VERTICALLY INTEGRATED MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING

• US 20100242603A1
• Filed: 10/30/2009
• Published: 09/30/2010
• Est. Priority Date: 03/24/2009
• Status: Active Grant

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Miller, Todd F., Lin, Yizhen, Park, Woo Tae, Monk, David J.
• Granted Patent: US 8,220,330 B2
• Time in Patent Office: Days
• US Class Current: 73/514.320
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/082 for two degrees of freedom of movement of a single mass
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Claims

1. A microelectromechanical systems (MEMS) sensor device comprising:

a first substrate having a first side;

a first sensor disposed on said first side and configured to sense a first physical stimulus;

a second substrate having a second side, said second substrate being coupled to said first substrate with said second side facing said first side; and

a second sensor disposed on said second side and situated facing said first sensor, said second sensor being configured to sense a second physical stimulus, said second physical stimulus differing from said first physical stimulus.

2. A MEMS sensor device as claimed in claim 1 wherein:

said first sensor comprises an inertial sensor, and said first physical stimulus is motion; and

said second sensor comprises a pressure sensor, and said second physical stimulus is pressure.

3. A MEMS sensor device as claimed in claim 1 further comprising a third sensor disposed on said first side of said first substrate and configured to sense a third physical stimulus, said third physical stimulus differing from said first physical stimulus and said second physical stimulus.

4. A MEMS sensor device as claimed in claim 3 wherein:

said first sensor comprises an inertial sensor, and said first physical stimulus is motion;

said second sensor comprises a pressure sensor, and said second physical stimulus is pressure; and

said third sensor comprises a magnetic sensor, and said third physical stimulus is a magnetic field.

5. A MEMS sensor device as claimed in claim 3 further comprising a shield trace interposed between said first and third sensors and coupled to a ground terminal to limit crosstalk between said first and third sensors.

6. A MEMS sensor device as claimed in claim 1 wherein said first sensor is spaced apart from said second sensor by a gap having a height sufficient to limit crosstalk between said first sensor and said second sensor.

7. A MEMS sensor device as claimed in claim 1 further comprising a stand-off element interposed between a periphery of said first and second substrates, said stand-off element having a height that produces a separation between said first and second substrates so that said first sensor is spaced apart from said second sensor by a gap.

8. A MEMS sensor device as claimed in claim 1 wherein:

said first sensor includes a first movable element; and

said second sensor includes a second movable element, said first and second movable elements being electrically coupled to a common electrical potential terminal.

9. A MEMS sensor device as claimed in claim 1 wherein said second substrate is coupled to said first substrate to form a hermetically sealed chamber in which both of said first sensor and said second sensor are located.

10. A MEMS sensor device as claimed in claim 9 wherein:

said hermetically sealed chamber exhibits a chamber pressure that is variable in response to an ambient temperature and an external pressure outside of said chamber;

said second sensor is a pressure sensor having a diaphragm that moves in response to a change in said external pressure to produce a pressure output signal indicative of said change in said external pressure; and

said MEMS sensor device further comprises a correction circuit in communication with said pressure sensor for receiving said pressure output signal and producing a corrected pressure signal to compensate for an error signal component in said pressure output signal.

11. A MEMS sensor device as claimed in claim 1 wherein:

said first sensor includes a movable element; and

said MEMS sensor device further comprises an over-travel stop positioned between said movable element and said second sensor, said over-travel stop being in non-movable connection with one of said first and second sides, said over-travel stop being adapted to limit movement of said movable element in a direction perpendicular to said first and second sides of said first and second substrates.

12. A MEMS sensor device as claimed in claim 11 wherein:

said movable element is a first movable element;

said over-travel stop is a first over-travel stop;

said second sensor includes a second movable element; and

said MEMS sensor device further comprises a second over-travel stop positioned between said second movable element and said first sensor, said second over-travel stop being in non-movable connection with one of said first and second sides, said second over-travel stop being adapted to limit movement of said second movable element in said direction perpendicular to said first and second sides of said first and second substrates.

13. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:

forming a first sensor on a first side of a first substrate, said first sensor being adapted to sense a first physical stimulus, said first sensor including a first movable element that is movable relative to said first side;

forming a second sensor on a second side of a second substrate, said second sensor being adapted to sense a second physical stimulus, said second physical stimulus differing from said first physical stimulus, said second sensor including a second movable element that is movable relative to said second side; and

after forming said first and second sensors, coupling said second substrate with said first substrate such that said second side faces said first side and said second movable element is situated facing said first movable element.

14. A method as claimed in claim 13 wherein said coupling operation couples said second substrate with said first substrate to form a hermetically sealed chamber in which said first and second sensors are located.

15. A method as claimed in claim 13 wherein:

said forming said first sensor forms said first sensor as an inertial sensor such that said first physical stimulus is motion;

said forming said second sensor forms said second sensor as a pressure sensor such that said second physical stimulus is pressure.

16. A method as claimed in claim 15 wherein:

said forming said first sensor comprises forming a third sensor on said first side of said first substrate as a magnetic sensor concurrent with forming said first sensor, said magnetic sensor being configured to sense a magnetic field.

17. A microelectromechanical systems (MEMS) sensor device comprising:

a first substrate having a first side;

a first sensor disposed on said first side and configured to sense a first physical stimulus, said first sensor including a movable element adapted to move in response to said first physical stimulus;

a second substrate having a second side, said second substrate being coupled to said first substrate with said second side facing said first side to form a hermetically sealed chamber;

a second sensor disposed on said second side and situated facing said first sensor, said second sensor being configured to sense a second physical stimulus, said second physical stimulus differing from said first physical stimulus, and said first and second sensors being located in said chamber; and

an over-travel stop positioned between said movable element and said second sensor, said over-travel stop being in non-movable connection with one of said first and second sides, said over-travel stop being adapted to limit movement of said movable element in a direction perpendicular to said first and second sides of said first and second substrates.

18. A MEMS sensor device as claimed in claim 17 wherein:

said first sensor comprises an inertial sensor, and said first physical stimulus is motion; and

said second sensor comprises a pressure sensor, and said second physical stimulus is pressure.

19. A MEMS sensor device as claimed in claim 17 further comprising a third sensor disposed on said first side of said first substrate and configured to sense a third physical stimulus, said third physical stimulus differing from said first physical stimulus and said second physical stimulus.

20. A MEMS sensor device as claimed in claim 19 wherein:

said first sensor comprises an inertial sensor, and said first physical stimulus is motion;

said second sensor comprises a pressure sensor, and said second physical stimulus is pressure; and

said third sensor comprises a magnetic sensor, and said third physical stimulus is a magnetic field.