PORTABLE OPTICAL DETECTION CHIP AND MANUFACTURING METHOD THEREOF

• US 20100240168A1
• Filed: 06/04/2010
• Published: 09/23/2010
• Est. Priority Date: 05/02/2007
• Status: Active Grant

• Current Assignee: National Tsing Hua University
• Original Assignee: National Tsing Hua University
• Inventors: HUNG, KUO YUNG, TSENG, FAN GANG
• Granted Patent: US 7,851,251 B2
• Time in Patent Office: Days
• US Class Current: 438/65
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/107 the potential barrier working in avalanche mode, e.g. avalanche photodiodes

Abstract

A portable optical detection chip comprises a substrate, a plurality of avalanche-type photosensitive device modules and a plurality of plane mirrors. The plurality of avalanche-type photosensitive device modules are formed on the substrate, and each of them comprises a plurality of avalanche-type photosensitive devices and a plurality of lenses. Each of the lenses is stacked on one of the avalanche-type photosensitive devices. The plurality of plane mirrors are disposed between the avalanche-type photosensitive device modules. That is, the avalanche-type photosensitive device modules are separated from each other by the plane mirrors.

Claims

1. The method for manufacturing a portable optical detection chip, comprising the steps of:

forming a plurality of avalanche-type photosensitive devices on a substrate;

disposing a hydrophobic layer on the avalanche-type photosensitive devices and the substrate, wherein the hydrophobic layer covers areas excluding photosensitive areas of the avalanche-type photosensitive devices;

forming a lens on the photosensitive area of each of the avalanche-type photosensitive devices; and

forming a plurality of inclined plane mirrors on the substrate, wherein the plane mirrors partition the avalanche-type photosensitive devices into a plurality of groups.

2. The method for manufacturing a portable optical detection chip of claim 1, wherein the arrangement of the avalanche-type photosensitive devices in each of the avalanche-type photosensitive device modules approaches a circle.

3. The method for manufacturing a portable optical detection chip of claim 2, wherein the avalanche-type photosensitive devices of one of the avalanche-type photosensitive device modules are arranged into a hexagonal shape, with one of the avalanche-type photosensitive devices in the middle of the hexagon, and the other avalanche-type photosensitive devices are around the middle one.

4. The method for manufacturing a portable optical detection chip of claim 1, wherein the lens is curved surfaces formed on a UV curable photoresist material by surface tension.

5. The method for manufacturing a portable optical detection chip of claim 1, wherein the lens are made of high transparent plastic materials.

6. The method for manufacturing a portable optical detection chip of claim 1, wherein the lens has a micro-spherical or non-spherical surface formed by electrostatic forces.

7. The method for manufacturing a portable optical detection chip of claim 1, wherein the plane mirrors are pillars standing at an incline on the substrate and formed by an inclined exposure method.

8. The method for manufacturing a portable optical detection chip of claim 7, wherein the substrate, the UV curable photoresist material and a mask are immersed in glycerol after the inclined exposure method is performed.

9. The method for manufacturing a portable optical detection chip of claim 7, further comprising a step of forming an anti-reflection layer on the substrate.

10. The method for manufacturing a portable optical detection chip of claim 1, wherein the hydrophobic layer is a Teflon.

11. The method for manufacturing a portable optical detection chip of claim 1, wherein the avalanche-type photosensitive device has a ring-shaped protection area to avoid the early occurrence of breakdown in a junction in the avalanche-type photosensitive device.

12. The method for manufacturing a portable optical detection chip of claim 1, wherein the avalanche-type photosensitive device module detects corresponding sample spots on a biochip in a point-to-point manner.