LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME

• US 20100244060A1
• Filed: 06/18/2010
• Published: 09/30/2010
• Est. Priority Date: 12/14/2004
• Status: Active Grant

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Optodevice Company Limited (Seoul Semiconductor Co., Ltd.)
• Inventors: LEE, Chung Hoon, Yves, Lacroix, Yoon, Hyung Soo, Lee, Young Ju
• Granted Patent: US 7,842,959 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Claims

1. A package for a light emitting device, comprising:

a package body comprising leads;

a plurality of light emitting cells arranged on the package body;

a plurality of first connection members arranged between the package body and the plurality of light emitting cells, the plurality of first connection members coupling a first portion of the plurality of light emitting cells in series to form a first light emitting cell array, and

a plurality of second connection members arranged between the package body and the plurality of light emitting cells, the plurality of second connection members coupling a second portion of the plurality of light emitting cells in series to form a second light emitting cell array,

wherein the first light emitting cell array and the second light emitting cell array are configured to be coupled to an alternating current (AC) power source in reverse parallel.

2. The package of claim 1, wherein the plurality of light emitting cells is arranged on the leads.

3. The package of claim 1, further comprising:

a heat sink,

wherein the plurality of light emitting cells is arranged on the heat sink.

4. The package of claim 1, further comprising:

a submount substrate arranged between the package body and the plurality of light emitting cells,

wherein the plurality of light emitting cells is arranged on the submount substrate, and the plurality of first connection members is arranged between the plurality of light emitting cells and the submount substrate.

5. The package of claim 4, further comprising:

a heat sink,

wherein the submount substrate is arranged on the heat sink

6. The package of claim 4, wherein the submount substrate comprises bonding pads that are coupled to the leads.

7. The package of claim 6, further comprising bonding wires, wherein the bonding pads are coupled to the leads through the bonding wires.

8. The package of claim 4, further comprising:

bonding pads which penetrate the submount substrate and are coupled to the package body.

9. The package of claim 1, further comprising:

a transparent substrate arranged on the plurality of light emitting cells.

10. The package of claim 1, further comprising:

a molding member covering the plurality of light emitting cells.

11. The package of claim 10, wherein the molding member comprises a lens shape.

12. The package of claim 11, wherein the molding member comprises at least one of a fluorescent substance and a diffusing substance.

13. The package of claim 10, further comprising:

a fluorescent substance arranged between the molding member and the light emitting cells.

14. The package of claim 1, wherein the package body comprises a circuit board comprising the leads.

15. The package of claim 1, further comprising:

metal layers arranged on the light emitting cells.

16. The package of claim 15, wherein each of the metal layers comprises at least one of a transparent electrode layer and a reflective layer.

17. The package of claim 8, wherein the bonding pads are directly connected to the leads.