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RESISTIVELY HEATED SMALL PLANAR FILAMENT

  • US 20100239828A1
  • Filed: 03/19/2009
  • Published: 09/23/2010
  • Est. Priority Date: 03/19/2009
  • Status: Abandoned Application
First Claim
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1. A planar filament device, comprising:

  • a) a layer patterned to form;

    i) a pair of spaced-apart bonding pads each configured to receive an electrical connection; and

    ii) a filament connected between the pair of bonding pads configured to receive an applied electric current therethrough; and

    b) the filament having a non-uniform width measured in a plane of the layer and transverse to a length of the filament; and

    c) the filament being wider near an intermediate portion of the filament and narrower at ends of the filament near the pair of bonding pads.

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