APPARATUS AND METHOD OF TESTING SINGULATED DIES

• US 20100244873A1
• Filed: 06/08/2010
• Published: 09/30/2010
• Est. Priority Date: 09/19/2005
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Dozier, Thomas H. II, Hsu, David S., Miller, Charles A., Eldridge, Benjamin N., Khandros, Igor Y.
• Granted Patent: US 8,513,969 B2
• Time in Patent Office: Days
• US Class Current: 324/762.30
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Abstract

An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.

Claims

1-37. -37. (canceled)

38. A die carrier apparatus comprising:

a carrier;

a plurality of die sites on the carrier, each die site comprising an area on the carrier where a singulated die can be placed;

application circuitry disposed on the carrier; and

electrical connections from the application circuitry, wherein the electrical connections are connectable to a die disposed at one of the die sites.

39. The die carrier apparatus of claim 38, wherein the application circuitry is configured to generate signals for input into a die disposed at one of the die sites.

40. The die carrier apparatus of claim 39 further comprising electrical inputs configured to receive control signals for input into the application circuitry.

41. The die carrier apparatus of claim 40, wherein the electrical inputs comprise electrically conductive elements configured to be contacted by probes of a probing device.

42-53. -53. (canceled)