Thin Flexible Sensor
First Claim
1. A sensor (100, 300, 400) comprising:
- a thin and substantially flat flexible substrate (102, 406);
one or more sensor arrays (104, 302) disposed on the flexible substrate (102, 406) that measure acceleration, force or pressure;
an output interface (108, 418) disposed on the flexible substrate (102, 406);
a processor or an analog circuit (304) disposed on the flexible substrate (102, 406) and connected to the one or more sensor arrays (104, 302) and the output interface (108, 418); and
a power source (106, 416) disposed on the flexible substrate (102, 406) and connected to the one or more sensor arrays (104, 302), the output interface (108, 418), and the processor or the analog circuit (304).
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention provides a sensor (100, 300, 400) that includes a thin and substantially flat flexible substrate (102, 406) having one or more sensor arrays (104, 302), a power source (106, 416), an output interface (108, 418) and a processor or analog circuit (304), all of which are disposed on the substantially flat flexible substrate (102, 406). The substrate (102, 406) can be any shape (e.g., rectangular, circular, a polygon, an irregular shape that is decorative) and made from a polymer, metal film or other suitable material. Note that the substrate can be rigid or semi-flexible instead of flexible. A protective layer may cover the sensor array (104, 302), the power source (106, 416), and the processor or analog circuit (304). Alternatively, a protective covering can be used to encapsulate the device. The one or more sensor arrays (104, 302) measure acceleration, force or pressure.
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Citations
35 Claims
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1. A sensor (100, 300, 400) comprising:
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a thin and substantially flat flexible substrate (102, 406); one or more sensor arrays (104, 302) disposed on the flexible substrate (102, 406) that measure acceleration, force or pressure; an output interface (108, 418) disposed on the flexible substrate (102, 406); a processor or an analog circuit (304) disposed on the flexible substrate (102, 406) and connected to the one or more sensor arrays (104, 302) and the output interface (108, 418); and a power source (106, 416) disposed on the flexible substrate (102, 406) and connected to the one or more sensor arrays (104, 302), the output interface (108, 418), and the processor or the analog circuit (304). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A sensor (100, 300, 400) comprising:
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an upper protective layer (402); a lower protective layer (404); and a thin and substantially flat flexible polymer or thin metal substrate (102, 406) disposed between the upper protective layer (402) and the lower protective layer (404); one or more sensor arrays (104, 302) disposed on the substrate that measure acceleration, force or pressure; an output interface (108, 418) disposed on the substrate (102, 406); a processor or an analog circuit (304) disposed on the substrate (102, 406) and connected to the sensor array(s) (104, 302) and the output interface (108, 418); and a power source (106, 416) disposed on the substrate (102, 406) and connected to the processor or the analog circuit (304). - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method or manufacturing a sensor comprising the steps of:
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passivating a silicon wafer; adding a polyimide layer to the wafer; creating one or more sensor arrays (104, 302) using a MEMS process wherein the sensor array(s) (104, 302) measure acceleration, force or pressure; dicing the wafer to extract the individual dies/sensors printing a circuit on a flexible substrate (102, 406); applying a paste or epoxy to the flexible substrate (102, 406) to receive and secure the individual dies/sensors; placing the individual dies/sensors on the flexible substrate (102, 406); placing the flexible substrate (102, 406) on a lower protective layer (404) containing electrical interconnects and an output interface (108, 418) a processor or an analog circuit (304), and a power source (106, 416); securing the flexible substrate (102, 406) to the lower protective layer (404); placing and securing a upper protective layer (402) to the flexible substrate (102, 406) and the lower protective layer (404) to compete assembly of the sensor. - View Dependent Claims (35)
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Specification