Printed circuit board, manufacturing method thereof and radio-frequency device
First Claim
1. A PCB, comprising:
- a first board material, a second board material, and a third board material sequentially pressed together, whereinthe first board material, the second board material, and the third board material are provided with an opening respectively;
at least two openings have different sizes, a borehole passing through at least one board material in the region between boundaries of the two openings having different sizes is provided on the PCB.
2 Assignments
0 Petitions
Accused Products
Abstract
A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.
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Citations
23 Claims
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1. A PCB, comprising:
- a first board material, a second board material, and a third board material sequentially pressed together, wherein
the first board material, the second board material, and the third board material are provided with an opening respectively; at least two openings have different sizes, a borehole passing through at least one board material in the region between boundaries of the two openings having different sizes is provided on the PCB. - View Dependent Claims (2, 3, 4, 5, 6)
- a first board material, a second board material, and a third board material sequentially pressed together, wherein
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7. A method for manufacturing a PCB, comprising:
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forming an opening in a first board material, a second board material, and a third board material respectively, at least two openings have different sizes; stacking the first board material, second board material, and third board material are sequentially; pressing the stacked first board material, second board material, and third board material together; and forming a borehole passing through at least one board material in the region between boundaries of the two openings having different size. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A radio-frequency device, comprising:
- a PCB and a radio-frequency component mounted on the PCB, wherein
the PCB comprises a first board material, a second board material, and a third board material sequentially pressed together; the first board material, the second board material, and the third board material are provided with an opening respectively; and at least two openings have different sizes, a borehole passing through at least one board material in the region between boundaries of the two openings having different sizes is provided on the PCB. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
- a PCB and a radio-frequency component mounted on the PCB, wherein
Specification