SUBMOUNT FOR ELECTRONIC COMPONENTS

• US 20100238637A1
• Filed: 06/05/2007
• Published: 09/23/2010
• Est. Priority Date: 06/08/2006
• Status: Active Grant

• Current Assignee: Philips Lighting BV (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Snijder, Pieter J., Bhattacharya, Rabin, Van Pieterson, Liesbeth, Zainzinger, Erich
• Granted Patent: US 8,259,460 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile textile substrates H05K1/038
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 2201/10651 Component having two leads, e.g. resistor, capacitor
• CPC Class Codes: H05K 2201/10818 Flat leads
• CPC Class Codes: H05K 2201/10825 Distorted or twisted flat leads, i.e. deformed by torque
• CPC Class Codes: H05K 2201/10962 Component not directly connected to the PCB
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/1446 Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/321 by conductive adhesives

Abstract

A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Claims

1. A submount (100) for arranging electronic components (150) on a substrate, comprising a head member (101) having an upper side and a substrate side and at least one substrate-engaging member (132, 133) protruding from the substrate side of said head member (101), wherein said head member (101) comprises at least two, from each other isolated, electrically conductive portions (102, 103), each electrically conductive portion (102, 103) comprising a component contact (112, 113) for connection of electronic components thereto, and a substrate contact (122, 123) arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate.

2. A submount according to claim 1, wherein at least one of said substrate contacts (122, 123) is at least partly constituted by a substrate-engaging member (132, 133).

3. A submount according to claim 1, wherein said at least one substrate-engaging member (132, 133) is essentially pin-shaped.

4. A submount according to claim 1, wherein said substrate-engaging member (132, 133) has a length exceeding the thickness of the substrate.

5. A submount according to claim 1, wherein at least one substrate-engaging member (132, 133) is foldable.

6. A submount according to claim 1, wherein the cross-section of said substrate-engaging member (332, 333), in a plane perpendicular to the main extension of said substrate engaging member, has an oblong shape.

7. A submount according to claim 6, comprising at least a first substrate engaging member (332) and a second substrate-engaging member (333), wherein the long axis of the oblong cross section of said first substrate-engaging member forms an angle of from 15°

to 165°

to the long axis of the oblong cross section of said second substrate-engaging member.

8. A submount according to claim 1, wherein at least one of said substrate contacts comprises a portion having serrated surface.

9. A submount according to claim 1, wherein at least one electronic component (150) is connected to said component contacts.

10. A submount according to claim 1, wherein said at least one electronic component (150) is selected from the group consisting of light-emitting diodes, integrated circuitry packages, sensors, actuators and semi-conductor components.

11. A submount (400) according to claim 1, wherein a portion of said head member (401) constitutes a male member of a snap fastener comprising an engaging protrusion (450) for engaging with an engaging recess of an female member of a snap fastener.

12. A submount (400) according to claim 11, wherein an electronic component (470), constituting said female member of a snap fastener comprising an engaging recess (480), is snap-locked on said engaging protrusion (450).

13. A submount according to claim 1, wherein a portion of said head member constitutes a female member of a snap fastener comprising an engaging recess for engaging with an engaging protrusion of an male member of a snap fastener.

14. A submount according to claim 13, wherein an electronic component, constituting said male member of a snap fastener, is snap-locked on said head member engaging recess.

15. A submount according to claim 1, wherein a conductive adhesive material (162, 163) is arranged on at least one of said substrate contacts (122, 123).

16. A submount according to claim 15, wherein said conductive adhesive material comprises a conductive epoxy material or an conductive adhesive tape.

17. An arrangement comprising a textile substrate (200) having a front side and a back side and comprising at least two separate conductive electrodes (201, 202), and at least one submount (100) according to claim 1, wherein said at least one substrate-engaging member (132, 133) of said submount penetrates said substrate from the front side thereof, and wherein each of said conductive electrodes (201, 202) is in contact with a separate substrate contact (122, 123) of said submount.

18. An arrangement according to claim 17, wherein said conductive electrodes are clamped between said substrate contacts and said substrate.

19. An arrangement according to claim 17, wherein a conductive adhesive material bonds at least one of said substrate contact to one of said conductive electrodes.

20. An arrangement according to claim 17, wherein at least one substrate-engaging member extends through said substrate to the backside thereof, and wherein a section of said substrate-engaging member located on said backside is bent towards the backside surface of the substrate.

21. An arrangement according to claim 17, wherein at least one of said conductive electrodes is arranged on the backside of the substrate, and is connected to said submount via contact to a section of a substrate-engaging member extending to said backside.

22. An arrangement according to claim 17, wherein said conductive electrode arranged on the backside of said substrate is clamped between said substrate and said substrate-engaging member.

23. An arrangement according to claim 17, wherein an isolating layer, arranged to isolate a conductive electrode, is penetrated by a substrate contact to form an electrical connection from said conductive electrode to said substrate contact.

24. An arrangement according to claim 17, wherein a female or male member of a snap fastener is arranged on the backside of said substrate and retained by engagement with said substrate engaging means.