15, wherein, the radio-frequency device is a base station and the radio-frequency component is one of a high-power radio-frequency PA low noise amplifier or a transceiver and a power supply circuit component.