MEMS SENSOR, MEMS SENSOR MANUFACTURING METHOD, AND ELECTRONIC DEVICE
First Claim
1. A MEMS sensor comprising:
- a support portion;
a movable weight portion;
a connection portion connecting the support portion and the movable weight portion, is possible an elastic deformation;
a fixed electrode portion extending from the support portion; and
a movable electrode portion extending from the movable weight portion and disposed opposed to the fixed electrode portion, whereinat least one of the movable weight portion, the connection portion, the fixed electrode portion, and the movable electrode portion, includes an adjusting layer.
2 Assignments
0 Petitions
Accused Products
Abstract
A MEMS sensor formed by processing a multi-layer wiring structure, includes: a movable weight portion coupled to a fixed frame portion with an elastic deformable portion and having a hollow portion formed at the periphery; a capacitance electrode portion including a fixed electrode portion fixed to the fixed frame portion and a movable electrode portion connected to the movable weight portion and arranged to face the fixed electrode portion; and an adjusting layer for adjusting at least one of amass of the movable weight portion, a damping coefficient of the movable electrode portion, and spring characteristics in the elastic deformable portion, wherein the adjusting layer includes at least one insulating layer that is a constituent element of the multi-layer wiring structure.
-
Citations
10 Claims
-
1. A MEMS sensor comprising:
-
a support portion; a movable weight portion; a connection portion connecting the support portion and the movable weight portion, is possible an elastic deformation; a fixed electrode portion extending from the support portion; and a movable electrode portion extending from the movable weight portion and disposed opposed to the fixed electrode portion, wherein at least one of the movable weight portion, the connection portion, the fixed electrode portion, and the movable electrode portion, includes an adjusting layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A MEMS sensor manufacturing method for a MEMS sensor including a support portion;
- a movable weight portion;
a connection portion connecting the support portion and the movable weight portion, is possible an elastic deformation;
a fixed electrode portion extending from the support portion; and
a movable electrode portion extending from the movable weight portion and disposed opposed to the fixed electrode portion, comprising;forming a laminated layer structure on a substrate; forming an adjusting layer at top layer or bottom layer of the laminated layer structure; forming a first cavity portion from a top layer of the laminated layer structure to surface of the substrate, by anisotropic etching; isotropically etching the substrate via the first cavity portion to form a second cavity portion between the substrate and the laminated layer structure.
- a movable weight portion;
Specification