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FABRICATION METHOD FOR DEVICE STRUCTURE HAVING TRANSPARENT DIELECTRIC SUBSTRATE

  • US 20100240195A1
  • Filed: 05/13/2010
  • Published: 09/23/2010
  • Est. Priority Date: 11/18/2004
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor integrated circuit chip comprising:

  • preparing a wafer including a dielectric substrate that is transparent to light and having a front surface and a back surface, a first film formed on the back surface of the dielectric substrate, a second film formed on the first film, a third film formed on the second film, and a fourth film formed on the front surface, the second film having a lower refractive index than the first and third films;

    forming circuitry in and on the fourth film, and dicing the wafer into chips; and

    illuminating the third film by sensing light for detection of the wafer, during said forming.

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