RESISTIVELY HEATED SMALL PLANAR FILAMENT

• US 20100239828A1
• Filed: 03/19/2009
• Published: 09/23/2010
• Est. Priority Date: 03/19/2009
• Status: Abandoned Application

• Current Assignee: Moxtek Inc (Nippon Kayaku Company Limited)
• Original Assignee: Moxtek Inc (Nippon Kayaku Company Limited)
• Inventors: Cornaby, Sterling W., Bard, Erik C.
• Application Number:
  US12/407,457
• Publication Number:
  US 20100239828A1
• Time in Patent Office: Days
• US Class Current: 428/195.100
• CPC Class Codes: H01J 1/16 characterised by the shape
• CPC Class Codes: H01J 1/18 Supports; Vibration-damping arrangements
• CPC Class Codes: H01J 2201/2853 Serpentine
• CPC Class Codes: H01J 2201/2867 Spiral or helix
• CPC Class Codes: H01J 35/064 Details of the emitter, e.g. material or structure H01J35/065 takes precedence
• CPC Class Codes: H01K 1/14 characterised by the shape
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

A planar filament comprising two bonding pads and a non-linear filament connected between the two bonding pads. The filament may be wider in the center to increase filament life. The planar filament may be mounted on a substrate for easier handling and placement. Voltage can be used to create an electrical current through the filament, and can result in the emission of electrons from the filament. The planar filament can be utilized in an x-ray tube.

Claims

1. A planar filament device, comprising:

a) a layer patterned to form;

i) a pair of spaced-apart bonding pads each configured to receive an electrical connection; and

ii) a filament connected between the pair of bonding pads configured to receive an applied electric current therethrough; and

b) the filament having a non-uniform width measured in a plane of the layer and transverse to a length of the filament; and

c) the filament being wider near an intermediate portion of the filament and narrower at ends of the filament near the pair of bonding pads.

2. A device as in claim 1, wherein the filament has a double spiral shape oriented parallel to the layer.

3. A device as in claim 1, further comprising at least one beam shaping pad also patterned in and defined by the layer, and disposed adjacent to and spaced-apart from the filament.

4. A device as in claim 1, further comprising:

a) at least two beam shaping pads patterned in and defined by the layer; and

b) each of the at least two beam shaping pads being electrically connected to the pair of bonding pads.

5. A device as in claim 1, further comprising:

a) a beam shaping pad patterned in and defined by the layer and electrically connected to one of the pair of bonding pads; and

b) the beam shaping pad substantially surrounding the filament in a plane of the layer.

6. A device as in claim 1, further comprising:

a) a vacuum enclosure disposed about the filament; and

b) an electrical power source connected to the bonding pads to apply the electric current through the filament to cause the filament to release electrons.

7. A device as in claim 1, wherein support structures support each of the bonding pads and the support structures are electrically isolated from each other.

8. A device as in claim 7, wherein the support structures are connected to an electrically resistant support base.

9. A planar filament device, comprising:

a) a layer patterned to form;

i) a pair of spaced-apart bonding pads each configured to receive an electrical connection; and

ii) a filament connected between the pair of bonding pads configured to receive an applied electric current therethrough; and

b) the filament being suspended between the bonding pads without any other contacting structure on a bottom surface thereof;

c) the filament being flat with planar top and bottom surfaces that are substantially parallel with respect to one another;

d) the filament having a nonuniform width measured in a plane of the layer and transverse to a length of the filament;

e) the filament being wider near an intermediate portion of the filament and narrower at ends of the filament near the pair of bonding pads;

f) the filament extending non-linearly between the pair of bonding pads; and

h) electrically isolated support structures supporting each of the bonding pads.

10. A device as in claim 9, further comprising:

a) a vacuum enclosure disposed about the planar filament;

b) a cathode coupled to the vacuum enclosure;

c) an anode coupled to the vacuum enclosure and opposing the cathode; and

d) a power source electrically coupled to the pair of bonding pads to apply the electric current through the filament to cause the filament to release electrons, and a high voltage power supply being electrically coupled to the cathode and the anode to form a voltage differential therebetween to cause the electrons to accelerate to the anode.

11. A planar filament device, comprising:

a) a substrate with a top surface;

b) a layer disposed over the top surface of the substrate and patterned to form;

i) a pair of spaced-apart bonding pads each configured to receive an electrical connection; and

ii) a filament connected between the pair of bonding pads configured to receive an applied electric current therethrough.

12. A device as in claim 11, wherein the filament has a double spiral shape oriented parallel to the layer.

13. A device as in claim 11, wherein the filament has a non-uniform width measured in a plane of the layer and transverse to a length of the filament.

14. A device as in claim 11, wherein the filament is wider near an intermediate portion of the filament and narrower ar ends of the filament near the pair of bonding pads.

15. A device as in claim 11, further comprising at least one beam shaping pad also patterned in and defined by the layer, and disposed adjacent and spaced-apart from the fi lament.

16. A device as in claim 11, further comprising:

a) at least two beam shaping pads patterned in and defined by the layer; and

b) each of the at least two beam shaping pads being electrically connected to the pair of bonding pads.

17. A device as in claim 11, further comprising:

a) a beam shaping pad patterned in and defined by the layer and electrically connected to one of the pair of bonding pads; and

b) the beam shaping pad substantially surrounding the filament in a plane of the layer.

18. A device as in claim 11, further comprising:

a) a vacuum enclosure disposed about the filament; and

b) an electrical power source connected to the bonding pads to apply the electric current through the filament to cause the filament to release electrons.

19. A planar filament device, comprising:

a) a substrate with a top surface;

b) a layer disposed over the top surface of the substrate and patterned to form;

i) a pair of spaced-apart bonding pads each configured to receive an electrical connection; and

ii) a filament connected between the pair of bonding pads configured to receive an applied electric current therethrough; and

c) the filament being suspended between the bonding pads without any other contacting structure on a bottom surface thereof;

d) the filament having a non-uniform width measured in a plane of the layer and transverse to a length of the filament;

e) the filament being wider near an intermediate portion of the filament and narrower at ends of the filament near the pair of bonding pads; and

f) the filament extending non-linearly between the pair of bonding pads.

20. A device as in claim 19, further comprising:

a) a vacuum enclosure disposed about the filament; and

b) an electrical power source connected to the bonding pads to apply the electric current through the filament to cause the filament to release electrons.

c) a cathode coupled to the vacuum enclosure;

d) an anode coupled to the vacuum enclosure and opposing the cathode; and

e) the filament being associated with the cathode.