Nano and meso shell-core control of physical properties and performance of electrically insulating composites

• US 20100239851A1
• Filed: 09/28/2006
• Published: 09/23/2010
• Est. Priority Date: 06/14/2005
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Power Generation, Inc.
• Inventors: Wood, John W., Stevens, Gary, Smith, James D.B.
• Granted Patent: US 7,851,059 B2
• Time in Patent Office: Days
• US Class Current: 428/324
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0224 Conductive particles having an insulating coating
• CPC Class Codes: H05K 2201/0248 Needles or elongated particles; Elongated cluster of chemically bonded particles microfibers H05K2201/0251; stacked conductors H05K2201/0379
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/251 Mica
• CPC Class Codes: Y10T 428/254 Polymeric or resinous material
• CPC Class Codes: Y10T 428/256 Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/257 Iron oxide or aluminum oxide
• CPC Class Codes: Y10T 428/258 Alkali metal or alkaline earth metal or compound thereof
• CPC Class Codes: Y10T 428/259 Silicic material
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31993 Of paper

Abstract

A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles'"'"' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

Claims

1. A high thermal conductivity resin comprising:

a host resin matrix; and

high thermal conductivity fillers, wherein said high thermal conductivity fillers are mixed within said host resin matrix to form a resin mixture;

wherein said fillers comprise at least 3-5% by weight of said resin mixture;

wherein said high thermal conductivity fillers are an average of 1-100 nm in at least one dimension and are smaller than an average of 1000 nm in a longest dimension of said fillers;

wherein said host resin matrix forms ordered resin shells around said high thermal conductivity fillers;

wherein resin molecules are aligned perpendicular to a surface of said high thermal conductivity fillers;

wherein an overlap of said ordered resin shells is formed between said high thermal conductivity fillers such that continuous pathways for increased phonon flux are created through said resin mixture; and

wherein said fillers are comprised of larger particles and smaller particles, wherein said larger particles have at least one size dimension that is greater than 100 nm, and wherein said smaller particles have at least one size dimension that is smaller than 100 nm.

2. The high thermal conductivity resin of claim 1, wherein said fillers comprise surface functional groups for increasing reactivity with the resin matrix.

3. The high thermal conductivity resin of claim 2, wherein the surface functional groups comprise at least one of hydroxyl, carboxylic, amine, epoxide, silane or vinyl.

4. The high thermal conductivity resin of claim 1, wherein said fillers are in the form of dendritic stars.

5. The high thermal conductivity resin of claim 1, wherein the ordered resin shells comprise a volume approximately equal to or greater than that of said fillers, and wherein said ordered resin shells are disposed around individual ones of said fillers.

8. The high thermal conductivity resin of claim 1, wherein said resin is comprised of at least 50% liquid crystal epoxy resin.

9. The high thermal conductivity resin of claim 8, wherein said fillers are effective to provide a seeding site for crystallization of said liquid crystal epoxy resin.

10. The high thermal conductivity resin of claim 1, wherein said fillers comprise surface functional groups for providing enhanced charge transport for said high thermal conductivity resin.

11. The high thermal conductivity resin of claim 10, wherein said surface functional groups comprise at least one of OH, COOH, NH2, or SO3H.

12. An impregnated porous media comprising the high thermal conductivity resin of claim 1.

13. The high thermal conductivity resin of claim 1, wherein said high thermal conductivity fillers have an aspect ratio of between 10-50.

14. The high thermal conductivity resin of claim 1, wherein said high thermal conductivity fillers are formed from a two phase organic-inorganic composite.

6. (canceled)

7. The high thermal conductivity resin of claim 6, wherein the ratio of larger particles to smaller particles is from 3:

1 to 10;

1 by weight.

15. A continuous organic-inorganic resin comprising:

a host resin network; and

inorganic high thermal conductivity fillers evenly dispersed in said host resin network and essentially completely co-reacted with said host resin network;

wherein said high thermal conductivity fillers are selected from at least one of oxides, nitrides, and carbides;

wherein said high thermal conductivity fillers have been surface treated to introduce surface functional groups that allow for the essentially complete co-reactivity with said host resin network;

wherein said continuous organic-inorganic resin comprises a minimum of 3% and a maximum of 50% by weight of said high thermal conductivity fillers;

wherein said high thermal conductivity fillers are from an average of 1-100 nm in at least one dimension and are smaller than an average of 1000 nm in a longest dimension;

wherein said host resin network forms ordered resin shells around said high thermal conductivity fillers;

wherein resin molecules are aligned perpendicular to a surface of said high thermal conductivity fillers;

wherein an overlap of said ordered resin shells is formed between said high thermal conductivity fillers such that continuous pathways for increased phonon flux are created through said resin mixture; and

wherein said resin is comprised of at least 50% liquid crystal epoxy resin.

16. The continuous organic-inorganic resin of claim 15, wherein said at least one of oxides, nitrides, and carbides comprise Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2 with mixed stoichiometric and non-stoichiometric combinations.

17. An impregnated porous media comprising the continuous organic-inorganic resin of claim 15.

18. The impregnated porous media of claim 17, wherein said porous media is a paper matrix.

19. A porous media impregnated with a high thermal conductivity resin comprising:

a porous media; and

a high thermal conductivity material loaded resin comprising high thermal conductivity fillers dispersed within a host resin matrix, wherein said high thermal conductivity fillers comprise 3-50% by weight of said resin;

wherein said high thermal conductivity fillers comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide, diamonds and dendrimers;

wherein said high thermal conductivity fillers are from an average of 1-100 nm in at least one dimension and are smaller than an average of 1000 nm in a longest dimension;

wherein said host resin matrix forms ordered resin shells around said high thermal conductivity fillers;

wherein resin molecules are aligned perpendicular to a surface of said high thermal conductivity fillers;

wherein an overlap of said ordered resin shells is formed between said high thermal conductivity fillers such that continuous pathways for increased phonon flux are created through said resin mixture; and

wherein said fillers are comprised of larger particles and smaller particles, wherein said larger particles have at least one size dimension that is greater than 100 nm, and wherein said smaller particles have at least one size dimension that is smaller than 100 nm.

20. The porous media impregnated with said high thermal conductivity resin of claim 19, wherein said paper matrix is a mica-glass insulating paper.