EMI SHIELDED CONDUIT ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

• US 20100241206A1
• Filed: 03/17/2010
• Published: 09/23/2010
• Est. Priority Date: 03/19/2009
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Brendel, Richard L., Stevenson, Robert A., Truex, Buehl E.
• Granted Patent: US 8,095,224 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61B 2018/00839 Bioelectrical parameters, e.g. ECG, EEG
• CPC Class Codes: A61B 2090/374 NMR or MRI
• CPC Class Codes: A61B 2562/182 Electrical shielding, e.g. using a Faraday cage
• CPC Class Codes: A61B 2562/222 Electrical cables or leads therefor, e.g. coaxial cables or ribbon cables
• CPC Class Codes: A61B 2562/227 Sensors with electrical connectors
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/283 Invasive
• CPC Class Codes: A61B 5/7203 for noise prevention, reduction or removal
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: G01R 33/285 Invasive instruments, e.g. catheters or biopsy needles, specially adapted for tracking, guiding or visualization by NMR

Abstract

An EMI shielded conduit assembly for an active implantable medical device (AIMD) includes an EMI shielded housing for the AIMD, a hermetic feedthrough terminal associated with the AIMD housing, and an electronic circuit board, substrate or network disposed within the AIMD housing remote from the hermetic feedthrough terminal. At least one leadwire extends from the hermetic feedthrough terminal to the remote circuit board, substrate or network. An EMI shield is conductively coupled to the AIMD housing and substantially co-extends about the leadwire in non-conductive relation thereto.

Claims

1. An EMI shielded conduit assembly for an active implantable medical device (AIMD), comprising:

an EMI shielded housing for the AIMD;

a hermetic feedthrough terminal associated with the AIMD housing;

an electronic circuit board, substrate or network disposed within the AIMD housing remote from the hermetic feedthrough terminal;

at least one leadwire extending from the hermetic feedthrough terminal to the remote electronic circuit board, substrate or network; and

an EMI shield conductively coupled to the AIMD housing, and substantially co-extensively about the at least one leadwire in non-conductive relation.

2. The EMI shielded conduit assembly of claim 1, wherein the electronic circuit board, substrate or network comprises a low pass EMI filter, an L-C trap, a bandstop filter, or a combination thereof.

3. The EMI shielded conduit assembly of claim 2, wherein the low pass EMI filter and the L-C trap are grounded to the EMI shield.

4. The EMI shielded conduit assembly of claim 2 or 3, wherein the low pass EMI filter comprises a capacitor.

5. The EMI shielded conduit assembly of claim 4, wherein the low pass EMI filter comprises a feedthrough capacitor, an MLCC chip capacitor, a flat-through capacitor, an X2Y attenuator, or a multi-element low-pass filter, or a combination thereof.

6. The EMI shielded conduit assembly of claim 2 or 3, wherein the low pass EMI filter comprises an active electronic filter.

7. The EMI shielded conduit assembly of claim 1 or 2, including a high voltage suppression network associated with the remote electronic circuit board, substrate or network.

8. The EMI shielded conduit assembly of claim 7, wherein the high voltage suppression network is grounded to the EMI shield.

9. The EMI shielded conduit assembly of claim 7, wherein the high voltage suppression network comprises a diode array.

10. The EMI shielded conduit assembly of claim 1, wherein the electronic circuit board, substrate or network comprises a programmable short-to-housing switch network.

11. The EMI shielded conduit assembly of claim 1, wherein the AIMD housing comprises a conductive equipotential surface.

12. The EMI shielded conduit assembly of claim 11, wherein the AIMD housing comprises a metallic can.

13. The EMI shielded conduit assembly of claim 2 or 3, wherein the low pass filter, the L-C trap, or the bandstop filter is disposed on the circuit board or the substrate.

14. The EMI shielded conduit assembly of claim 13, wherein the EMI shield extends from the hermetic feedthrough terminal to the low pass EMI filter, the L-C trap, or the bandstop filter.

15. The EMI shielded conduit assembly of claim 1 or 11, wherein the hermetic feedthrough terminal includes a ferrule conductively coupled to the AIMD housing.

16. The EMI shielded conduit assembly of claim 15, wherein the EMI shield is conductively coupled to the ferrule.

17. The EMI shielded conduit assembly of claim 1, wherein the at least one leadwire comprises a plurality of leadwires, and the EMI shield comprises at least two EMI shields conductively coupled to the AIMD housing and each substantially co-extending about at least one respective leadwire in non-conductive relation.

18. The EMI shielded conduit assembly of claim 17, including a non-conductive insulator disposed between each leadwire and its respective EMI shield.

19. The EMI shielded conduit assembly of claim 1 or 18, wherein the EMI shield comprises a conductive heat-shrink tubing.

20. The EMI shielded conduit assembly of claim 1, wherein the EMI shield comprises a conductive foil, wire, braid, mesh, circuit trace, or solid tubular material.

21. The EMI shielded conduit assembly of claim 9, wherein the EMI shield is radially spaced from the at least one leadwire.

22. The EMI shielded conduit assembly of claim 20, including a flex cable embodying the at least one leadwire and the EMI shield.