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AUTOMATED WAFER DEFECT INSPECTION SYSTEM AND A PROCESS OF PERFORMING SUCH INSPECTION

  • US 20100239157A1
  • Filed: 05/28/2010
  • Published: 09/23/2010
  • Est. Priority Date: 07/15/1998
  • Status: Active Grant
First Claim
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1. An automated system for inspecting a substrate such as a wafer in any form including whole patterned wafers, sawn wafers, broken wafers, and wafers of any kind on film frames, dies, die in gel paks, die in waffle paks, multi-chip modules often called MCMs, JEDEC trays, Auer boats, and other wafer and die package configurations for defects, the system comprising:

  • a wafer test plate;

    a wafer provider for providing a wafer to the test plate;

    a visual inspection device for visual inputting of a plurality of known good quality wafers during training and for visual inspection of other unknown quality wafers during inspection;

    an illuminator for providing short pulses of light to each of the unknown quality wafers during movement between the wafer and the visual inspection device; and

    a microprocessor having processing and memory capabilities for developing a model of good quality wafer and comparing unknown quality wafers to the model.

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