MOUNTING TABLE STRUCTURE AND PLASMA FILM FORMING APPARATUS

• US 20100244350A1
• Filed: 03/17/2010
• Published: 09/30/2010
• Est. Priority Date: 03/17/2009
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Nasman, Ronald, Fujisato, Toshiaki
• Granted Patent: US 8,592,712 B2
• Time in Patent Office: Days
• US Class Current: 269/289.R
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: H01J 37/34 operating with cathodic sputtering H01J37/36 takes precedence ; methods of cathodic sputtering C23C14/34
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support

Abstract

A mounting table structure for mounting thereon an object to be processed to form a metal-containing thin film on the object includes a ceramic mounting table in which a chuck electrode and a heater are embedded, and a metal flange connected to a bottom surface of a peripheral portion of the mounting table. The mounting table structure further includes a metal base which is joined to the flange by screws and has a coolant path for flowing a coolant therein, and a metal seal member interposed between the flange and the base.

Claims

1. A mounting table structure for mounting thereon an object to be processed to form a metal-containing thin film on the object, comprising:

a ceramic mounting table in which a chuck electrode and a heater are embedded;

a metal flange connected to a bottom surface of a peripheral portion of the mounting table;

a metal base which is joined to the flange by screws and has a coolant path for flowing a coolant therein; and

a metal seal member interposed between the flange and the base.

2. The mounting table structure of claim 1, wherein the flange extends downwardly from a bottom surface of the mounting table.

3. The mounting table structure of claim 2, wherein the metal base includes a disc-shaped base plate and a cooling jacket which is provided on the base plate, has therein the coolant path and is positioned at an inner side of the flange.

4. The mounting table structure of claim 3, wherein the cooling jacket is horizontally divided into an upper and a lower block body.

5. The mounting table structure of claim 4, wherein an upward force is applied to the upper block body from the lower block body by resilient members.

6. The mounting table structure of claim 5, wherein upthrust pins formed of a heat insulating material are provided at inner sides of the resilient members.

7. The mounting table structure of claim 5, wherein facing surfaces of the upper block body and the lower block body have irregularities engaged with each other.

8. The mounting table structure of claim 7, wherein a gap between the facing surfaces of the upper block body and the lower block body is formed as a gaseous thermal conduction buffer layer for alleviating heat transfer.

9. The mounting table structure of claim 1, wherein the mounting table is supported by a hollow support column made of metal.

10. The mounting table structure of claim 9, wherein the support column includes therein coolant tubes connected to the coolant path.

11. The mounting table structure of claim 9, wherein a through hole is formed at a central portion of the base to communicate with an inside of the hollow support column.

12. The mounting table structure of claim 11, wherein at least one of an electrode line connected to the chuck electrode, a power supply line connected to the heater, a thermocouple line for measuring the temperature of the mounting table and a backside gas line for supplying a gas between a top surface of the mounting table and a bottom surface of the object is inserted in the support column and the through hole to pass therethrough.

13. The mounting table structure of claim 12, wherein the electrode line is formed of a conductive metal pipe, and the metal pipe also serves as the backside gas line.

14. The mounting table structure of claim 12, wherein a hollow cap made of a heat insulating material is joined to a central portion of the bottom surface of the mounting table, and wherein an upper end portion of the electrode line is inserted through the cap and an upper end portion of the power supply line and an upper end portion of the thermocouple line are positioned on an outside of the cap.

15. A plasma film forming apparatus for forming a thin film containing metal on an object to be processed, comprising:

a vacuum evacuable processing chamber;

the mounting table structure of claim 1 for mounting thereon the object;

a gas introduction unit for introducing a predetermined gas into the processing chamber;

a plasma generating source for generating a plasma in the processing chamber;

a metal target containing the metal;

a target power supply for supplying a voltage to the metal target to attract ions of the gas;

a bias power supply for supplying a bias power to the chuck electrode of the mounting table structure; and

a chuck power supply for supplying a chuck voltage to the chuck electrode of the mounting table structure.